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91. 发明授权

US08398766B2 Semiconductor wafer composed of monocrystalline silicon and method for producing it 有权
标题翻译：由单晶硅组成的半导体晶片及其制造方法
公开(公告)号：US08398766B2
公开(公告)日：2013-03-19
申请号：US12548862
申请日：2009-08-27
申请人： Timo Mueller , Gudrun Kissinger , Walter Heuwieser , Martin Weber
发明人： Timo Mueller , Gudrun Kissinger , Walter Heuwieser , Martin Weber
IPC分类号： C30B15/02
CPC分类号： C30B29/06 , C30B15/04 , C30B15/203 , C30B15/305 , C30B30/04 , C30B33/02
摘要： Semiconductor wafers composed of monocrystalline silicon and doped with nitrogen contain an OSF region and a Pv region, wherein the OSF region extends from the center radially toward the edge of the wafer as far as the Pv region; the wafer has an OSF density of less than 10 cm−2, a BMD density in the bulk of at least 3.5×108 cm−3, and a radial distribution of the BMD density with a fluctuation range BMDmax/BMDmin of not more than 3. The wafers are produced by controlling initial nitrogen content and maintaining oxygen within a narrow window, followed by a heat treatment.
摘要翻译：由单晶硅构成并掺杂有氮的半导体晶片包含OSF区域和Pv区域，其中OSF区域从中心径向延伸至晶片边缘至Pv区域; 晶片具有小于10cm -2的OSF密度，至少3.5×10 8 cm -3的本体的BMD密度以及具有不大于3的波动范围BMDmax / BMDmin的BMD密度的径向分布通过控制初始氮含量并将氧保持在窄窗口内，然后进行热处理来生产晶片。

92. 发明申请

US20130035457A1 PROCESS FOR PREPARING A BLOCK COPOLYMER 有权
标题翻译：制备嵌段共聚物的方法
公开(公告)号：US20130035457A1
公开(公告)日：2013-02-07
申请号：US13566096
申请日：2012-08-03
申请人： Martin Weber , Thomas Weiß , Christian Maletzko , Bastiaan Bram Pieter Staal , Claudia Spang
发明人： Martin Weber , Thomas Weiß , Christian Maletzko , Bastiaan Bram Pieter Staal , Claudia Spang
IPC分类号： C08G65/48
CPC分类号： C08G65/48 , C08G65/2612 , C08G2261/126 , C08L71/02 , C08L2205/05 , C08L81/06
摘要： The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide.The present invention also relates to a block copolymer obtainable from this process.The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.
摘要翻译：本发明涉及一种制备包含聚亚芳基醚和聚环氧烷嵌段的嵌段共聚物的方法，其包括HO封端的聚亚芳基醚与单体烯化氧的反应。本发明还涉及可从该方法得到的嵌段共聚物。本发明还涉及具有聚环氧烷 - 聚芳基醚 - 聚环氧烷嵌段的三嵌段聚合物。

93. 发明申请

US20130023619A1 PROCESS FOR PRODUCING THERMOPLASTIC MOLDING COMPOSITIONS BASED ON STYRENE COPOLYMERS AND POLYAMIDE WITH IMPROVED TOUGHNESS 失效
标题翻译：基于苯乙烯共聚物和具有改善的韧性的聚酰胺制造热塑性成型组合物的方法
公开(公告)号：US20130023619A1
公开(公告)日：2013-01-24
申请号：US13547830
申请日：2012-07-12
申请人： Martin Weber , Marko Blinzler , Norbert Güntherberg
发明人： Martin Weber , Marko Blinzler , Norbert Güntherberg
IPC分类号： C08L77/00 , C08L21/00 , C08L33/20
CPC分类号： C08L77/00 , C08K5/1539 , C08K7/00 , C08L25/12 , C08L33/20 , C08L51/04
摘要： Processes for producing thermoplastic molding compositions, which comprise a) from 3 to 79% by weight of one or more (methyl)styrene-acrylonitrile copolymers, which have no maleic-anhydride-derived units, b) from 15 to 91% by weight of one or more polyamides, c) from 5 to 50% by weight of one or more rubbers, d) from 1 to 25% by weight of one or more compatibilizers, e) from 0 to 2% by weight of one or more low-molecular-weight compounds which comprise a dicarboxylic anhydride group, f) from 0 to 50% by weight of one or more fibrous or particulate fillers, and g) from 0 to 40% by weight of further additives, by producing a melt comprising components A, B, and C in a first step and subsequently incorporating D, Also, thermoplastic molding compositions obtainable by these processes, the use of these thermoplastic molding compositions, and moldings, fibers, and foils comprising these thermoplastic molding compositions.
摘要翻译：制备热塑性模塑组合物的方法，其包含a）3至79重量％的一种或多种（甲基）苯乙烯 - 丙烯腈共聚物，其不具有马来酸酐衍生的单元，b）15至91重量％一种或多种聚酰胺，c）5至50重量％的一种或多种橡胶，d）1至25重量％的一种或多种相容剂，e）0至2重量％的一种或多种低聚物，包含二羧酸酐基团的分子量化合物，f）0至50重量％的一种或多种纤维或颗粒填料，和g）0至40重量％的其它添加剂，通过制备包含组分A ，B和C，并且随后掺入D。此外，可通过这些方法获得的热塑性模塑组合物，这些热塑性模塑组合物的使用以及包含这些热塑性模塑组合物的模制品，纤维和箔。

94. 发明申请

US20120153233A1 THERMOPLASTIC MOLDING COMPOSITION 有权
标题翻译：热塑性成型组合物
公开(公告)号：US20120153233A1
公开(公告)日：2012-06-21
申请号：US13332424
申请日：2011-12-21
申请人： Cecile Gibon , Xin Yang , Christof Kujat , Martin Weber , Laszlo Szarvas , Daniel Klein , Petra Poetschke , Beate Krause
发明人： Cecile Gibon , Xin Yang , Christof Kujat , Martin Weber , Laszlo Szarvas , Daniel Klein , Petra Poetschke , Beate Krause
IPC分类号： H01B1/24 , B82Y30/00
CPC分类号： H01B1/24 , B82Y30/00
摘要： The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) at least one polyamide, copolyamide or a polyamide-comprising polymer blend as component A, b) from 0.1 to 10% by weight of carbon nanotubes, graphenes or mixtures thereof as component B, c) from 0.1 to 3% by weight of ionic liquids as component C, wherein the thermoplastic molding composition does not comprise any polyamide-12 units.
摘要翻译：热塑性模塑组合物基于热塑性模塑组合物包含a）至少一种聚酰胺，共聚酰胺或含聚酰胺的聚合物共混物作为组分A，b）0.1至10重量％的碳纳米管，石墨烯或其混合物作为组分B，c）0.1至3重量％的作为组分C的离子液体，其中热塑性模塑组合物不包含任何聚酰胺-12单元。

95. 发明申请

US20120149796A1 METHOD FOR PRODUCING LOW-HALOGEN POLYBIPHENYLSULFONE POLYMERS 有权
标题翻译：生产低卤代聚二苯乙烯聚合物的方法
公开(公告)号：US20120149796A1
公开(公告)日：2012-06-14
申请号：US13391082
申请日：2010-08-17
申请人： Martin Weber , Christian Maletzko , Gerhard Lange , Jörg Erbes , Matthias Dietrich , Nicolas Inchaurrondo , Christoph Sigwart
发明人： Martin Weber , Christian Maletzko , Gerhard Lange , Jörg Erbes , Matthias Dietrich , Nicolas Inchaurrondo , Christoph Sigwart
IPC分类号： C08G75/20 , C08L81/06
CPC分类号： C08G75/20 , C08G75/23 , C08G2261/3444 , C08J5/18 , C08J2381/06 , C08L81/06 , C08L2207/04 , D01F6/76
摘要： The present invention relates to a process for the production of low-halogen-content polybiphenyl sulfone polymers, to the resultant polybiphenyl sulfone polymers, to polybiphenyl sulfone polymers having less than 400 ppm content of polymer-bonded halogen, to thermoplastic molding compositions comprising these polybiphenyl sulfone polymers, and to their use for the production of moldings, of fibers, of films, of membranes, or of foams.
摘要翻译：本发明涉及一种制备低卤含量的聚联苯砜聚合物的方法，所制备的聚联苯砜聚合物与聚合物键合的卤素含量少于400ppm的聚苯醚砜聚合物，包括这些聚联苯砜聚合物，以及它们用于生产模制品，纤维，膜，膜或泡沫的用途。

96. 发明申请

US20120145948A1 THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS 审中-公开
标题翻译：导热聚酯模塑材料
公开(公告)号：US20120145948A1
公开(公告)日：2012-06-14
申请号：US13363839
申请日：2012-02-01
申请人： Hiroki Fukuhara , Andreas Eipper , Carsten Weiß , Mark Völkel , Reinhard Stransky , Jens Aßmann , Martin Weber
发明人： Hiroki Fukuhara , Andreas Eipper , Carsten Weiß , Mark Völkel , Reinhard Stransky , Jens Aßmann , Martin Weber
IPC分类号： C09K5/14
CPC分类号： C09K5/14 , C08K3/22 , C08K5/09 , C08L67/00 , C08L67/02 , C08L69/00 , C08L2666/18
摘要： Thermoplastic molding compositions comprising A) from 10 to 69% by weight of a thermoplastic polyester B) from 30 to 79% by weight of an aluminum oxide C) from 0.01 to 10% by weight of an organic or inorganic acid or mixture of these D) from 0 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these E) from 0 to 50% by weight of other additives, where the entirety of the percentages by weight of components A) to E) gives 100%.
摘要翻译：热塑性成型组合物，其包含A）10至69重量％的热塑性聚酯B）30至79重量％的氧化铝C）0.01至10重量％的有机或无机酸或这些D的混合物）0至10重量％的D1）至少一种高度支化或超支化的聚碳酸酯，其OH数为1至600mg KOH / g聚碳酸酯（根据DIN 53240，第2部分）或D2）至少一种高度支链或超支化的AxBy型聚酯，其中x为至少1.1，y为至少2.1，或这些E）的混合物为0至50重量％的其它添加剂，其中组分A的重量百分比）到E）给出100％。

97. 发明授权

US08197715B2 Thermoplastic moulding compositions having improved ductility 有权
标题翻译：热塑性成型组合物具有改善的延展性
公开(公告)号：US08197715B2
公开(公告)日：2012-06-12
申请号：US12519674
申请日：2007-12-11
申请人： Martin Weber , Xaver Hopfenspirger , Steffen Funkhauser , Walter Heckmann , Jörg Schnorr , Raquel Fernandez Rodiles , Rainer Klenz , Hagen Stawitzki , Bernd Bruchmann
发明人： Martin Weber , Xaver Hopfenspirger , Steffen Funkhauser , Walter Heckmann , Jörg Schnorr , Raquel Fernandez Rodiles , Rainer Klenz , Hagen Stawitzki , Bernd Bruchmann
IPC分类号： H01B1/06 , A61K9/16 , C08L31/00 , C08L27/00
CPC分类号： C08L77/06 , C08L51/06 , C08L67/00 , C08L69/00 , C08L77/00 , C08L2205/03 , C08L2666/18 , C08L2666/02 , C08L2666/24
摘要： Thermoplastic molding compositions comprising A) from 40 to 96% by weight of a semiaromatic polyamide, B) from 2 to 30% by weight of a copolymer composed of B1) from 35 to 89.9% by weight of ethylene, B2) from 10 to 60% by weight of 1-octene or 1-butene or propylene or a mixture of these, and B3) from 0.05 to 5% by weight of functional monomers, where the functional monomers have been selected from the group of the carboxylic acid groups, carboxylic anhydride groups, carboxylic ester groups, carboxamide groups, carboximide groups, amino groups, hydroxy groups, epoxy groups, urethane groups, or oxazoline groups, or a mixture of these, C) from 1 to 50% by weight of fibrous or particulate fillers, or a mixture of these, D) from 0.1 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these, E) from 0 to 15% by weight of an electrically conductive additive, F) from 0 to 30% by weight of further additives, where the total of the percentages by weight of components A) to F) is 100%.
摘要翻译：热塑性成型组合物，其包含A）40至96重量％的半芳族聚酰胺，B）2至30重量％的共聚物，由B1组成，35至89.9重量％的乙烯，B2）10至60 重量％的1-辛烯或1-丁烯或丙烯或它们的混合物和B3）0.05至5重量％的官能单体，其中官能单体选自羧酸基团，羧酸基团酸酐基，羧酸酯基，羧酰胺基，酰亚胺基，氨基，羟基，环氧基，氨基甲酸酯基或恶唑啉基，或它们的混合物，C）1至50重量％的纤维或颗粒填料，或这些的混合物，D）0.1至10重量％的D1）至少一种高度支化或超支化的聚碳酸酯，其OH数为1至600mg KOH / g聚碳酸酯（根据DIN 53240，第2部分），或D2）至少一种高度支化或超支化的AxBy型聚酯，其中x为l 东部1.1，y为至少2.1，或这些的混合物，E）0至15重量％的导电添加剂，F）0至30重量％的其它添加剂，其中通过组分A）至F）的重量为100％。

98. 发明授权

US08172941B2 Method and device for producing semiconductor wafers of silicon 失效
标题翻译：用于制造硅半导体晶片的方法和装置
公开(公告)号：US08172941B2
公开(公告)日：2012-05-08
申请号：US12002881
申请日：2007-12-19
申请人： Martin Weber , Herbert Schmidt , Wilfried von Ammon
发明人： Martin Weber , Herbert Schmidt , Wilfried von Ammon
IPC分类号： C30B15/00 , C30B21/06 , C30B27/02 , C30B28/10 , C30B30/04
CPC分类号： C30B29/06 , C30B15/203 , C30B15/30 , C30B30/04 , Y10T117/1016 , Y10T117/1032
摘要： Semiconductor wafers of silicon are produced by pulling a single crystal from a melt contained in a crucible and slicing semiconductor wafers from the pulled single crystal, heat being delivered to a center of the growing single crystal at the boundary with the melt during the pulling of the single crystal, a CUSP magnetic field applied such that a neutral surface of the CUSP magnetic field intersects a pulling axis of the single crystal at a distance of at least 50 mm from a surface of the melt. An apparatus suitable therefore contains a CUSP field positioned such that a neutral field intersects the axis of the crystal in the crucible 50 mm or more from the melt surface.
摘要翻译：硅的半导体晶片通过从包含在坩埚中的熔体中拉出单晶并从拉出的单晶切片半导体晶片来产生，在拉伸单晶期间，热量被传送到与熔体边界处的生长单晶的中心单晶，施加CUSP磁场，使得CUSP磁场的中性表面与熔体表面至少50mm的距离与单晶的牵引轴相交。因此，合适的装置包含CUSP场，其定位成使得中性场与坩埚中的晶体的轴线相距熔融表面50mm以上。

99. 发明申请

US20120029106A1 METHOD FOR PRODUCING LOW-CHLORINE POLYBIPHENYL SULFONE POLYMERS 有权
标题翻译：生产低氯聚苯乙烯磺化聚合物的方法
公开(公告)号：US20120029106A1
公开(公告)日：2012-02-02
申请号：US13262727
申请日：2010-03-30
申请人： Martin Weber , Christian Maletzko , Gerhard Lange , Jörg Erbes , Matthias Dietrich , Nicholas Inchaurrondo
发明人： Martin Weber , Christian Maletzko , Gerhard Lange , Jörg Erbes , Matthias Dietrich , Nicholas Inchaurrondo
IPC分类号： C08G75/20 , C08L81/06
CPC分类号： C08G75/23 , C08L61/02 , C08L65/02 , C08L79/08 , C08L81/06
摘要： The present invention relates to a process for the production of low-chlorine-content polybiphenyl sulfone polymers, to the polybiphenyl sulfone polymers obtainable in this way, to polybiphenyl sulfone polymers with less than 800 ppm content of organically bonded chlorine, to thermoplastic molding compositions and moldings, fibers, films, membranes, or foams comprising the polybiphenyl sulfone polymers mentioned, and also to their use for the production of moldings, of fibers, of films, of membranes, or of foams.
摘要翻译：本发明涉及一种生产低氯含量的聚联苯砜聚合物的方法，可以以这种方式获得的聚联苯砜聚合物与具有小于800ppm有机结合氯的量的聚联苯砜聚合物，包括所提及的聚联苯砜聚合物的模制品，纤维，膜，膜或泡沫，以及它们用于生产纤维，膜，膜或泡沫的模制品的用途。

100. 发明申请

US20110237693A1 Blends made of polyarylene ethers and of polyarylene sulfides 审中-公开
标题翻译：由聚亚芳基醚和聚亚芳基硫化物制成的共混物
公开(公告)号：US20110237693A1
公开(公告)日：2011-09-29
申请号：US13053872
申请日：2011-03-22
申请人： Martin Weber , Christian Maletzko , Susanne Zeiher , Mark Völkel , Norbert Güntherberg , Rüdiger Bluhm , Bernd Bruchmann
发明人： Martin Weber , Christian Maletzko , Susanne Zeiher , Mark Völkel , Norbert Güntherberg , Rüdiger Bluhm , Bernd Bruchmann
IPC分类号： C08L81/06 , C08L69/00 , C08K7/14 , C08L81/04
CPC分类号： C08J5/18 , C08G2650/32 , C08G2650/40 , C08J9/0085 , C08J2371/12 , C08J2381/06 , C08L71/00 , C08L71/12 , C08L81/02 , C08L2205/03 , C08L67/00 , C08L69/00
摘要： The present invention relates to thermoplastic molding compositions comprising the following components: (A1) at least one polyarylene ether having an average of at most 0.5 phenolic end groups per polymer chain, (A2) optionally at least one polyarylene ether having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one polyarylene sulfide, (C) at least one hyperbranched polymer selected from hyperbranched polycarbonates and hyperbranched polyesters, (D) optionally at least one functionalized polyarylene ether comprising carboxy groups, (E) optionally at least one fibrous or particulate filler, and (F) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, to the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.
摘要翻译：本发明涉及包含以下组分的热塑性模塑组合物：（A1）每个聚合物链平均具有至多0.5个酚端基的至少一个聚亚芳基醚，（A2）任选至少一种平均至少一个的聚亚芳基醚（B）至少一种聚亚芳基硫醚，（C）至少一种选自超支化聚碳酸酯和超支化聚酯的超支化聚合物，（D）任选至少一种包含羧基的官能化聚芳醚，（E）任选地至少一种纤维或颗粒填料，和（F）任选的其它添加剂和/或加工助剂。本发明还涉及本发明的热塑性模塑组合物的制造方法，其用于制造模制品，纤维，泡沫或薄膜以及所得模制品，纤维，泡沫和薄膜。

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