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91. 发明授权

US09207002B2 Contaminant separator for a vapor-compression refrigeration apparatus 有权
标题翻译：用于蒸气压缩式制冷装置的污染物分离器
公开(公告)号：US09207002B2
公开(公告)日：2015-12-08
申请号：US13271304
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Evan G. Colgan , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Evan G. Colgan , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12 , F25B21/02 , F25B43/00 , H05K7/20 , B23P15/26
CPC分类号： F25B21/02 , B23P15/26 , F25B43/00 , F25B43/003 , F25B2400/01 , H05K7/20809 , H05K7/20836 , Y10T29/49359
摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.
摘要翻译：提供了便于冷却电子部件的装置和方法。该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。蒸发器与电子部件联接并冷却。该装置还包括与制冷剂流动路径流体连通的污染物分离器。分离器包括制冷剂冷滤器和热电阵列。通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

92. 发明授权

US09167721B2 Direct facility coolant cooling of a rack-mounted heat exchanger 有权
标题翻译：直接设置机架式热交换器的冷却液冷却
公开(公告)号：US09167721B2
公开(公告)日：2015-10-20
申请号：US13305937
申请日：2011-11-29
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , F24F3/14 , F24F11/30 , F24F2110/20 , F25B2600/13 , F25D17/02 , F25D31/002 , F25D2317/04131 , H05K7/20781 , H05K7/20836
摘要： A cooling apparatus and method are provided. The cooling apparatus includes a coolant-cooled heat exchanger for facilitating dissipation of heat generated within an electronics rack, and a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.
摘要翻译：提供了一种冷却装置和方法。冷却装置包括冷却剂冷却的热交换器，用于便于散发在电子机架内产生的热量和冷却剂控制装置。冷却剂控制装置包括在设备冷却剂供应和返回之间流体连通地联接的至少一个冷却剂再循环管道，其中设备冷却剂供应和返回便于向热交换器提供设备冷却剂。控制装置还包括与再循环管道相关联的冷却剂泵和控制器，其控制供应给热交换器的设备冷却剂的温度，并且经由冷却剂再循环管道和冷却剂重新定向设备冷却剂泵从设备冷却剂返回到设备冷却剂供应，至少部分地确保供应到热交换器的设备冷却剂保持高于露点温度。

93. 发明授权

US08824143B2 Combined power and cooling rack supporting an electronics rack(S) 有权
标题翻译：组合电源和散热架支持电子机架（S）
公开(公告)号：US08824143B2
公开(公告)日：2014-09-02
申请号：US13271262
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20627 , H05K7/20772 , H05K7/20836
摘要： A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange assemblies associated with the frame. The one or more bulk power assemblies are configured to provide power to the one or more electronics racks, and the one or more heat exchange assemblies are configured to cool system coolant provided to the one or more electronics racks. Heat is transferred by the one or more heat exchange assemblies from the system coolant to a facility coolant. In operation, the power and cooling apparatus is coupled to provide both power and cooling to the one or more electronics racks.
摘要翻译：提供了组合的动力和冷却装置，其有助于对与动力和冷却装置不同的一个或多个电子机架供电和冷却。动力和冷却装置包括框架，与框架相关联的一个或多个主体动力组件以及与框架相关联的一个或多个热交换组件。所述一个或多个主体动力组件被配置成向所述一个或多个电子机架提供动力，并且所述一个或多个热交换组件被配置为冷却提供给所述一个或多个电子机架的系统冷却剂。热量由一个或多个热交换组件从系统冷却剂传送到设备冷却剂。在操作中，电源和冷却装置被耦合以向一个或多个电子机架提供电力和冷却。

94. 发明授权

US08813515B2 Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component 有权
标题翻译：热电增强蒸汽压缩制冷装置有助于电子部件的冷却
公开(公告)号：US08813515B2
公开(公告)日：2014-08-26
申请号：US12939574
申请日：2010-11-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： F25B21/02 , F25B40/00 , H05K7/20836
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.
摘要翻译：提供了用于促进电子部件的冷却的装置和方法。该装置包括制冷剂回路，耦合到制冷剂回路的压缩机以及与制冷剂回路热连通地设置的可控热电阵列。流过制冷剂回路的制冷剂有助于从电子部件散发热量，并且热电阵列设置有位于压缩机上游的制冷剂回路的第一部分与阵列的第一侧热接触，第二部分位于压缩机下游的制冷剂回路的一部分与阵列的第二侧热接触。热电阵列确保进入压缩机的制冷剂回路中的制冷剂通过将通过第二部分的制冷剂的热量传递通过制冷剂回路的第一部分的制冷剂而处于过热的热力学状态。

95. 发明授权

US08783052B2 Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling 有权
标题翻译：冷却液缓冲，蒸汽压缩制冷与储热和压缩机循环
公开(公告)号：US08783052B2
公开(公告)日：2014-07-22
申请号：US12939535
申请日：2010-11-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： F25B49/02 , F25B25/005 , F25B2400/01 , F25B2400/24 , F25B2600/0251 , F28D20/021 , F28D2020/0008 , H05K7/20809 , Y02E60/145
摘要： Apparatus and method are provided for cooling an electronic component(s). The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via a coolant loop. A thermal buffer unit is coupled in fluid communication with the coolant loop, and a refrigerant loop is coupled in fluid communication with the heat exchanger. The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop. A compressor is coupled in fluid communication with the refrigerant loop and is maintained ON responsive to heat load of the component(s) exceeding a heat load threshold, and is cycled ON and OFF responsive to heat load of the component(s) being below the threshold. The thermal storage unit dampens swings in coolant temperature within the coolant loop during cycling ON and OFF of the compressor.
摘要翻译：提供了用于冷却电子部件的装置和方法。该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通的冷却剂 - 制冷剂热交换器。热缓冲单元与冷却剂回路流体连通地联接，并且制冷剂回路与热交换器流体连通地联接。热交换器将冷却剂回路中的冷却剂的热量散发到制冷剂回路中的制冷剂。压缩机与制冷剂回路流体连通地联接，并且响应于超过热负荷阈值的部件的热负荷而保持接通，并响应于部件的热负荷而循环接通和断开阈。在循环打开和关闭压缩机期间，热存储单元会抑制冷却液回路内冷却液温度的波动。

96. 发明授权

US08743545B2 Thermal expansion-enhanced heat sink for an electronic assembly 失效
标题翻译：用于电子组件的热膨胀增强型散热器
公开(公告)号：US08743545B2
公开(公告)日：2014-06-03
申请号：US13271268
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20 , G06F1/20 , H05K5/00
CPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
摘要翻译：散热器和制造方法被提供用于从电子部件去除热量。散热器包括散热器底座和框架。基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。热界面材料设置在基底表面和电子部件之间。

97. 发明授权

US08472182B2 Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack 有权
标题翻译：用于促进从液冷电子机架散热的装置和方法
公开(公告)号：US08472182B2
公开(公告)日：2013-06-25
申请号：US12845374
申请日：2010-07-28
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20781
摘要： Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.
摘要翻译：提供了用于促进电子机架的一个或多个部件的冷却的装置和方法。该装置包括与要冷却的电子部件相关联的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通地连接以从冷却剂接收冷却剂并供应冷却剂到液冷结构。热交换器设置在包含机架的数据中心的冷空气室内的电子机架的外部，并且气室与冷空气源耦合，从而向数据中心提供冷却的空气。冷空气通风室的冷却空气穿过热交换器并冷却通过热交换器的冷却剂，冷却剂将通过其的冷却剂的热量散发到通过热交换器的冷空气，以促进电子部件相关联的液体冷却具有液冷结构。

98. 发明授权

US08248801B2 Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat 有权
标题翻译：热电增强型液体冷却装置和方便散热的方法
公开(公告)号：US08248801B2
公开(公告)日：2012-08-21
申请号：US12845355
申请日：2010-07-28
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , H05K5/00 , H05K7/00 , F28F7/00 , F28D15/00 , F25D23/12
CPC分类号： H05K7/2079 , H05K7/20836
摘要： Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.
摘要翻译：提供了热电增强型液体冷却装置和方法，以便于电子机架的一个或多个部件的冷却。该装置包括与要冷却的部件热连通的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通，用于接收和供应冷却剂冷却液流向液冷结构。热电阵列设置有与阵列的第一和第二侧热接触的第一和第二冷却剂回路部分。热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。通过第一和第二环路部分的冷却剂通过液体 - 空气热交换器进行冷却。

99. 发明授权

US08189334B2 Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack 有权
标题翻译：电子机架的除湿和再加湿冷却装置和方法
公开(公告)号：US08189334B2
公开(公告)日：2012-05-29
申请号：US12787790
申请日：2010-05-26
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20 , F25D15/00
CPC分类号： H05K7/20736 , F24F3/14 , F24F2013/221 , H05K7/20745
摘要： Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet side of the rack, wherein air flows through the rack from the air inlet side to an air outlet side. The heat exchanger, which is positioned for ingressing air to pass thereacross before passing through the electronics rack, is in fluid communication with a coolant loop for passing coolant through the heat exchanger, and the heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the heat exchanger's dehumidifying of ingressing air, and an evaporator disposed at the air outlet side humidifies air egressing from the electronics rack employing condensate from the condensate collector.
摘要翻译：为电子机架提供除湿和再加湿冷却装置和方法。该装置包括设置在机架的空气入口侧的空气 - 液体热交换器，其中空气从空气入口侧流过空气出口侧。定位用于在通过电子机架之前使空气通过的热交换器与用于使冷却剂通过热交换器的冷却剂回路流体连通，并且热交换器将进入的空气除湿到电子机架以减少空气流过架子的露点。设置在空气入口侧的冷凝水收集器收集来自热交换器对进入空气的除湿的液体冷凝物，并且设置在空气出口侧的蒸发器使用来自冷凝物收集器的冷凝物从电子机架排出空气。

100. 发明授权

US08179677B2 Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack 有权
标题翻译：用于电子机架的电子子系统的浸入式冷却装置和方法
公开(公告)号：US08179677B2
公开(公告)日：2012-05-15
申请号：US12825756
申请日：2010-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , F28D15/02
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的外壳，以及设置在密封室内的电介质流体，电子子系统浸没在电介质流体内。提供了一种液体冷却的蒸汽冷凝器，其包括在隔室的上部中在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片有助于冷却上升到隔室上部的介质流体蒸气。填充材料设置在密封隔室内以减少隔室内所需的介电流体的量以实现电子子系统的浸没冷却，并且填充材料包括成形表面，以将隔室内的介质流体蒸气导向冷凝器翅片。

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