会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 98. 发明授权
    • Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement
    • 使用轴失真测量实时控制化学机械抛光工艺
    • US06213846B1
    • 2001-04-10
    • US09351436
    • 1999-07-12
    • Leping LiXinhui Wang
    • Leping LiXinhui Wang
    • B24B4900
    • B24B37/013B24B49/16
    • A method is provided for detecting the endpoint of a film removal process such as chemical-mechanical polishing (CMP). The process uses a device having a shaft, and friction in the film removal causes torque on the shaft. Two axially displaced reflecting portions are provided on the shaft. Light reflected from these portions generates first and second reflected signals, respectively. A phase difference between the reflected signals is detected, and an output signal is generated in accordance therewith. A change in the output signal indicates a change in deformation of the shaft resulting from change in the torque, thereby indicating the endpoint of the film removal process.
    • 提供了用于检测诸如化学机械抛光(CMP)的膜去除过程的终点的方法。 该方法使用具有轴的装置,并且膜去除中的摩擦导致轴上的扭矩。 两个轴向位移的反射部分设置在轴上。 从这些部分反射的光分别产生第一和第二反射信号。 检测反射信号之间的相位差,并根据其产生输出信号。 输出信号的变化表示由转矩变化引起的轴的变形的变化,由此表示膜去除过程的终点。