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    • 92. 发明申请
    • Semiconductor memory device capable of realizing a chip with high operation reliability and high yield
    • 半导体存储器件能够实现具有高操作可靠性和高产量的芯片
    • US20050063209A1
    • 2005-03-24
    • US10957722
    • 2004-10-05
    • Hiroshi NakamuraKen TakeuchiHideko OodairaKenichi ImamiyaKazuhito NaritaKazuhiro ShimizuSeiichi Aritome
    • Hiroshi NakamuraKen TakeuchiHideko OodairaKenichi ImamiyaKazuhito NaritaKazuhiro ShimizuSeiichi Aritome
    • G11C16/04H01L21/8247H01L27/10H01L27/105H01L27/115H01L29/788H01L29/792G11C8/00G11C5/06
    • G11C5/063G11C16/0483G11C16/08G11C2029/0403H01L27/105H01L27/115H01L27/11521H01L27/11524
    • A semiconductor memory device capable of preventing occurrence of a defect caused by a lowering in the etching precision in an end area of the memory cell array and realizing an inexpensive chip having high operation reliability and high manufacturing yield is provided. A first block is constructed by first memory cell units each having a plurality of memory cells connected, a second block is constructed by second memory cell units each having a plurality of memory cells connected, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder. By use of the semiconductor memory device, occurrence of a defect caused by a lowering in the etching precision in an end area of the memory cell array can be prevented, and the manufacturing yield can be made high and the operation reliability can be made high without substantially increasing the chip size.
    • 提供一种半导体存储器件,其能够防止由于存储单元阵列的端部区域中的蚀刻精度降低而导致的缺陷的发生,并且实现了具有高操作可靠性和高制造成品率的便宜的芯片。 第一块由具有连接的多个存储单元的第一存储单元单元构成,第二块由具有连接的多个存储单元的第二存储单元单元构成,并且存储单元阵列通过将第一块 在其两端部分,并且将第二块布置在其另一部分上。 存储单元阵列的端侧上的第一存储单元单元的结构与第二存​​储单元单元的结构不同。 用于将存储单元阵列的选择栅极线连接到行解码器中的相应晶体管的布线由布线层形成,布线层形成在用于将存储单元阵列的控制栅极线连接到行解码器中的晶体管的布线之上。 通过使用半导体存储器件,可以防止由存储单元阵列的端部区域中的蚀刻精度降低引起的缺陷的发生,并且可以使制造成品率高,并且可以使操作可靠性高而无需高 大大增加芯片尺寸。
    • 96. 发明授权
    • EEPROM with increased reading speed
    • EEPROM读取速度更快
    • US08513726B2
    • 2013-08-20
    • US13370064
    • 2012-02-09
    • Hiroshi NakamuraKenichi Imamiya
    • Hiroshi NakamuraKenichi Imamiya
    • H01L29/76
    • H01L27/11526G11C11/5621G11C16/0483G11C16/26H01L27/115H01L27/11529H01L2924/0002H01L2924/00
    • In an EEPROM consisting of a NAND cell in which a plurality of memory cells are connected in series, the control gate voltage Vread of the memory cell in a block selected by the data read operation is made different from the each of the voltages Vsg1, Vsg2 of the select gate of the select transistor in the selected block so as to make it possible to achieve a high speed reading without bringing about the breakdown of the insulating film interposed between the select gate and the channel of the select transistor. The high speed reading can also be made possible in the DINOR cell, the AND cell, NOR cell and the NAND cell having a single memory cell connected thereto, if the control gate voltage of the memory cell is made different from the voltage of the select gate of the select transistor.
    • 在由多个存储单元串联连接的NAND单元组成的EEPROM中,通过数据读取操作选择的块中的存储单元的控制栅极电压Vread与电压Vsg1,Vsg2 在所选择的块中选择晶体管的选择栅极,从而使得可以实现高速读取,而不会导致插入在选择栅极和选择晶体管的沟道之间的绝缘膜的击穿。 如果使存储器单元的控制栅极电压与选择的电压不同,则也可以在DINOR单元,AND单元,NOR单元和与其连接的单个存储单元的NAND单元中实现高速读数。 选择晶体管的栅极。