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    • 91. 发明申请
    • SOLID-STATE IMAGE CAPTURING ELEMENT, IMAGE CAPTURING DEVICE AND SIGNAL PROCESSING METHOD
    • 固态图像捕获元件,图像捕获器件和信号处理方法
    • US20120182453A1
    • 2012-07-19
    • US13498598
    • 2011-04-22
    • Masao HiramotoYusuke MonobeYoshiaki SugitaniMasaaki Suzuki
    • Masao HiramotoYusuke MonobeYoshiaki SugitaniMasaaki Suzuki
    • H04N9/07H04N9/04H04N3/14H01L27/146
    • H01L27/14625H01L27/14621H01L27/14645H04N9/045H04N2209/047
    • The solid-state image sensor 10 includes an array of photosensitive cells and an array 100 of dispersing elements. The photosensitive cell array is comprised of unit blocks 40, each including four photosensitive cells 2a, 2b, 2c and 2d. The dispersing element array 100 makes light, obtained by subtracting a light ray with a first color component C1 from the incoming light W and adding a light ray with a second color component C2 to the remainder, incident on the first photosensitive cell 2a, also makes light, obtained by subtracting the light ray with the second color component C1 from the incoming light W and adding the light ray with the first color component C1 to the remainder, incident on the second photosensitive cell 2b, further makes light, obtained by subtracting the light rays with the first and second color components C1+C2 from the incoming light W, incident on the third photosensitive cell 2c, and further makes light, obtained by adding the light rays with the first and second color components C1+C2 to the incoming light W, incident on the fourth photosensitive cell 2d.
    • 固态图像传感器10包括感光单元阵列和分散元件阵列100。 感光单元阵列由单元块40组成,每个单元块40包括四个感光单元2a,2b,2c和2d。 分散元件阵列100通过从入射光W减去具有第一颜色成分C1的光线并将入射到第一感光单元2a上的剩余部分中的第二颜色分量C2的光线加入而获得的光也使得 通过从入射光W减去具有第二颜色分量C1的光线并将入射到第二感光单元2b上的第一颜色分量C1的光线添加到余数而获得的光进一步使得通过减去 来自入射光W的第一和第二颜色分量C1 + C2的光线入射到第三感光单元2c上,并且进一步使通过将第一和第二颜色分量C1 + C2的光线与入射 入射到第四感光单元2d上的光W。
    • 93. 发明申请
    • SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP APPARATUS
    • 固态图像拾取装置和图像拾取装置
    • US20110234869A1
    • 2011-09-29
    • US13132690
    • 2010-09-24
    • Masao HiramotoMasayuki MisakiTeruyuki TakizawaMasaaki Suzuki
    • Masao HiramotoMasayuki MisakiTeruyuki TakizawaMasaaki Suzuki
    • H04N5/335
    • H04N5/374H01L27/14621H01L27/14627H01L27/1464H04N5/2253H04N5/2254H04N5/2258
    • A solid-state image sensor according to the present invention includes: a semiconductor layer (100 with first and second surfaces (100a, 100b), the second surface (100b) being opposite to the first surface (100a); a plurality of photosensitive cells (1a, 1b, etc.), which are arranged two-dimensionally in the semiconductor layer (100) between the first and second surfaces thereof (100a, 100b); a first array (200) of micro condenser lenses, which are arranged on the same side as the first surface (100a) to focus incoming light onto a first group of photosensitive cells that are included in those photosensitive cells; and a second array (300) of micro condenser lenses, which are arranged on the same side as the second surface (100b) to focus incoming light onto a second group of photosensitive cells that are also included in those photosensitive cells but that are different from the first group of photosensitive cells.
    • 根据本发明的固态图像传感器包括:半导体层(100具有第一和第二表面(100a,100b),第二表面(100b)与第一表面(100a)相对;多个感光单元 (100a,100b)在半导体层(100)中二维布置的第一阵列(1a,1b等);微聚焦透镜的第一阵列(200),布置在 与第一表面(100a)相同的一侧,以将入射光聚焦到包含在那些感光单元中的第一组感光单元上;以及微聚焦透镜的第二阵列(300),其布置在与 第二表面(100b)将入射光聚焦到第二组感光细胞上,所述第二组感光细胞也包括在那些感光细胞中但不同于第一组感光细胞。
    • 97. 发明申请
    • SOLID-STATE IMAGING DEVICE
    • 固态成像装置
    • US20100188537A1
    • 2010-07-29
    • US12671083
    • 2009-06-10
    • Masao HiramotoKazuya YonemotoSeiji NishiwakiMasaaki SuzukiYoshiaki SugitaniShinichi Wakabayashi
    • Masao HiramotoKazuya YonemotoSeiji NishiwakiMasaaki SuzukiYoshiaki SugitaniShinichi Wakabayashi
    • H04N5/335
    • H04N5/2254H01L27/14621H01L27/14627H01L27/14629H04N5/33H04N9/045
    • Light-splitting elements are arranged in at least two columns and two rows to form two pairs 1a, 1b and 1c, 1d. Each element splits incident light into light rays and makes them fall on a portion of a photosensing section right under itself and an adjacent photosensitive cell. The element 1a splits the incident light so that a primary color ray C1 and its complementary color ray C1′ enter an adjacent cell 2b and an underlying cell 2a, respectively. The element 1b makes a primary color ray C2 and its complementary color ray C2′ enter an underlying cell 2a and an adjacent cell 2a, respectively. The element 1c does the same as the element 1b. And the element 1d makes a primary color ray C3 and its complementary color ray C3′ enter an adjacent cell 2c and an underlying cell 2d, respectively. These photosensitive cells 2 perform photoelectric conversion, thereby outputting an electrical signal representing the intensity of the incident light. By carrying out simple calculations between the outputs of these cells, a color signal and a luminance signal are generated.
    • 光分离元件以至少两列和两列排列以形成两对1a,1b和1c,1d。 每个元件将入射光分成光线并使它们落在其本身正下方的光敏部分的一部分和相邻的感光单元上。 元件1a分割入射光,使得原色光线C1及其互补色光线C1'分别进入相邻的单元2b和下面的单元2a。 元件1b使原色光线C2和它的互补色射线C2'分别进入下面的单元2a和相邻单元2a。 元件1c与元件1b相同。 并且元件1d使原色光线C3和其互补色光线C3'分别进入相邻单元格2c和下面的单元格2d。 这些感光单元2进行光电转换,从而输出表示入射光强度的电信号。 通过在这些单元的输出之间进行简单的计算,生成彩色信号和亮度信号。
    • 99. 发明授权
    • Method of manufacturing thick dielectric pattern and method of manufacturing image displaying apparatus
    • 制造厚电介质图案的方法和制造图像显示装置的方法
    • US07485410B2
    • 2009-02-03
    • US11166105
    • 2005-06-27
    • Masaaki SuzukiOsamu Watanabe
    • Masaaki SuzukiOsamu Watanabe
    • G03F7/26
    • H01J9/241H05K3/0023H05K3/4664H05K2201/0195H05K2203/0514
    • A method of manufacturing a thick dielectric pattern disposed on a substrate. A first precursor layer is formed by imparting a first photosensitive dielectric paste, including a dielectric material, onto a substrate and drying it. A second precursor layer is formed by imparting a second photosensitive dielectric paste, including a dielectric material higher in softening point than the dielectric material included in the first photosensitive dielectric paste, on the first precursor layer and drying it. Precursor patterns are formed by collectively exposing and developing the layered products of the first precursor layer and the second precursor layer through the mask of a predetermined pattern, and a thick dielectric pattern is formed by collectively baking the precursor patterns.
    • 一种制造设置在基板上的厚电介质图案的方法。 通过将包含电介质材料的第一光敏电介质膏施加到基板上并将其干燥来形成第一前体层。 第二前体层通过在第一前体层上施加第二感光电介质浆料,该第二光敏电介质浆料包含比包含在第一光敏电介质浆料中的介电材料高的软化点的介电材料,并将其干燥。 通过通过预定图案的掩模将第一前体层和第二前体层的层叠体共同地曝光和显影来形成前体图案,并且通过共同烘烤前体图案形成厚的电介质图案。