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    • 91. 发明授权
    • Solar cell system manufacturing method
    • 太阳能电池系统制造方法
    • US08623693B2
    • 2014-01-07
    • US13569274
    • 2012-08-08
    • Yuan-Hao JinQun-Qing LiShou-Shan Fan
    • Yuan-Hao JinQun-Qing LiShou-Shan Fan
    • H01L21/00H01L31/00H01L31/18
    • H01L31/18H01L31/035218H01L31/042H01L31/043H01L31/047H01L31/056Y02E10/52
    • A solar cell system making method includes steps of making a round P-N junction by (a) stacking a P-type silicon layer and a N-type silicon layer on top of each other, and (b) forming a P-N junction near an interface between the P-type silicon layer and the N-type silicon layer; cutting the round P-N junction into a plurality of arc shaped solar cell preforms; forming an arc shaped surface by stacking the plurality of arc shaped solar cell preforms along a first direction and forming an electrode layer between each adjacent two of the plurality of arc shaped solar cell preforms; and forming a first collection electrode and a second collection electrode to form an arc shaped solar cell system having a photoreceptive surface being on the arc shaped surface and being configured to receive incident light beams.
    • 太阳能电池系统制造方法包括以下步骤:通过(a)在彼此的顶部堆叠P型硅层和N型硅层来制造圆形PN结,以及(b)在接合点之间形成PN结, P型硅层和N型硅层; 将圆形P-N结切割成多个弧形太阳能电池预制件; 通过沿着第一方向堆叠所述多个弧形太阳能电池预制件并在所述多个弧形太阳能电池预制件中的每个相邻的两个之间形成电极层来形成弧形表面; 以及形成第一收集电极和第二收集电极,以形成具有在所述弧形表面上的感光表面并被配置为接收入射光束的弧形太阳能电池系统。
    • 95. 发明授权
    • Light emitting diode
    • 发光二极管
    • US08796716B2
    • 2014-08-05
    • US13479233
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L33/00
    • H01L33/24H01L33/005
    • A light emitting diode including a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order, and a surface of the second semiconductor layer away from the active layer is configured as the light emitting surface. A first electrode covers the entire surface of the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.
    • 提供了包括第一半导体层,有源层和第二半导体层的发光二极管。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上,并且第二半导体层远离有源层的表面被配置为发光表面。 第一电极覆盖第一半导体层的整个表面。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层的第一表面的表面上并排排列,并且每个三维纳米结构的横截面为M形。
    • 96. 发明授权
    • Light emitting diode
    • 发光二极管
    • US08759858B2
    • 2014-06-24
    • US13479230
    • 2012-05-23
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • Zhen-Dong ZhuQun-Qing LiLi-Hui ZhangMo ChenShou-Shan Fan
    • H01L33/00
    • H01L33/24H01L33/06H01L33/22
    • A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The substrate includes an epitaxial growth surface and a light emitting surface. The first semiconductor layer, the active layer and the second semiconductor layer is stacked on the epitaxial growth surface. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.
    • 提供了包括基板,第一半导体层,有源层和第二半导体层的发光二极管。 衬底包括外延生长表面和发光表面。 第一半导体层,有源层和第二半导体层堆叠在外延生长表面上。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层的第一表面的表面上并排排列,并且每个三维纳米结构的横截面为M形。