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91. 发明授权

US07863079B2 Methods of reducing CD loss in a microelectromechanical device 有权
标题翻译：减少微机电设备中CD损耗的方法
公开(公告)号：US07863079B2
公开(公告)日：2011-01-04
申请号：US12026131
申请日：2008-02-05
申请人： Manish Kothari , Clarence Chui , Sauri Gudlavalleti
发明人： Manish Kothari , Clarence Chui , Sauri Gudlavalleti
IPC分类号： H01L21/00
CPC分类号： G02B26/001
摘要： Methods of fabricating an electromechanical systems device that minimize critical dimension (CD) loss in the device are described. The methods provide electromechanical systems devices with improved properties, including high reflectivity.
摘要翻译：描述了使装置中的临界尺寸（CD）损耗最小化的机电系统装置的制造方法。这些方法提供具有改进性能的机电系统装置，包括高反射率。

92. 发明授权

US07816710B2 Packaging for an interferometric modulator with a curved back plate 有权
标题翻译：具有弯曲背板的干涉式调制器的封装
公开(公告)号：US07816710B2
公开(公告)日：2010-10-19
申请号：US12019590
申请日：2008-01-24
申请人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
发明人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC分类号： H01L29/80
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译：封装由具有干涉式调制器和背板的透明基板制成。非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。背板包括相对于基板的弯曲部分。弯曲部分基本上遍及后板。背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

93. 发明授权

US07679812B2 Support structure for MEMS device and methods therefor 失效
标题翻译： MEMS器件的支撑结构及其方法
公开(公告)号：US07679812B2
公开(公告)日：2010-03-16
申请号：US11491389
申请日：2006-07-21
申请人： Teruo Sasagawa , Clarence Chui , Manish Kothari , SuryaPrakash Ganti , Jeffrey B. Sampsell , Chun-Ming Wang
发明人： Teruo Sasagawa , Clarence Chui , Manish Kothari , SuryaPrakash Ganti , Jeffrey B. Sampsell , Chun-Ming Wang
IPC分类号： G02B26/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B2201/042 , B81B2203/0307 , B81C1/00595 , B81C2201/014 , G02B26/001
摘要： A microelectromechanical systems device having support structures formed of sacrificial material surrounded by a protective material. The microelectromechanical systems device includes a substrate having an electrode formed thereon. Another electrode is separated from the first electrode by a cavity and forms a movable layer, which is supported by support structures formed of a sacrificial material.
摘要翻译：具有由保护材料包围的牺牲材料形成的支撑结构的微机电系统装置。微机电系统装置包括其上形成有电极的基板。另一电极通过空腔与第一电极分离，并形成可移动层，该可移动层由牺牲材料形成的支撑结构支撑。

94. 发明授权

US07636151B2 System and method for providing residual stress test structures 失效
标题翻译：提供残余应力测试结构的系统和方法
公开(公告)号：US07636151B2
公开(公告)日：2009-12-22
申请号：US11453633
申请日：2006-06-15
申请人： Manish Kothari , Lior Kogut , Clarence Chui
发明人： Manish Kothari , Lior Kogut , Clarence Chui
IPC分类号： G01L1/24 , G01B11/02 , G01B9/02
CPC分类号： G01L5/0047 , G02B26/001
摘要： The invention comprises systems and methods determining residual stress such as that found in interferometric modulators. In one example, a test unit can be configured to indicate residual stress in a film by interferometrically modulating light indicative of an average residual stress in two orthogonal directions of the substrate. The test unit can include a reflective membrane attached to the substrate where membrane is configured as a parallelogram with at least a portion of each side attached to the substrate, and an interferometric cavity formed between a portion of the membrane and a portion of the substrate, and where the membrane is configured to deform based on the residual stress of in the film and modulate light indicative of the amount of membrane deformation.
摘要翻译：本发明包括确定残余应力的系统和方法，例如在干涉式调制器中发现的。在一个示例中，测试单元可以被配置为通过对指示基板的两个正交方向上的平均残余应力的光进行干涉测量来指示膜中的残余应力。测试单元可以包括附接到基底的反射膜，其中膜被构造为平行四边形，其中每侧的至少一部分附着到基底，以及形成在膜的一部分和基底的一部分之间的干涉腔，并且其中膜被配置为基于膜的残余应力而变形并且调制指示膜变形量的光。

95. 发明申请

US20090195856A1 METHODS OF REDUCING CD LOSS IN A MICROELECTROMECHANICAL DEVICE 有权
标题翻译：减少微电子设备中CD损耗的方法
公开(公告)号：US20090195856A1
公开(公告)日：2009-08-06
申请号：US12026131
申请日：2008-02-05
申请人： Manish Kothari , Clarence Chui , Sauri Gudlavalleti
发明人： Manish Kothari , Clarence Chui , Sauri Gudlavalleti
IPC分类号： G02B26/00 , H01B13/00
CPC分类号： G02B26/001
摘要： Methods of fabricating an electromechanical systems device that minimize critical dimension (CD) loss in the device are described. The methods provide electromechanical systems devices with improved properties, including high reflectivity.
摘要翻译：描述了使装置中的临界尺寸（CD）损耗最小化的机电系统装置的制造方法。这些方法提供具有改进性能的机电系统装置，包括高反射率。

96. 发明申请

US20090189230A1 METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER 有权
标题翻译：用于包装具有并发卡特的MEMS器件的方法和系统
公开(公告)号：US20090189230A1
公开(公告)日：2009-07-30
申请号：US12415986
申请日：2009-03-31
申请人： Lauren Palmateer , William J. Cummings , Brian Gally , Clarence Chui , Manish Kothari
发明人： Lauren Palmateer , William J. Cummings , Brian Gally , Clarence Chui , Manish Kothari
IPC分类号： H01L23/31 , H01L29/84 , H01L21/56
CPC分类号： B81B7/0038 , B81C2203/019 , G02B26/001
摘要： Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
摘要翻译：公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

97. 发明申请

US20090015579A1 MECHANICAL RELAXATION TRACKING AND RESPONDING IN A MEMS DRIVER 审中-公开
标题翻译： MEMS驱动器中的机械放松跟踪和响应
公开(公告)号：US20090015579A1
公开(公告)日：2009-01-15
申请号：US11777123
申请日：2007-07-12
申请人： Ramez Nachman , Clarence Chui , Manish Kothari
发明人： Ramez Nachman , Clarence Chui , Manish Kothari
IPC分类号： G06F3/038
CPC分类号： G09G3/3466 , G02B26/001 , G09G3/2092 , G09G2320/041 , G09G2320/048
摘要： The invention comprises systems and methods for adjusting a driving voltage based on relaxation information of a movable reflective layer of an interferometric modulator. In one example, a device for driving a MEMS device having a movable reflective layer comprises a sensing unit configured to generate information related to one or more of time, environmental exposure, and frame rate of a movable reflective layer of at least one MEMS device, and a driver circuit configured to apply voltages to drive said at least one MEMS device, said voltages being based at least in part on said information.
摘要翻译：本发明包括基于干涉式调制器的可移动反射层的松弛信息来调节驱动电压的系统和方法。在一个示例中，用于驱动具有可移动反射层的MEMS器件的装置包括感测单元，其被配置为产生与至少一个MEMS器件的可移动反射层的时间，环境曝光和帧速率中的一个或多个相关的信息，以及被配置为施加电压以驱动所述至少一个MEMS器件的驱动器电路，所述电压至少部分地基于所述信息。

98. 发明授权

US07443563B2 Packaging for an interferometric modulator 有权
标题翻译：用于干涉式调制器的包装
公开(公告)号：US07443563B2
公开(公告)日：2008-10-28
申请号：US11653088
申请日：2007-01-12
申请人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
发明人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC分类号： G02F1/03
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译：封装由具有干涉式调制器和背板的透明基板制成。非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。设置背板，并将干燥剂施加到背板上。背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

99. 再颁专利

USRE40436E1 Hermetic seal and method to create the same 有权
标题翻译：密封和方法创造一样
公开(公告)号：USRE40436E1
公开(公告)日：2008-07-15
申请号：US11176878
申请日：2005-07-07
申请人： Manish Kothari , Clarence Chui
发明人： Manish Kothari , Clarence Chui
IPC分类号： B32B3/10
CPC分类号： B81B7/0041 , B81C2203/019 , Y10T428/162 , Y10T428/166 , Y10T428/239 , Y10T428/24777 , Y10T428/2852
摘要： An electronic display screen is created by processing a mirror on a substrate glass. A back plate glass is then placed on top of the substrate glass and sealed to the back plate glass. A hermetic seal that includes an adhesive mixed with zeolites is disclosed. The hermetic seal can seal the back plate glass with the substrate glass. The application of the hermetic seal is not limited to the electronic display screen. Rather, the hermetic seal can be used to seal a variety of surfaces including metals, polymers, plastics, alloys, ceramics and the like.
摘要翻译：通过在基板玻璃上处理反射镜来创建电子显示屏。然后将背板玻璃放置在基板玻璃的顶部上并密封到背板玻璃上。公开了一种包含与沸石混合的粘合剂的气密密封。气密密封可用基板玻璃密封背板玻璃。气密密封的应用不限于电子显示屏。相反，气密密封可用于密封包括金属，聚合物，塑料，合金，陶瓷等的各种表面。

100. 发明申请

US20070047900A1 MEMS devices having support structures and methods of fabricating the same 有权
标题翻译：具有支撑结构的MEMS器件及其制造方法
公开(公告)号：US20070047900A1
公开(公告)日：2007-03-01
申请号：US11491490
申请日：2006-07-21
申请人： Jeffrey Sampsell , Clarence Chui , Manish Kothari , Mark Miles , Teruo Sasagawa , Wonsuk Chung , Ming-Hau Tung
发明人： Jeffrey Sampsell , Clarence Chui , Manish Kothari , Mark Miles , Teruo Sasagawa , Wonsuk Chung , Ming-Hau Tung
IPC分类号： G02B6/00
CPC分类号： G02B26/001 , B81B3/007 , B81B2201/047 , B81B2203/0307 , B81B2203/053
摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.
摘要翻译： MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。在某些实施例中，可以使用铆钉和柱。在某些实施方案中，这些支撑结构由诸如金属或氧化物的刚性无机材料形成。在某些实施例中，还可以沉积蚀刻阻挡层以促进材料在形成相对于MEMS器件内的其它部件不能选择性蚀刻的支撑结构的形成中的使用。

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