专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明申请

US20110046319A1 ORGANOPOLYSILMETHYLENE AND A CURED PRODUCT THEREOF 有权
标题翻译：有机聚甲基苯乙烯及其固化产物
公开(公告)号：US20110046319A1
公开(公告)日：2011-02-24
申请号：US12860682
申请日：2010-08-20
申请人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08L83/06 , C08G77/16
CPC分类号： C08G77/50 , C08G77/16 , C08G77/18 , C08G77/24 , C08L83/14 , Y10T428/31663 , C08L83/00
摘要： The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group and a halogen atom; R2 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom and (R1)3SiCH2—, wherein R3 is, independently of each other, a group selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; and having, in a molecule, at least two out of alkoxy groups, hydroxy groups and halogen atoms bonded to one or more silicon atoms.
摘要翻译：本发明提供由以下通式（1）表示的有机聚亚甲硅烷基：其中R 1彼此独立地为选自除烯基以外的未取代或取代的碳原子数1〜10的一价烃基基团，烷氧基，羟基和卤素原子; R2彼此独立地选自除烯基，烷氧基，羟基，卤素原子以外的未取代或取代的碳原子数1〜10的一价烃基和（R1） 3SiCH 2 - ，其中R 3彼此独立地为选自氢原子和具有1至4个碳原子的烷基的基团; k为1〜100的整数， n为1〜1000的整数。并且在一个分子中具有与一个或多个硅原子键合的烷氧基，羟基和卤素原子中的至少两个。

92. 发明授权

US07858198B2 Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet 有权
标题翻译：含有荧光体的粘合性硅酮组合物，由该组合物形成的组合物片材，以及使用该片材的发光装置的制造方法
公开(公告)号：US07858198B2
公开(公告)日：2010-12-28
申请号：US12078909
申请日：2008-04-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B9/04 , C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.
摘要翻译：提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。荧光体的分散状态随时间保持稳定。在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材仪器。

93. 发明授权

US07683152B2 Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer 有权
标题翻译：部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，制造方法和包含该共聚物的树脂组合物
公开(公告)号：US07683152B2
公开(公告)日：2010-03-23
申请号：US11131197
申请日：2005-05-18
申请人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C08G77/24
CPC分类号： C08G77/455 , C08G73/106 , C08L63/00 , C08L79/08 , C08L83/10 , C08L2666/20 , C08L2666/22 , C08L2666/14
摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.
摘要翻译：提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y1是二胺残基，Y2是二氨基硅氧烷残基，Y1 和Y2分别以99-20摩尔％和1-80摩尔％的量包含在共聚物中，L和m各自为2-50的整数。共聚物对基材的粘合性好，防潮可靠性和低弹性模量。

94. 发明申请

US20100001311A1 HEAT-CURABLE SILICONE RESIN-EPOXY RESIN COMPOSITION, AND PREMOLDED PACKAGE MOLDED FROM SAME 有权
标题翻译：可固化硅氧烷树脂环氧树脂组合物和从其模塑的预制包装
公开(公告)号：US20100001311A1
公开(公告)日：2010-01-07
申请号：US12496460
申请日：2009-07-01
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
IPC分类号： H01L33/00 , C08L63/00
CPC分类号： H01L23/49861 , C08G77/16 , C08G77/18 , C08L63/00 , C08L63/06 , C08L83/04 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/14 , C08L2666/22 , H01L2924/00
摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.
摘要翻译：作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D）固化促进剂。该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。

95. 发明授权

US07432603B2 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US07432603B2
公开(公告)日：2008-10-07
申请号：US11138378
申请日：2005-05-27
申请人： Eiichi Asano , Toshio Shiobara
发明人： Eiichi Asano , Toshio Shiobara
IPC分类号： H01L23/29 , C08L63/00 , B32B27/04 , B32B27/20 , B32B27/38 , H01L21/56
CPC分类号： C08G59/08 , C08G59/621 , C08G59/688 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529
摘要： In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having a second ionization potential of up to 20 eV, typically Zn2SiO4, ZnCrO4, ZnFeO4 or ZnMoO4. When used for semiconductor encapsulation, the epoxy resin composition is highly reliable and cures into a product which is effective for minimizing electrical failure such as defective insulation due to a copper migration phenomenon.
摘要翻译：在包含（A）环氧树脂，（B）固化剂，（C）无机化合物和（D）无机填料）的环氧树脂组合物中，无机化合物（C）是至少一种金属元素的氧化物其中元素周期表中的II族金属元素具有高达20eV的第二电离电位，通常为Zn 2 SiO 4，ZnCrO 4， / SO 2，ZnFeO 4或ZnMoO 4。当用于半导体封装时，环氧树脂组合物是高度可靠的并且固化成对于最小化电气故障有效的产品，例如由于铜迁移现象导致的不良绝缘。

96. 发明授权

US07345105B2 Conductive adhesive composition 有权
标题翻译：导电胶组成
公开(公告)号：US07345105B2
公开(公告)日：2008-03-18
申请号：US10737748
申请日：2003-12-18
申请人： Masachika Yoshino , Motoo Fukushima , Toshio Shiobara
发明人： Masachika Yoshino , Motoo Fukushima , Toshio Shiobara
IPC分类号： C08J3/00 , C08K3/08 , C08L67/00 , C08L79/00 , C08L83/00
CPC分类号： H05K3/321 , H05K2201/0245
摘要： A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.
摘要翻译：通过将粘合剂树脂与基于作为导电剂的银粉的粘合剂组合物以30-98重量％混合来获得导电粘合剂组合物。银粉含有由平坦的一次粒子构成的银粉，其具有大量的聚集体结构，并且基于粘合剂的30-198重量％的振实密度为0.1-1.5克/厘米3 组成。导电性粘合剂组合物固化成具有改善的导电性，粘附性，耐热性，耐湿性，加工和热传递容易性的产品。

97. 发明授权

US07283715B2 Optical waveguide forming material and method 有权
标题翻译：光波导形成材料及方法
公开(公告)号：US07283715B2
公开(公告)日：2007-10-16
申请号：US10911686
申请日：2004-08-05
申请人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： G02B6/10 , G02B6/00
CPC分类号： G02B6/138 , C03C17/30 , G02B1/046 , C08L83/06
摘要： An optical waveguide comprising a substrate, a lower clad layer on the substrate, a core layer and an upper clad layer, at least one of the lower clad layer, the core layer and the upper clad layer is formed of a cured product of a photo-curable organopolysiloxane composition comprising(A) a (meth)acryloyloxy group-containing organopolysiloxane of the following average compositional formula (1): (CH2═CR1COO(CH2)n)a(Ph)bR2c(R3O)dSiO(4-a-b-c-d)/2 (1) wherein R1 is hydrogen or methyl, R2 is an C1–C8 alkyl or C2–C8 alkenyl group, Ph is phenyl, R3 is hydrogen or an unsubstituted or alkoxy-substituted C1–C4 alkyl group, subscripts a, b, c and d are numbers satisfying: 0.05≦a≦0.9, 0.1≦b≦0.9, 0≦c≦0.2, 0
摘要翻译：一种光波导，包括基板，基底上的下覆盖层，芯层和上覆盖层，下包层，芯层和上覆层中的至少一个由照相的固化产物形成可固化的有机基聚硅氧烷组合物，其包含（A）具有以下平均组成式（1）的（甲基）丙烯酰氧基的有机聚硅氧烷：<？在线式描述=“在线式”末端=“铅” CH 2 CO 2（CH 2）n（CH 2）n（CH 2）n（CH 2））（4-abcd）/ 2（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中R 1是氢或甲基 R 2是C 1 -C 8烷基或C 2 -C 8烷基或C 2 -C 8烷基， SUB>烯基，Ph是苯基，R 3是氢或未取代或烷氧基取代的C 1 -C 4烷基，下标 a，b，c和d是麻木的满足：0.05 <= a <= 0.9,0.1 <= b <= 0.9,0 <= c <= 0.2,0

98. 发明授权

US07276562B2 Epoxy-silicone mixed resin composition and light-emitting semiconductor device 有权
标题翻译：环氧硅酮混合树脂组合物和发光半导体装置
公开(公告)号：US07276562B2
公开(公告)日：2007-10-02
申请号：US11116295
申请日：2005-04-28
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/07
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/70 , C08L63/00 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , Y10T428/31511 , Y10T428/31663 , C08L2666/14 , C08L83/00 , C08L2666/02 , H01L2924/00014 , H01L2924/00
摘要： An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index within 10% of that of a cured product of the curable resin composition. It is suitable for use as an encapsulator for light-emitting semiconductors.
摘要翻译：一种环氧硅酮混合树脂组合物，得到透明固化物，其包含[I] 100重量份的含有有机硅化合物和环氧树脂作为必要成分的固化性树脂组合物，[II]将0.1〜50重量份折射率在固化树脂组合物的固化物的折射率的10％以内的有机硅弹性体。适用于发光半导体的封装。

99. 发明授权

US07147920B2 Wafer dicing/die bonding sheet 有权
标题翻译：晶片切片/芯片粘合片
公开(公告)号：US07147920B2
公开(公告)日：2006-12-12
申请号：US10713163
申请日：2003-11-17
申请人： Toshio Shiobara , Nobuhiro Ichiroku , Hideki Akiba , Masachika Yoshino
发明人： Toshio Shiobara , Nobuhiro Ichiroku , Hideki Akiba , Masachika Yoshino
IPC分类号： B32B27/38 , B32B27/28 , C08L63/00 , C08L79/08 , C08L83/10
CPC分类号： H01L21/6836 , B32B7/12 , C08L63/00 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J7/22 , C09J7/35 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2463/00 , C09J2479/08 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/19042 , H01L2924/3511 , Y10S525/928 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , Y10T428/31721 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.
摘要翻译：在包括背衬构件，粘合剂层和保护构件的晶片切割/芯片接合片中，粘合剂层由包含含酚羟基自由基的聚酰亚胺树脂，环氧树脂和环氧树脂固化的粘合剂组合物制成环氧树脂和环氧树脂固化剂的总重量与聚酰亚胺树脂的重量的比例为0.1:1至3:1。由于耐热性，改善的粘合性能和低弹性模量，晶片切割/芯片粘接片对于降低芯片粘合后的芯片的翘曲是有效的。

100. 发明申请

US20060264567A1 Lens-forming silicone resin composition and silicone lens 有权
标题翻译：透镜成型硅树脂组合物和硅胶透镜
公开(公告)号：US20060264567A1
公开(公告)日：2006-11-23
申请号：US11437662
申请日：2006-05-22
申请人： Toshio Shiobara , Tsutomu Kashiwagi , Katsuyuki Imazawa
发明人： Toshio Shiobara , Tsutomu Kashiwagi , Katsuyuki Imazawa
IPC分类号： C08L83/04 , C08K5/09
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00
摘要： Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a platinum group metal base catalyst, and (D) a mold release agent cure into colorless, transparent, heat resistant parts which can be smoothly released from the mold and used as lenses in LED devices.
摘要翻译：硅氧烷树脂组合物，其包含（A）含有至少两个脂族不饱和键的有机聚硅氧烷，（B）分子中具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，（C）铂族金属碱催化剂和（D）脱模剂固化成无色，透明，耐热的部件，可以从模具中顺利释放并用作LED器件中的透镜。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式