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    • 92. 发明授权
    • Methods for analyzing the effectiveness of wafer backside cleaning
    • 分析晶圆背面清洗效果的方法
    • US06624078B1
    • 2003-09-23
    • US10196849
    • 2002-07-15
    • Michael Ravkin
    • Michael Ravkin
    • H01L21461
    • H01L22/34
    • A method for using a monitor substrate to determine effectiveness of a cleaning operation is provided. The method includes selecting a substrate from a lot of substrates and inspecting a surface of the substrate to determine a roughness profile of the substrate. The monitor substrate is then processed through a cleaning operation, and the monitor substrate is patterned with die regions throughout. Each of the die regions has a plurality of areas defining distinct roughness simulations. The method the proceeds to inspecting the monitor substrate at one die region and at one of the plurality of areas in the one die region that most closely resembles the roughness profile of the substrate. The inspecting of the monitor substrate is configured to yield data regarding cleaning performance of the cleaning operation.
    • 提供了一种使用监视器基板来确定清洁操作的有效性的方法。 该方法包括从许多基底中选择基底并检查基底的表面以确定基底的粗糙度轮廓。 然后通过清洁操作处理监视器基板,并且整个监视器基板被图案化。 每个模具区域具有限定不同粗糙度模拟的多个区域。 该方法用于在一个管芯区域和一个管芯区域中与该衬底的粗糙度轮廓最相似的多个区域中的一个区域中检查监测器衬底。 监视器基板的检查被配置为产生关于清洁操作的清洁性能的数据。
    • 94. 发明授权
    • Apparatus for processing a wafer
    • 用于处理晶片的设备
    • US06425158B2
    • 2002-07-30
    • US09918667
    • 2001-07-27
    • Michael Ravkin
    • Michael Ravkin
    • B08B104
    • H01L21/67046Y10S134/902
    • A method and apparatus for processing wafer edges is disclosed. Pressure applied to the wafer at one end of A brush/pad assembly is greater than at the opposite end of the brush/pad assembly. The increased pressure causes wafer rotation to slow or to reverse direction as compared to less pressure applied by the brush/pad assembly. In one embodiment slowed rotation causes a difference in tangential velocity between the roller(s) and the wafer edge/bevel that causes pads in the roller(s) to process the edge/bevel of the wafer. In another embodiment, the opposite direction of rotation causes the wafer to rotate counter to rollers otherwise causing the wafer to rotate. Cleaning surfaces in the rollers clean the edges of the wafer whether rotation is slowed or reversed.
    • 公开了一种用于处理晶片边缘的方法和装置。 在刷/垫组件的一端施加到晶片的压力大于刷/垫组件的相对端。 与由刷/垫组件施加的较小压力相比,增加的压力导致晶片旋转减慢或反向。 在一个实施例中,减速旋转导致辊和晶片边缘/斜面之间的切向速度的差异导致辊中的垫处理晶片的边缘/斜面。 在另一个实施例中,相反的旋转方向导致晶片相对于辊旋转,否则导致晶片旋转。 滚筒中的清洁表面清洁晶片的边缘,无论旋转是否减速或反转。