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    • 93. 发明授权
    • Semiconductor devices having improved gate insulating layers and related methods of fabricating such devices
    • 具有改进的栅极绝缘层的半导体器件和制造这种器件的相关方法
    • US07157762B2
    • 2007-01-02
    • US10982580
    • 2004-11-04
    • Chang-Hyun Lee
    • Chang-Hyun Lee
    • H01L27/108H01L21/336
    • H01L27/105H01L27/11526H01L27/11546H01L29/42324
    • Semiconductor devices are provided on a substrate having a cell array region and a peripheral circuit region. A first device isolation layer defines a cell active region in the cell array region and a second device isolation layer having first and second sidewalls defines a peripheral active region in the peripheral circuit region. A cell gate pattern that includes a plurality of conductive layers crosses over the cell active region, and a peripheral gate pattern that includes a plurality of conductive layers crosses over the peripheral active region. A lowermost layer of the peripheral gate pattern has first and second sidewalls that are aligned with respective of either the first and second sidewalls of the second device isolation layer or a vertical extension of the first and second sidewalls of the second device isolation layer. Further, the lowest layer of the cell gate pattern and the lowest layer of the peripheral gate pattern comprise different conductive layers.
    • 半导体器件设置在具有单元阵列区域和外围电路区域的基板上。 第一器件隔离层限定电池阵列区域中的电池有源区,并且具有第一和第二侧壁的第二器件隔离层限定外围电路区域中的外围有源区。 包括多个导电层的单元栅极图案与单元有源区交叉,并且包括多个导电层的外围栅极图案跨过周边有源区。 外围栅极图案的最下层具有与第二器件隔离层的第一和第二侧壁的相应的第一和第二侧壁或第二器件隔离层的第一和第二侧壁的垂直延伸部对准的第一和第二侧壁。 此外,单元栅极图案的最下层和外围栅极图案的最下层包括不同的导电层。
    • 96. 发明申请
    • Non-Volatile Memory Devices with Charge Storage Insulators and Methods of Fabricating Such Devices
    • 具有充电存储绝缘体的非易失性存储器件和制造这种器件的方法
    • US20060240612A1
    • 2006-10-26
    • US11428884
    • 2006-07-06
    • Chang-Hyun Lee
    • Chang-Hyun Lee
    • H01L21/8238
    • H01L27/105H01L27/11568H01L27/11573
    • A non-volatile memory device comprises a cell region defined at a substrate and a plurality of device isolation layers formed in the cell region to define a plurality of active regions. A charge storage insulator covers substantially the entire top surface of the cell region. A plurality of gate lines are formed on the charge storage insulator that cross over the device isolation layers. Conductive patterns are disposed between predetermined gate lines that penetrate the charge storage insulator to electrically connect with the active regions. According to the method of fabricating the device, a plurality of device isolation layers are formed in the substrate and then a charge storage insulator is formed on an entire surface of the substrate and the device isolation layers. A plurality of parallel gate lines that cross over the device isolation layers are formed on the charge storage insulator and then conductive patterns are formed between predetermined gate lines. The conductive patterns penetrate the charge storage insulator and electrically connect with the active regions.
    • 非易失性存储器件包括限定在衬底处的单元区域和形成在单元区域中以限定多个有源区域的多个器件隔离层。 电荷存储绝缘体基本上覆盖电池区域的整个顶表面。 在电荷存储绝缘体上形成有跨越器件隔离层的多条栅极线。 导电图案设置在穿过电荷存储绝缘体的预定栅极线之间以与有源区电连接。 根据该器件的制造方法,在衬底中形成多个器件隔离层,然后在衬底和器件隔离层的整个表面上形成电荷存储绝缘体。 在电荷存储绝缘体上形成跨越器件隔离层的多条平行栅极线,然后在预定栅极线之间形成导电图案。 导电图案穿透电荷存储绝缘体并与有源区电连接。
    • 97. 发明申请
    • Nonvolatile memory devices and methods of forming the same
    • 非易失存储器件及其形成方法
    • US20060208338A1
    • 2006-09-21
    • US11375983
    • 2006-03-15
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/00
    • H01L27/105B82Y10/00H01L21/823462H01L27/0629H01L27/11526H01L27/11546H01L27/11568
    • Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. The second conductive layer is etched to form a cell gate electrode in the cell array region and to concurrently remove the second conductive layer from the resistor region and the first conductive layer is etched in the resistor region to form a resistor.
    • 形成存储器件的方法包括在包括单元阵列区域和电阻器区域的半导体衬底中形成器件隔离层,器件隔离层延伸到电阻器区域中并在半导体衬底中限定有源区域。 在电阻器区域中的器件隔离层上形成第一导电层。 半导体衬底暴露在电池阵列区域中。 在半导体衬底的包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的部分上形成电池绝缘层。 在半导体衬底的包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的部分中的单元绝缘层上形成第二导电层。 蚀刻第二导电层以在电池阵列区域中形成电池栅电极,并且同时从电阻器区域去除第二导电层,并且在电阻器区域中蚀刻第一导电层以形成电阻器。
    • 99. 发明授权
    • Non-volatile memory devices with charge storage insulators
    • 具有电荷存储绝缘体的非易失性存储器件
    • US06995424B2
    • 2006-02-07
    • US10712426
    • 2003-11-13
    • Chang-Hyun Lee
    • Chang-Hyun Lee
    • H01L29/792
    • H01L27/11568H01L27/105H01L27/115H01L27/11573H01L29/66833
    • A non-volatile memory device comprises a cell region defined at a substrate and a plurality of device isolation layers formed in the cell region to define a plurality of active regions. A charge storage insulator covers substantially the entire top surface of the cell region. A plurality of gate lines are formed on the charge storage insulator that cross over the device isolation layers. Conductive patterns are disposed between predetermined gate lines that penetrate the charge storage insulator to electrically connect with the active regions. According to the method of fabricating the device, a plurality of device isolation layers are formed in the substrate and then a charge storage insulator is formed on an entire surface of the substrate and the device isolation layers. A plurality of parallel gate lines that cross over the device isolation layers are formed on the charge storage insulator and then conductive patterns are formed between predetermined gate lines. The conductive patterns penetrate the charge storage insulator and electrically connect with the active regions.
    • 非易失性存储器件包括限定在衬底处的单元区域和形成在单元区域中以限定多个有源区域的多个器件隔离层。 电荷存储绝缘体基本上覆盖电池区域的整个顶表面。 在电荷存储绝缘体上形成有跨越器件隔离层的多条栅极线。 导电图案设置在穿过电荷存储绝缘体的预定栅极线之间以与有源区电连接。 根据该器件的制造方法,在衬底中形成多个器件隔离层,然后在衬底和器件隔离层的整个表面上形成电荷存储绝缘体。 在电荷存储绝缘体上形成跨越器件隔离层的多条平行栅极线,然后在预定栅极线之间形成导电图案。 导电图案穿透电荷存储绝缘体并与有源区电连接。
    • 100. 发明授权
    • Methods of programming non-volatile semiconductor memory devices including coupling voltages and related devices
    • 编程非易失性半导体存储器件包括耦合电压和相关器件的方法
    • US06987694B2
    • 2006-01-17
    • US10640082
    • 2003-08-13
    • Chang-Hyun Lee
    • Chang-Hyun Lee
    • G11C16/00
    • G11C11/5628G11C16/0483G11C16/12G11C16/3418
    • A non-volatile memory device may include a string of serially connected memory cell transistors with each memory cell transistor of the string being connected to a different word line. The non-volatile memory device may be programmed by applying a pass voltage to a first word line connected to a first memory cell transistor of the string, by applying a coupling voltage to a second word line connected to a second memory cell transistor of the string, and by applying a program voltage to a third word line connected to a third memory cell transistor of the string. More particularly, the coupling voltage can be greater than a ground voltage of the memory device, and the pass voltage and the coupling voltage can be different. In addition, the program voltage can be applied to the third word line while applying the pass voltage to the first word line and while applying the coupling voltage to the second word line, and the third memory cell transistor can be programmed responsive to applying the program voltage to the third word line wherein the second memory cell transistor is between the first and third memory cell transistors of the serially connected string. Related devices are also discussed.
    • 非易失性存储器件可以包括一串串联的存储单元晶体管,其中串的每个存储单元晶体管连接到不同的字线。 可以通过向连接到串的第一存储单元晶体管的第一字线施加通过电压来对非易失性存储器件进行编程,通过向连接到串的第二存储单元晶体管的第二字线施加耦合电压 并且通过对连接到串的第三存储单元晶体管的第三字线施加编程电压。 更具体地,耦合电压可以大于存储器件的接地电压,并且通过电压和耦合电压可以不同。 此外,可以将编程电压施加到第三字线,同时将通过电压施加到第一字线,同时将耦合电压施加到第二字线,并且第三存储单元晶体管可以响应于应用程序而被编程 电压到第三字线,其中第二存储单元晶体管位于串行连接的串的第一和第三存储单元晶体管之间。 还讨论了相关设备。