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    • 91. 发明授权
    • Phase change memory coding
    • 相变存储器编码
    • US08634235B2
    • 2014-01-21
    • US12823508
    • 2010-06-25
    • Hsiang-Lan LungMing Hsiu LeeYen-Hao ShihTien-Yen WangChao-I Wu
    • Hsiang-Lan LungMing Hsiu LeeYen-Hao ShihTien-Yen WangChao-I Wu
    • G11C11/00
    • G11C13/0004G11C11/5678G11C13/004G11C13/0069G11C2013/0092
    • An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.
    • 集成电路相变存储器可以通过在一些单元和存储器中引起第一电阻状态以及存储器中的第二电阻状态以及存储器中的一些其他单元来表示数据集而被预编码。 在对数据集进行编码之后,将集成电路相变存储器安装在基板上。 在安装集成电路相变存储器之后,通过感测第一和第二电阻状态以及将第一电阻状态下的单元改变为第三电阻状态并将第二电阻状态的单元改变为第四电阻状态来读取数据组。 第一和第二电阻状态在焊接或其他热循环过程之后保持感测裕度。 第三和第四电阻状态的特征在于能够使用更高速度和更低功率的转换,适用于电路的任务功能。
    • 92. 发明申请
    • HIGH-ENDURANCE PHASE CHANGE MEMORY DEVICES AND METHODS FOR OPERATING THE SAME
    • 高耐久性相变记忆体装置及其操作方法
    • US20120327708A1
    • 2012-12-27
    • US13472395
    • 2012-05-15
    • Pei-Ying DUChao-I WuMing-Hsiu LeeSangbum KimChung Hon Lam
    • Pei-Ying DUChao-I WuMing-Hsiu LeeSangbum KimChung Hon Lam
    • G11C11/00
    • G11C13/0004G11C13/0021
    • Phase change based memory devices and methods for operating such devices described herein overcome the set or reset failure mode and result in improved endurance, reliability and data storage performance. A high current repair operation is carried out in response to a set or reset failure of a phase change memory cell. The higher current repair operation can provide a sufficient amount of energy to reverse compositional changes in the phase change material which can occur after repeated set and reset operations. By reversing these compositional changes, the techniques described herein can recover a memory cell which experienced a set or reset failure, thereby extending the endurance of the memory cell. In doing so, phase change based memory devices and methods for operating such devices are provided which have high cycle endurance.
    • 基于相变的存储器件和用于操作这里描述的这种器件的方法克服了设置或复位故障模式并导致改进的耐久性,可靠性和数据存储性能。 响应于相变存储单元的置位或复位故障执行高电流修复操作。 更高的电流修复操作可以提供足够的能量来反转在重复设置和复位操作之后可能发生的相变材料的组成变化。 通过颠倒这些组合变化,本文描述的技术可以恢复经历设置或复位故障的存储器单元,从而延长存储单元的耐久性。 这样做,提供了具有高循环耐久性的基于相变的存储器件和用于操作这些器件的方法。
    • 94. 发明授权
    • Trench type non-volatile memory having three storage locations in one memory cell
    • 在一个存储单元中具有三个存储位置的沟槽型非易失性存储器
    • US08138540B2
    • 2012-03-20
    • US11258490
    • 2005-10-24
    • Chao-I Wu
    • Chao-I Wu
    • H01L29/76
    • H01L27/11568H01L27/115
    • A non-volatile memory. The non-volatile memory comprises a substrate, a conductive layer, a charge storage layer, several first doped regions and several second doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is located over the substrate, wherein the conductive layer fills in the trenches. The charge storage layer is located between the substrate and the conductive layer. The first doped regions are located in the substrate adjacent to both sides of the trenches respectively, wherein the first doped regions between the neighboring trenches are separated from each other. The second doped regions are located in a portion of the substrate under the bottoms of the trenches respectively.
    • 非易失性存储器。 非易失性存储器包括衬底,导电层,电荷存储层,几个第一掺杂区域和几个第二掺杂区域。 衬底具有形成在其中的多个沟槽。 导电层位于衬底上,其中导电层填充在沟槽中。 电荷存储层位于基板和导电层之间。 第一掺杂区域分别位于与沟槽两侧相邻的衬底中,其中相邻沟槽之间的第一掺杂区域彼此分离。 第二掺杂区域分别位于沟槽底部的衬底的一部分中。
    • 95. 发明授权
    • Program and erase methods with substrate transient hot carrier injections in a non-volatile memory
    • 在非易失性存储器中进行衬底瞬态热载体注入的编程和擦除方法
    • US08072810B2
    • 2011-12-06
    • US12985743
    • 2011-01-06
    • Tzu-Hsuan HsuChao-I WuKuang-Yeu HsiehYa-Chin King
    • Tzu-Hsuan HsuChao-I WuKuang-Yeu HsiehYa-Chin King
    • G11C11/34
    • G11C16/0466
    • The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. the programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure.
    • 本发明通过采用用于编程的衬底瞬态热电子技术和用于擦除的衬底瞬时热孔技术来描述电荷俘获存储器的均匀编程方法和均匀擦除方法,其模拟用于NAND存储器操作的FN隧道法。 本发明的方法可应用于包括n沟道或p沟道SONOS类型的存储器和浮动栅(FG)型存储器的各种电荷捕获存储器。 使用衬底瞬态热电子注入进行电荷俘获存储器的编程,其中体偏置电压Vb具有短的脉冲宽度,并且栅极偏置电压Vg具有足以将电子从沟道区域移动到 电荷捕获结构。