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91. 外观设计

USD507544S1 Light emitting diode package 失效
公开(公告)号：USD507544S1
公开(公告)日：2005-07-19
申请号：US29180484
申请日：2003-04-25
申请人： Bily Wang , Jonnie Chuang
设计人： Bily Wang , Jonnie Chuang

92. 外观设计

USD506732S1 Light-emitting diode 失效
公开(公告)号：USD506732S1
公开(公告)日：2005-06-28
申请号：US29207970
申请日：2004-06-23
申请人： Bily Wang , Jonnie Chuang , Hui Yen Huang
设计人： Bily Wang , Jonnie Chuang , Hui Yen Huang

93. 发明申请

US20050093010A1 IC PACKAGE WITH STACKED SHEET METAL SUBSTRATE 有权
标题翻译： IC封装与堆叠的金属基板
公开(公告)号：US20050093010A1
公开(公告)日：2005-05-05
申请号：US10697610
申请日：2003-10-31
申请人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
IPC分类号： H01L21/60 , H01L23/495 , H01L29/22 , H01L33/00
CPC分类号： H01L24/97 , H01L23/49562 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Stacked metal sections serve as two leads of an IC package. In one embodiment, an IC chip is mounted on one section serving as the terminal for the bottom electrode of the chip, and the top electrode of the chip is wire-bonded to the other section serving as another terminal for the chip. The thin sheet metal permits narrower etched separation between the two metal sections. Stacking of two pre-etched thin sheet metals strengthens the substrate. The package is covered with glue to hold the two sections together. The stacked pre-etched metal sheets can serve as a common substrate for a matrix of IC packages, which can later be cut in two orthogonal directions to yield individual packages.
摘要翻译：堆叠金属部分作为IC封装的两个引线。在一个实施例中，将IC芯片安装在用作芯片的底部电极的端子的一个部分上，并且芯片的顶部电极引线接合到用作芯片的另一个端子的另一个部分。薄金属板允许两个金属部分之间的较窄的蚀刻间隔。两个预蚀刻的薄金属板的堆叠加强了基板。包装用胶水覆盖，将两个部分保持在一起。堆叠的预蚀刻金属片可以用作IC封装的矩阵的公共衬底，其可以随后在两个正交方向上被切割以产生单独的封装。

94. 发明授权

US06784458B1 Random partitionable dot matrix LED display 有权
标题翻译：随机可分割点阵LED显示屏
公开(公告)号：US06784458B1
公开(公告)日：2004-08-31
申请号：US10412764
申请日：2003-04-14
申请人： Bily Wang , Jonnie Chuang
发明人： Bily Wang , Jonnie Chuang
IPC分类号： H01L2715
CPC分类号： G09F9/33 , H01L25/0753 , H01L2924/0002 , H05K1/0289 , H01L2924/00
摘要： An array of light emitting diodes (LED) are laid out as a dot matrix array as a display panel. Each LED is accessed by two dimensional addressing from a first set of parallel horizontal interconnections and a second set of orthogonal interconnections. The two sets of orthogonal interconnections are printed on two sides of a substrate. One of the two electrodes of an LED, which mounted on the top of the substrate, is fed through the substrate with a via hole and connected to the orthogonal interconnection at the bottom of the substrate. The size of the display panel is configurable by removing certain rows and/or columns. More than one partitioned blocks can be pieced together by aligning and coupling the corresponding orthogonal interconnections through a motherboard.
摘要翻译：一组发光二极管（LED）作为点阵阵列布置为显示面板。每个LED通过来自第一组并行水平互连和第二组正交互连的二维寻址来访问。两组正交互连印刷在基板的两侧。安装在基板顶部的LED的两个电极中的一个通过基板通过基板通孔并连接到基板底部的正交互连。通过删除某些行和/或列可以配置显示面板的大小。通过对准和耦合相应的正交互连通过母板，可以将多于一个的分区块拼接在一起。

95. 发明授权

US07276782B2 Package structure for semiconductor 有权
标题翻译：半导体封装结构
公开(公告)号：US07276782B2
公开(公告)日：2007-10-02
申请号：US11011133
申请日：2004-12-15
申请人： Billy Wang , Jonnie Chuang , Chi-Wen Hung , Chuan-Fa Lin
发明人： Billy Wang , Jonnie Chuang , Chi-Wen Hung , Chuan-Fa Lin
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L24/48 , H01L24/85 , H01L24/97 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and quality of package can be increased, and when packaging an LED chip, it easily meets the package requirements of an electronic chip. In addition, the substrate structure is cheaper than the prior art, because a double-layered substrate is employed to improve the strength, and the package structure is also preferred because an external frame device is additionally used for preventing interference by external light. The package structure for the semiconductor has a substrate, an external frame device and a polymer filler.
摘要翻译：描述了半导体的封装结构。其优点在于它具有很强的结构强度，并且当被光穿透时，它不会被外界光影响并且可以使光凝结。因此，不容易变形，可以提高封装的成品率和质量，并且在封装LED芯片时，容易满足电子芯片的封装要求。此外，由于使用双层基板来提高强度，因此基板结构比现有技术便宜，并且封装结构也是优选的，因为外部框架装置另外用于防止外部光的干扰。半导体的封装结构具有衬底，外部框架器件和聚合物填料。

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