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    • 92. 发明授权
    • Glaze compositions for ceramic substrates
    • 陶瓷基材的釉料组合物
    • US4746578A
    • 1988-05-24
    • US847480
    • 1986-04-03
    • Kazuo KondoTatsunori KurachiMasahiko Okuyama
    • Kazuo KondoTatsunori KurachiMasahiko Okuyama
    • C03C8/02C03C8/04C03C8/00
    • C03C8/02C03C8/04
    • Glaze compositions for ceramic substrates such as an alumina substrate are described. In a first embodiment, the glaze composition consists of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO and 0.1 to 5 mol % Y.sub.2 O.sub.3. In a second embodiment, the glaze composition consists essentially of 55 to 75 mol % SiO.sub.2, 1 to 15 mol % Al.sub.2 O.sub.3, 3 to 20 mol % CaO, 1 to 13 mol % BaO, 1 to 5 mol % Y.sub.2 O.sub.3, 25 mol % or less SrO, 7 mol % or less B.sub.2 O.sub.3, 2 mol % or less ZnO and 2 mol % or less MgO. In a third embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.3, 2 to 20 mol % CaO and 1 to 13 mol % BaO. In a fourth embodiment, the glaze composition consists essentially of 58 to 75 mol % SiO.sub.2, 2 to 15 mol % Al.sub.2 O.sub.3, 0.5 to 5 mol % La.sub.2 O.sub.3, 2 to 20 mol % CaO, 1 to 13 mol % BaO, 25 mol % or less SrO, 2 mol % or less MgO, 7 mol % or less B.sub.2 O.sub.3, and 5 mol % or less Y.sub.2 O.sub.3. These glaze compositions are suitable for use in surface glazing of ceramic substrates for thermal heads, printer heads, etc.
    • 描述了诸如氧化铝衬底的陶瓷衬底的釉料组合物。 在第一实施方案中,釉料组合物由55至75mol%的SiO 2,1至15mol%的Al 2 O 3,3至20mol%的CaO,1至13mol%的BaO和0.1至5mol%的Y 2 O 3组成。 在第二实施方案中,釉料组合物基本上由55至75mol%的SiO 2,1至15mol%的Al 2 O 3,3至20mol%的CaO,1至13mol%的BaO,1至5mol%的Y 2 O 3,25mol%或 较少的SrO,7摩尔%以下的B2O3,2摩尔%以下的ZnO和2摩尔%以下的MgO。 在第三实施方案中,釉料组合物基本上由58至75mol%的SiO 2,2至15mol%的Al 2 O 3,0.5至5mol%的La 2 O 3,2至20mol%的CaO和1至13mol%的BaO组成。 在第四实施方案中,釉料组合物基本上由58至75mol%的SiO 2,2至15mol%的Al 2 O 3,0.5至5mol%的La 2 O 3,2至20mol%的CaO,1至13mol%的BaO,25mol%或 较少的SrO,2摩尔%以下的MgO,7摩尔%以下的B2O3和5摩尔%以下的Y2O3。 这些釉料组合物适用于用于热敏头,打印头等陶瓷基材的表面玻璃。
    • 95. 发明授权
    • Analog integrated circuit
    • 模拟集成电路
    • US4689579A
    • 1987-08-25
    • US721132
    • 1985-04-08
    • Akira ShibataKazuo KondoKoichi Hirose
    • Akira ShibataKazuo KondoKoichi Hirose
    • H01L27/06H01L27/07H03F3/45H01L27/02
    • H01L27/0794H01L27/0652
    • A high-density analog integrated circuit having built-in resistor elements formed simultaneously with the formation of the base of transistor is disclosed in which a high-resistance element is formed of an ion-implanted resistor, a low-resistance element is formed of a base-diffused resistor, and a pair of high-resistance elements are connected in such a manner that a difference between a signal current flowing through one of the high-resistance elements and another signal current flowing through the other high-resistance element is outputted, and in which an ion-implanted resistor having a high resistance and a thin film capacitor having a small capacitance make up a built-in time constant circuit, which makes it possible to integrate on one semiconductor chip circuits such as a filter circuit for video signal and an input bias circuit.
    • 公开了一种具有与形成晶体管基极同时形成的内置电阻元件的高密度模拟集成电路,其中高电阻元件由离子注入电阻器形成,低电阻元件由 基极扩散电阻器和一对高电阻元件以这样的方式连接,使得流过高电阻元件中的一个的信号电流与流过另一个高电阻元件的另一个信号电流之间的差异被输出, 其中具有高电阻的离子注入电阻器和具有小电容的薄膜电容器构成内置的时间常数电路,这使得可以集成在一个半导体芯片电路上,例如用于视频信号的滤波器电路 和输入偏置电路。
    • 98. 发明授权
    • Glass-ceramic product
    • 玻璃陶瓷制品
    • US4540671A
    • 1985-09-10
    • US552190
    • 1983-11-15
    • Kazuo KondoMasahiko Okuyama
    • Kazuo KondoMasahiko Okuyama
    • C03C10/14C03B32/02C03C10/00C03C10/08H01B3/08C03C3/22C03B32/00C04B33/34
    • C03C10/0054C03C10/0045Y10S428/901
    • A glass-ceramic product is disclosed. The glass product is produced by combining 0.1 to 6 wt % of a compound selected from the group consisting of B.sub.2 O.sub.3 and P.sub.2 O.sub.5 with a mixture. The mixture includes 54 to 63 wt % SiO.sub.2, 20 to 28 wt % Al.sub.2 O.sub.3, 10 to 18 wt % MgO and 2 to 6 wt % ZnO. From the combined compound and mixture are formed a glassy material and then glassy material is ground in order to form a frit. The frit is then molded and the molded frit is fired into a crystalline form. The resulting glass-ceramic product has a low permittivity as compared with alumina and low power factor tan .delta.. Further, the product has a coefficient of thermal expansion which is comparable with the value for silicon semiconductor chips. The product also has other desirable characteristics such as its firing and crystallizing temperature, moisture absorption and mechanical strength.
    • 公开了一种玻璃陶瓷产品。 通过混合0.1〜6重量%的选自B 2 O 3和P 2 O 5的化合物来制造玻璃制品。 该混合物包括54至63重量%的SiO 2,20至28重量%的Al 2 O 3,10至18重量%的MgO和2至6重量%的ZnO。 从组合的化合物和混合物形成玻璃状材料,然后研磨玻璃状材料以形成玻璃料。 然后将玻璃料模制,并将模制的玻璃料烧成结晶形式。 所得到的玻璃陶瓷产品与氧化铝和低功率因数tanδ相比具有低介电常数。 此外,该产品具有与硅半导体芯片的值相当的热膨胀系数。 该产品还具有其它理想的特性,例如其焙烧和结晶温度,吸湿性和机械强度。