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91. 发明授权

US07402047B2 IC card 失效
标题翻译： IC卡
公开(公告)号：US07402047B2
公开(公告)日：2008-07-22
申请号：US11449815
申请日：2006-06-09
申请人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Yosuke Yukawa
发明人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Yosuke Yukawa
IPC分类号： H01R12/00
CPC分类号： G06K19/07732 , G06K19/07 , G06K19/0719 , G06K19/072 , G06K19/07733 , G06K19/07743 , H01L2224/05553 , H01L2224/48137 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要： A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot, wherein the amounts of protrusion of slot terminals in a card slot are alternately changed in association with a zigzag section, and the slot terminals are disposed in a row in parallel as a whole.
摘要翻译：多功能IC卡（MFC）与多媒体卡，SD卡等的兼容性在该连接器端子（＃1〜＃13）中以锯齿形的方式配置在卡片基板（1）上两行，存储卡单元（3）和SIM（用户识别模块）卡单元（4）分别专门连接并安装到连接器端子（＃1至＃13）的预定端子上的多功能设施。存储卡单元（3）和SIM卡单元（4）分别设置有用于存储安全密码的区域。因此，一个IC卡能够实现安全级别不同的多功能设备。由于在连接器端子的阵列中采用对应于由之字形形式表示的形式的多列布局，所以在卡槽中可以采用相对简单的结构，其中卡终端在卡中的突出量插槽与锯齿形部分交替地改变，并且插槽端子整体上平行布置成一排。

92. 发明授权

US07291018B2 IC card 有权
公开(公告)号：US07291018B2
公开(公告)日：2007-11-06
申请号：US11449765
申请日：2006-06-09
申请人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Yosuke Yukawa
发明人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Yosuke Yukawa
IPC分类号： H01R12/00
CPC分类号： G06K19/07732 , G06K19/07 , G06K19/0719 , G06K19/072 , G06K19/07733 , G06K19/07743 , H01L2224/05553 , H01L2224/48137 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要： A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot, wherein the amounts of protrusion of slot terminals in a card slot are alternately changed in association with a zigzag section, and the slot terminals are disposed in a row in parallel as a whole.

93. 发明授权

US07267287B2 IC card 有权
标题翻译： IC卡
公开(公告)号：US07267287B2
公开(公告)日：2007-09-11
申请号：US11619129
申请日：2007-01-02
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K19/06 , G06K7/06
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

94. 发明授权

US07227251B2 Semiconductor device and a memory system including a plurality of IC chips in a common package 有权
标题翻译：半导体器件和包括公共封装中的多个IC芯片的存储器系统
公开(公告)号：US07227251B2
公开(公告)日：2007-06-05
申请号：US11114175
申请日：2005-04-26
申请人： Kazuki Sakuma , Masayasu Kawamura , Yasushi Takahashi , Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano
发明人： Kazuki Sakuma , Masayasu Kawamura , Yasushi Takahashi , Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano
IPC分类号： H01L23/02 , H01L23/48 , G11C8/00
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49537 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01055 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.
摘要翻译：半导体器件通过层叠两个半导体芯片与其背面面对面设置而形成。每个半导体芯片设置有用于时钟使能的外部引线，时钟使能信号和芯片选择信号被单独地输入。在访问一个半导体芯片的情况下，通过将时钟使能信号和芯片选择信号设置为非活动状态，将另一个半导体芯片设置为低功耗模式。

95. 发明授权

US06573567B1 IC card 有权
公开(公告)号：US06573567B1
公开(公告)日：2003-06-03
申请号：US09689663
申请日：2000-10-13
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L2362
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.

96. 发明授权

US06531773B2 Semiconductor device 有权
公开(公告)号：US06531773B2
公开(公告)日：2003-03-11
申请号：US09930942
申请日：2001-08-17
申请人： Hirotaka Nishizawa , Masachika Masuda , Kouichi Kanemoto , Tamaki Wada
发明人： Hirotaka Nishizawa , Masachika Masuda , Kouichi Kanemoto , Tamaki Wada
IPC分类号： H01L2334
CPC分类号： H01L24/49 , H01L23/49575 , H01L23/50 , H01L24/48 , H01L24/73 , H01L25/18 , H01L2224/05554 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01039 , H01L2924/01056 , H01L2924/01058 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A chip mounting method is proposed which considers facilitating the testing of semiconductor chips when a plurality of semiconductor chips are sealed in a single resin sealing body. This method also considers its application to a variety of MCPs and system LSIs. In a single package, one signal output terminal of the first semiconductor chip and a first external terminal of the semiconductor device are internally connected independently. One signal input terminal of the second semiconductor chip and a second external terminal of the semiconductor device are internally connected independently. The first and second external terminals of the semiconductor device are connected outside of the semiconductor device to complete the connection between the signal output terminal and the signal input terminal.

97. 发明授权

US06492727B2 Semiconductor device 有权
公开(公告)号：US06492727B2
公开(公告)日：2002-12-10
申请号：US09930943
申请日：2001-08-17
申请人： Hirotaka Nishizawa , Masachika Masuda , Kouichi Kanemoto , Tamaki Wada
发明人： Hirotaka Nishizawa , Masachika Masuda , Kouichi Kanemoto , Tamaki Wada
IPC分类号： H01L2334
CPC分类号： H01L24/49 , H01L23/49575 , H01L23/50 , H01L24/48 , H01L24/73 , H01L25/18 , H01L2224/05554 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01039 , H01L2924/01056 , H01L2924/01058 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A chip mounting method is proposed which considers facilitating the testing of semiconductor chips when a plurality of semiconductor chips are sealed in a single resin sealing body. This method also considers its application to a variety of MCPs and system LSIs. In a single package, one signal output terminal of the first semiconductor chip and a first external terminal of the semiconductor device are internally connected independently. One signal input terminal of the second semiconductor chip and a second external terminal of the semiconductor device are internally connected independently. The first and second external terminals of the semiconductor device are connected outside of the semiconductor device to complete the connection between the signal output terminal and the signal input terminal.

98. 发明授权

US08018038B2 IC card with terminals for direct access to internal components 有权
标题翻译：带有终端的IC卡，用于直接访问内部组件
公开(公告)号：US08018038B2
公开(公告)日：2011-09-13
申请号：US12835847
申请日：2010-07-14
申请人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka Nishizawa , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L23/02 , H01L23/52 , H01L23/538 , H01L23/58 , G06K19/07
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

99. 发明授权

US07552876B2 IC card 失效
标题翻译： IC卡
公开(公告)号：US07552876B2
公开(公告)日：2009-06-30
申请号：US11924044
申请日：2007-10-25
申请人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Kouichi Kanemoto , Yousuke Yukawa
发明人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Kouichi Kanemoto , Yousuke Yukawa
IPC分类号： G06K19/06
CPC分类号： G06K19/07732 , G06K19/07743 , G11C5/066 , H01L25/18 , H01L2223/54406 , H01L2223/54486 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2225/06562 , H01L2924/01021 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/3011 , H05K1/117 , H01L2924/00 , H01L2924/00012
摘要： An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
摘要翻译： IC卡具有安装在其上的半导体集成电路芯片的卡片基板和形成在其上的多个连接器端子。连接器端子从壳体露出。连接器端子以IC卡插入方向观察时以相互相邻的序列之间的交错形式以多个顺序布置。由于采用交错布局，所以可以相对容易地采用其中插座插座的插座端子的突出量改变并且插座端子串联布置的结构或配置。如果采用向下或低阶IC卡的连接器端子排列作为特定的连接器端子序列，而专门用于向上或高位IC卡的功能被分配给另一个交错的连接器端子装置，则向后兼容性也可以轻松实现。

100. 发明申请

US20080257968A1 IC CARD 失效
标题翻译： IC卡
公开(公告)号：US20080257968A1
公开(公告)日：2008-10-23
申请号：US11924044
申请日：2007-10-25
申请人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Kouichi Kanemoto , Yousuke Yukawa
发明人： Hirotaka Nishizawa , Haruji Ishihara , Atsushi Shiraishi , Kouichi Kanemoto , Yousuke Yukawa
IPC分类号： G06K19/06
CPC分类号： G06K19/07732 , G06K19/07743 , G11C5/066 , H01L25/18 , H01L2223/54406 , H01L2223/54486 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2225/06562 , H01L2924/01021 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/3011 , H05K1/117 , H01L2924/00 , H01L2924/00012
摘要： An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
摘要翻译： IC卡具有安装在其上的半导体集成电路芯片的卡片基板和形成在其上的多个连接器端子。连接器端子从壳体露出。连接器端子以IC卡插入方向观察时以相互相邻的序列之间的交错形式以多个顺序布置。由于采用交错布局，所以可以相对容易地采用其中插座插座的插座端子的突出量改变并且插座端子串联布置的结构或配置。如果采用向下或低阶IC卡的连接器端子排列作为特定的连接器端子序列，而专门用于向上或高位IC卡的功能被分配给另一个交错的连接器端子装置，则向后兼容性也可以轻松实现。

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