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91. 发明申请

US20130121635A1 DIRECT INTERLAYER OPTICAL COUPLER 有权
标题翻译：直接中间层光耦合器
公开(公告)号：US20130121635A1
公开(公告)日：2013-05-16
申请号：US13293624
申请日：2011-11-10
申请人： Hiren D. Thacker , Xuezhe Zheng , Ivan Shubin , Kannan Raj , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Hiren D. Thacker , Xuezhe Zheng , Ivan Shubin , Kannan Raj , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02B6/26 , B23P11/00
CPC分类号： G02B6/26 , Y10T29/49826
摘要： In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.
摘要翻译：在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。该光耦合器具有与光波导的光学模式不同的光学模式。例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

92. 发明授权

US08346087B2 Wavelength-division multiplexing for use in multi-chip systems 有权
标题翻译：波分复用用于多芯片系统
公开(公告)号：US08346087B2
公开(公告)日：2013-01-01
申请号：US11863815
申请日：2007-09-28
申请人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
发明人： Brian W. O'Krafka , Ashok V. Krishnamoorthy , John E. Cunningham , Xuehze Zheng , Ilya A. Sharapov , Ronald Ho
IPC分类号： H04B10/00 , H04B10/24
CPC分类号： G02B6/43 , G02B6/3897 , H01L23/48 , H01L2924/0002 , H04J14/02 , H01L2924/00
摘要： Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).
摘要翻译：描述了包括芯片模块（CM）阵列的系统的实施例。在该系统中，阵列中的给定CM包括被配置为通过使用接近连接器的电磁接近通信来将数据信号与一个或多个相邻CM通信的半导体管芯。注意，接近连接器靠近半导体管芯的表面。此外，给定CM被配置为通过使用光通信的光信号路径与其他CM通信光信号，并且使用波分复用（WDM）对光信号进行编码。

93. 发明申请

US20120321251A1 THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS 有权
标题翻译：三维宏块包括光学互连
公开(公告)号：US20120321251A1
公开(公告)日：2012-12-20
申请号：US13566598
申请日：2012-08-03
申请人： Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/26
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译：多芯片模块（MCM）包括使用光学互连耦合的一堆芯片。在堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到光波导的第二光耦合器。第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面中）或从第二方向到光波导。与第二方向相关联的光路通过中间芯片中的基板的开口。

94. 发明授权

US08334149B2 Mechanical coupling in a multi-chip module using magnetic components 有权
标题翻译：使用磁性元件的多芯片模块中的机械耦合
公开(公告)号：US08334149B2
公开(公告)日：2012-12-18
申请号：US13467671
申请日：2012-05-09
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L21/00
CPC分类号： H01L23/13 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/16147 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81141 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01051 , H01L2924/01056 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。这些正面和负面的特征相互交织在一起。特别地，正特征可以与给定的一对负特征匹配，其包括每个基底上的负特征。此外，给定对中的负特征中的至少一个可以包括硬磁材料，并且给定对中的正特征和另一个负特征可以包括软磁材料，其提供到硬磁体的通量回流路径材料。以这种方式，硬磁材料可以促进基板的可重新机械耦合。

95. 发明申请

US20120177318A1 WAVEGUIDE ELECTRO-ABSORPTION MODULATOR 有权
标题翻译：波导电吸收式调节器
公开(公告)号：US20120177318A1
公开(公告)日：2012-07-12
申请号：US12986062
申请日：2011-01-06
申请人： Xuezhe Zheng , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Xuezhe Zheng , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02F1/01
CPC分类号： G02F1/025 , G02F2001/0157
摘要： During operation of an electro-absorption modulator, an optical signal is conveyed, using an optical waveguide in the electro-absorption modulator, to a semiconductor layer that substantially fills a gap between two portions of the optical waveguide. Then, the optical signal is electro-absorption modulated by selectively applying a voltage to electrodes that produces an electric field, approximately perpendicular to the midline of the optical waveguide, in the semiconductor layer. These electrodes are coupled to the edges of the semiconductor layer at the periphery along the width of the semiconductor layer by intervening layers. Furthermore, the intervening layers include a material that has a lower index of refraction than the semiconductor layer, and a lower optical absorption than the electrodes.
摘要翻译：在电吸收调制器的操作期间，使用电吸收调制器中的光波导将光信号传送到基本上填充光波导的两个部分之间的间隙的半导体层。然后，通过选择性地向在半导体层中产生大致垂直于光波导的中线的电场的电极施加电压来对光信号进行电吸收调制。这些电极通过中间层沿半导体层的宽度在周边连接到半导体层的边缘。此外，中间层包括具有比半导体层低的折射率的材料，并且具有比电极更低的光学吸收。

96. 发明授权

US08218334B2 Multi-chip module with multi-level interposer 有权
标题翻译：具有多级插入器的多芯片模块
公开(公告)号：US08218334B2
公开(公告)日：2012-07-10
申请号：US12719975
申请日：2010-03-09
申请人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
发明人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
IPC分类号： H05K1/14
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/6835 , H01L23/13 , H01L23/147 , H01L23/15 , H01L23/49827 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L2221/68309 , H01L2221/68345 , H01L2223/54426 , H01L2223/54473 , H01L2224/13 , H01L2224/13016 , H01L2224/131 , H01L2224/136 , H01L2224/16237 , H01L2224/81005 , H01L2224/81007 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/81901 , H01L2924/0001 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15787 , Y10T29/49165 , Y10T29/49204 , Y10T29/49895 , Y10T29/49947 , H01L2924/00012 , H01L2224/13099 , H01L2924/00
摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
摘要翻译：描述了包括多层插入板的多层插入板和多芯片模块（MCM）。多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到第一个微型弹簧连接器。类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧连接器

97. 发明申请

US20120093184A1 STRUCTURES AND METHODS FOR ADJUSTING THE WAVELENGTHS OF LASERS VIA TEMPERATURE CONTROL 有权
标题翻译：通过温度控制调节激光波长的结构和方法
公开(公告)号：US20120093184A1
公开(公告)日：2012-04-19
申请号：US13326297
申请日：2011-12-14
申请人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
发明人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
IPC分类号： H01S3/04 , H01S5/183
CPC分类号： H01S5/423 , H01S5/005 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0422 , H01S5/0612 , H01S5/18305 , H01S5/18327 , H01S5/4087
摘要： One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.
摘要翻译：本发明的一个实施例提供一种通过温度控制有助于调节激光器的波长的系统。该系统包括具有有源电路和信号焊盘所在的有源面的芯片。热控制机构提供安装在芯片的主动面上的两个激光器的局部热控制。通过单独控制激光器的温度，热控制机构控制由各个激光器发射的波长。通过产生导致两个或更多个激光器之间的温度差的温度梯度，该系统可以使激光器发射不同的波长。

98. 发明授权

US08150223B2 Thermal tuning of an optical device 有权
标题翻译：光学设备的热调谐
公开(公告)号：US08150223B2
公开(公告)日：2012-04-03
申请号：US12415882
申请日：2009-03-31
申请人： Guoliang Li , Ashok V. Krishnamoorthy , John E. Cunningham , Ivan Shubin , Xuezhe Zheng
发明人： Guoliang Li , Ashok V. Krishnamoorthy , John E. Cunningham , Ivan Shubin , Xuezhe Zheng
IPC分类号： G02B6/26
CPC分类号： G02B6/12007 , G02B2006/12061 , G02F1/011 , G02F1/0147 , G02F2202/10
摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide with a high thermal resistance to the surrounding external environment and a low thermal resistance to a localized heater. In particular, the thermal resistances associated with thermal dissipation paths from a heater in the optical device to an external environment via electrodes and via the substrate are increased, while the thermal resistance between the optical waveguide and the heater is decreased.
摘要翻译：描述了光学器件，光学器件阵列以及用于制造光学器件或阵列的技术的实施例。该光学器件实现在基板（例如硅）上，并且包括具有对周围外部环境的高耐热性和对局部加热器的低热阻的热可调谐光波导。特别地，与通过电极和经由基板的从光学装置中的加热器到外部环境的热耗散路径相关联的热阻增加，同时光波导和加热器之间的热阻降低。

99. 发明授权

US08131119B2 Optical device with large thermal impedance 有权
标题翻译：具有较大热阻抗的光器件
公开(公告)号：US08131119B2
公开(公告)日：2012-03-06
申请号：US12845035
申请日：2010-07-28
申请人： John E. Cunningham , Ashok V. Krishnamoorthy , Ivan Shubin , Guoliang Li , Xuezhe Zheng
发明人： John E. Cunningham , Ashok V. Krishnamoorthy , Ivan Shubin , Guoliang Li , Xuezhe Zheng
IPC分类号： G02B6/10 , G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02F1/025 , G02F1/0147 , G02F1/3133 , H01L2224/48091 , H01L2224/48472 , Y10T29/49124 , H01L2924/00014
摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption.
摘要翻译：描述了光学器件，光学器件阵列以及用于制造光学器件或阵列的技术的实施例。该光学器件实现在基板（例如硅）上，并且包括具有与其周围环境良好热隔离的热可调谐光波导。特别地，包括光波导的光学器件中的半导体的一部分自由地位于半导体层和衬底之间的间隙之上。通过减少光波导和外部环境之间的热耦合，可以以显着更少的功耗来热调谐光学器件。

100. 发明授权

US08102663B2 Proximity communication package for processor, cache and memory 有权
标题翻译：用于处理器，缓存和内存的接近通信包
公开(公告)号：US08102663B2
公开(公告)日：2012-01-24
申请号：US11864762
申请日：2007-09-28
申请人： John E. Cunningham , Ashok V. Krishnamoorthy , Anders Landin
发明人： John E. Cunningham , Ashok V. Krishnamoorthy , Anders Landin
IPC分类号： H05K7/00
CPC分类号： H01L25/18 , H01L23/48 , H01L24/73 , H01L25/0652 , H01L2224/1403 , H01L2224/16227 , H01L2224/16235 , H01L2224/1703 , H01L2225/06513 , H01L2225/06531 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2224/48
摘要： A “sombrero” bridge transports signal communication between a processor and one or more cache memories. The bridge surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor from another device. The bridge exchanges signals with the cache memories via capacitively coupled proximity connections. The bridge communicates with the processor via conductive (e.g. wire) connections and optionally proximity connections. Spacing between opposing pads of the proximity connection(s) between the bridge and the cache memories can be provided by recesses in a surface of the cache memory, corresponding recesses in an opposing surface of the bridge, and a ball for each matching pair of corresponding cache memory and bridge recesses. The ball fits in and between the recesses of the matching pair. The recess depths and ball diameter(s) constrain a minimum distance between opposing pads of the proximity connection(s).
摘要翻译： “sombrero”桥传输处理器与一个或多个缓存存储器之间的信号通信。该桥围绕处理器的周边，并且包括与处理器相对的孔，通过该孔可以从另一设备将功率和数据提供给处理器。桥接器通过电容耦合的接近连接与高速缓冲存储器交换信号。桥接器通过导电（例如导线）连接和可选的接近连接与处理器通信。桥接器和高速缓冲存储器之间的接近连接的相对焊盘之间的间隔可以由高速缓冲存储器的表面中的凹槽，桥的相对表面中的对应的凹部和用于每个匹配的对相应的对的球提供缓存和桥接凹槽。球配合在匹配对中的凹槽之间。凹陷深度和球直径约束邻近连接的相对焊盘之间的最小距离。

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