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1. 发明授权

US10184956B2 Probe card 有权
公开(公告)号：US10184956B2
公开(公告)日：2019-01-22
申请号：US15984420
申请日：2018-05-21
申请人： VIA Technologies, Inc.
发明人： Chen-Yueh Kung , Wen-Yuan Chang , Wei-Cheng Chen
IPC分类号： G01R1/073 , G01R1/20 , G01R31/02 , G01R31/26 , G01R31/28 , H01L21/66 , H01L21/84 , H01R12/06
摘要： A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

2. 发明授权

US07907419B2 Guide receptacle for tandem circuit board mating 有权
标题翻译：用于串联电路板交配的导向插座
公开(公告)号：US07907419B2
公开(公告)日：2011-03-15
申请号：US11873850
申请日：2007-10-17
申请人： Brian Patrick Costello
发明人： Brian Patrick Costello
IPC分类号： H01R12/06
CPC分类号： H05K7/142
摘要： A guide module is provided for connecting a primary circuit board and a secondary circuit board to a common backplane circuit board. The primary and secondary boards are in a tiered arrangement with both the primary and secondary circuit boards having interface connections on the backplane circuit board. The guide module includes a body having a height between opposite top and bottom surfaces. The height of the body establishes a stack height between the primary and secondary boards. Locating elements are formed on the top and bottom surfaces to locate and align the primary and secondary boards with respect to one another.
摘要翻译：提供了用于将初级电路板和次级电路板连接到公共背板电路板的引导模块。主电路板和次电路板分层布置，主电路板和次电路板都在背板电路板上具有接口连接。引导模块包括具有在相对的顶部和底部表面之间的高度的主体。主体的高度建立了主板和次板之间的堆叠高度。定位元件形成在顶表面和底表面上以相对于彼此定位和对齐主板和次板。

3. 发明申请

US20100127370A1 WIRING BOARD, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT 有权
标题翻译：接线板，半导体器件和半导体元件
公开(公告)号：US20100127370A1
公开(公告)日：2010-05-27
申请号：US12626037
申请日：2009-11-25
申请人： Takashi Ozawa , Hitoshi Sato
发明人： Takashi Ozawa , Hitoshi Sato
IPC分类号： H01L23/488 , H01R12/06
CPC分类号： H05K1/114 , H01L23/49838 , H01L24/16 , H01L24/17 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H05K1/113 , H05K2201/09627 , H05K2201/10674 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： On a semiconductor element loading face, wiring patterns are drawn out from those formed in the vicinity of the edge of the semiconductor element of the loading pads formed to correspond to the electrode terminals of the semiconductor element, and connected to via pads formed in the vicinity of the edge of the semiconductor element loading face; area pads constructed of the loading pads corresponding to the electrode terminals formed in the central region of the semiconductor element and its vicinity are electrically connected to external connecting terminal pads formed in the central region on the other side of the wiring board and its vicinity, through the nearest area pad vias encircled by the external connecting terminal pads and passing through the wiring board and the wiring patterns; and a plurality of the loading pads constituting the area pads commonly use one of the area pad vias.
摘要翻译：在半导体元件装载面上，从形成在与半导体元件的电极端子对应的装载焊盘的半导体元件的边缘附近形成的布线图案被拉出，并连接到形成在其附近的通孔焊盘的半导体元件装载面的边缘; 由与形成在半导体元件的中心区域的电极端子对应的负载焊盘构成的区域焊盘电连接到形成在布线基板的另一侧的中央区域的外部连接端子焊盘及其附近，通过由外部连接端子焊盘包围并通过布线板和布线图案的最近的区域焊盘通孔; 并且构成区域焊盘的多个装载焊盘通常使用区域焊盘通孔中的一个。

4. 发明申请

US20100073894A1 Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same 审中-公开
标题翻译：无芯基板，其制造方法以及包含其的微电子器件的封装
公开(公告)号：US20100073894A1
公开(公告)日：2010-03-25
申请号：US12284542
申请日：2008-09-22
申请人： Russell Mortensen , Mahadevan Suryakumar
发明人： Russell Mortensen , Mahadevan Suryakumar
IPC分类号： H01R12/06 , H01L23/12 , C25D5/02
CPC分类号： H01L23/49822 , C25D1/00 , C25D1/003 , C25D5/022 , C25D7/12 , H01L23/13 , H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/15159 , H01L2924/15311 , H01L2924/19106 , Y10T29/49124 , H01L2224/0401
摘要： A coreless substrate includes a stiffener material (110, 210, 620) having a plated via (120, 320) formed therein, an electrically insulating material (130, 230, 830) above the stiffener material, and an electrically conductive material (140, 240, 840) in the electrically insulating layer. In the same or another embodiment, a package for a microelectronic device includes a stiffener material layer (115, 215, 615) having plated vias (120, 320) formed therein and further having a recess (118, 218) therein, build-up layers (150, 350, 850) over the stiffener material layer, and a die (370) attached over the build-up layers. The stiffener material layer and the build-up layers form a coreless substrate (100, 380, 910, 920) of the package. The coreless substrate has a surface (381), and the die covers less than all of the surface of the coreless substrate such that the surface has at least one exposed region (382).
摘要翻译：无芯衬底包括其中形成有电镀通孔（120,320）的加强材料（110,210,620），加强材料上方的电绝缘材料（130,230,830），以及导电材料（140， 240，840）。在相同或另一个实施例中，一种用于微电子器件的封装包括：加强材料层（115,215,615），其具有在其中形成的电镀通孔（120,320），并且还具有其中的凹部（118,218），积聚加强材料层上的层（150,350,850）以及附着在积层上的模具（370）。加强材料层和堆积层形成封装的无芯衬底（100,380,910,920）。无芯基板具有表面（381），并且模具覆盖小于无芯基板的所有表面，使得表面具有至少一个暴露区域（382）。

5. 发明申请

US20090218123A1 MULTILAYER INTERCONNECTION BOARD 有权
标题翻译：多层互连板
公开(公告)号：US20090218123A1
公开(公告)日：2009-09-03
申请号：US12466604
申请日：2009-05-15
申请人： Issey Yamamoto , Akihiko Kamada
发明人： Issey Yamamoto , Akihiko Kamada
IPC分类号： H01R12/06
CPC分类号： H05K1/0271 , H05K1/0306 , H05K3/12 , H05K3/4611 , H05K3/4629 , H05K2201/0269 , H05K2201/09781
摘要： A multilayer interconnection board includes a plurality of laminated ceramic layers. Wiring electrodes are disposed on principal surfaces of the ceramic layers, and dot patterns are arranged around the wiring electrodes. The dot patterns are arranged such that the density distribution thereof is varied such that the ratio of the presence of the dot patterns in the vicinity of the wiring electrode is relatively large and the ratio of the presence is reduced as the distance from the wiring electrode increases.
摘要翻译：多层互连板包括多个层压陶瓷层。布线电极设置在陶瓷层的主表面上，并且点阵图形布置在布线电极周围。点图案被布置为使得其密度分布变化，使得布线电极附近的点图案的存在比例相对较大，并且随着与布线电极的距离增加而存在的比例降低。

6. 发明授权

US06969152B2 Printing apparatus and electronic device having line contact structure 失效
标题翻译：具有线接触结构的印刷设备和电子设备
公开(公告)号：US06969152B2
公开(公告)日：2005-11-29
申请号：US10713352
申请日：2003-11-17
申请人： Dong-sun Kim
发明人： Dong-sun Kim
IPC分类号： B41J29/00 , B41J2/175 , B41J2/01 , B41J2/14 , H01R12/00 , H01R12/06
CPC分类号： B41J2/1753
摘要： A contact structure for transferring an electrical signal from a main body to a print head, particularly a printing apparatus having a line contact structure, is provided. The printing apparatus comprises an electrical connecting portion formed at an end of the cable; a plurality of contact points formed at the electrical connecting portion, each in a form of a hollow projection so as to correspond to a circuit portion of the print head and having a hole form at an apex of the projection; a fixing portion for fixing the electrical connecting portion to the main body; and an elastic member interposed between the electrical connecting portion and the fixing portion and having a plurality of protruding portions corresponding to the plurality of contact points, wherein the elastic member presses the electrical connecting portion so that the plurality of contact points are in line contact with the circuit portion of the print head when the print head is mounted in the main body.
摘要翻译：提供了用于将电信号从主体传送到打印头的接触结构，特别是具有线接触结构的打印设备。打印装置包括形成在电缆端部的电连接部分。形成在所述电连接部分处的多个接触点，每个接触点为中空突起的形式，以便对应于所述打印头的电路部分并且在所述突起的顶点处具有孔形式; 用于将电连接部分固定到主体的固定部分; 以及弹性构件，其插入在所述电连接部和所述固定部之间，并且具有与所述多个接触点对应的多个突出部，其中，所述弹性构件按压所述电连接部，使得所述多个接触点与当打印头安装在主体中时打印头的电路部分。

7. 发明申请

US20050009415A1 Cable and connector assemblies and methods of making same 审中-公开
标题翻译：电缆和连接器组件及其制造方法
公开(公告)号：US20050009415A1
公开(公告)日：2005-01-13
申请号：US10855070
申请日：2004-05-26
申请人： Morgan Johnson
发明人： Morgan Johnson
IPC分类号： H01R12/06 , H01R12/16 , H01R13/514 , H01R12/24 , H01R4/02
CPC分类号： H01R12/523 , H01R12/7082 , H01R13/514 , H01R13/6588 , H01R13/6598
摘要： Cable and connector assemblies in which one or more conductors have transmission line characteristics, and methods of producing such assemblies include providing a body with openings therethrough, providing a conductive ground shield, at least at the inner surface of the openings, disposing at least one conductor through at least one opening, and disposing mechanical support means for positioning the at least one conductor within the at least one opening. The body may include structures for attaching the mechanical support means thereto. The body may be highly conductive so as to form the ground shield, or conductive inserts, or conductive coatings may be provided along the inner surface of the openings. The body may be formed from a unitary piece, or may be formed from a stack of slices. Alternatively, the body may be formed from a printed circuit board having plated-through holes. The body may act as a heat sink.
摘要翻译：其中一个或多个导体具有传输线特征的电缆和连接器组件以及制造这种组件的方法包括提供主体穿过其中的开口，至少在开口的内表面处提供导电接地屏蔽，设置至少一个导体通过至少一个开口，以及布置用于将所述至少一个导体定位在所述至少一个开口内的机械支撑装置。主体可以包括用于将机械支撑装置附接到其上的结构。主体可以是高导电性的，以便形成接地屏蔽，或者可以沿着开口的内表面设置导电插入件或导电涂层。主体可以由整体构成，或者可以由一叠切片形成。或者，主体可以由具有电镀通孔的印刷电路板形成。身体可以作为散热器。

8. 发明申请

US20090166078A1 MULTI-LAYERED WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：多层布线基板及其制造方法
公开(公告)号：US20090166078A1
公开(公告)日：2009-07-02
申请号：US12343844
申请日：2008-12-24
申请人： Isao MATSUI
发明人： Isao MATSUI
IPC分类号： H01R12/06 , H01R43/00
CPC分类号： H01R12/721 , H05K1/0231 , H05K1/184 , H05K3/0052 , H05K3/403 , H05K2201/09181 , H05K2201/0919 , H05K2201/10189 , H05K2201/10446 , H05K2201/10636 , Y02P70/611 , Y10T29/49117
摘要： In a multi-layered wiring substrate according to an exemplary aspect of the present invention, a conductor formed in an edge face area functions as a pad for mounting a connector.
摘要翻译：在根据本发明的示例性方面的多层布线基板中，形成在边缘区域中的导体用作用于安装连接器的垫。

9. 发明申请

US20090004891A1 TEST ACCESS FOR HIGH DENSITY INTERCONNECT BOARDS 审中-公开
标题翻译：高密度互连板的测试访问
公开(公告)号：US20090004891A1
公开(公告)日：2009-01-01
申请号：US11772201
申请日：2007-06-30
申请人： James Grealish , John T. Sprietsma , William O. Alger
发明人： James Grealish , John T. Sprietsma , William O. Alger
IPC分类号： H01R12/06
CPC分类号： G01R1/0408 , G01R1/07378 , H01L2224/16225 , H01L2924/15184 , H01L2924/15192 , H05K1/0268 , H05K1/112 , H05K1/181 , H05K3/3457 , H05K3/4611 , H05K2203/1581
摘要： A novel HDI board that enables test probe access comprises a stack of insulating layers having a first surface and a second surface, wherein the first surface includes at least two devices and the second surface includes a test probe accessible solder bead. The two devices are electrically coupled by at least one metal interconnect formed within the plurality of insulating layers. The HDI board also includes a backside μVia electrically coupling the solder bead to the metal interconnect. Testing of the device may be carried out by way of the solder bead and the backside μVia.
摘要翻译：使得能够进行测试探针存取的新型HDI板包括具有第一表面和第二表面的绝缘层堆叠，其中第一表面包括至少两个器件，并且第二表面包括测试探针可接近的焊珠。两个器件通过在多个绝缘层内形成的至少一个金属互连电耦合。 HDI板还包括一个背面的muVia，使焊珠与金属互连电连接。器件的测试可以通过焊珠和背面muVia进行。

10. 发明申请

US20080236880A1 MOUNTING BOARD INCLUDING A FLAT-TYPE ELECTRICAL ELEMENT AND CAPABLE OF BEING REDUCED IN SIZE, AND LEAD-ATTACHED ELECTRIC ELEMENT THAT IS FLAT IN SHAPE AND HAS A LEAD BONDED TO EACH ELECTRODE FACE 有权
标题翻译：安装板包括一个扁平型电气元件，并且尺寸可以减小，并且导线附着的电气元件在形状上是平的，并且有一个引线绑定到每个电极面
公开(公告)号：US20080236880A1
公开(公告)日：2008-10-02
申请号：US12056854
申请日：2008-03-27
申请人： Hirotoshi OZAKI , Akiko MORIMOTO , Tetsuya YAMASHITA
发明人： Hirotoshi OZAKI , Akiko MORIMOTO , Tetsuya YAMASHITA
IPC分类号： H01R12/06 , H05K1/00
CPC分类号： H01R12/7082 , H05K1/182 , H05K3/3421 , H05K2201/09836 , H05K2201/10037 , H05K2201/10484 , H05K2201/10651 , H05K2201/10856 , H05K2203/0195 , H05K2203/082
摘要： A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.
摘要翻译：安装有引线的电气元件的引线附接电气元件和安装板都有助于减小安装板的尺寸并且便于返工。引线连接的电气元件由电气元件和两个引线构成。每个引线包括结合到电气元件的相应电极面的主要部分和相对于主要部分倾斜的弯曲部分。安装板由PC（印刷电路板）和带引线的电气元件构成。在PC板的表面上设置两个导电焊盘。引线连接的电气元件已经插入到PC板的孔中，并且附接到电气元件的引线的弯曲部分被接合到导电焊盘，使得电气元件通过引线悬挂在孔中。

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