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1. 发明授权

US09196969B2 Radiating element for antenna 有权
标题翻译：天线辐射元件
公开(公告)号：US09196969B2
公开(公告)日：2015-11-24
申请号：US13419140
申请日：2012-03-13
申请人： Zhonglin Wu , Lei Shi , Gang Cheng , Mulin Liu , Zhuofeng Gao
发明人： Zhonglin Wu , Lei Shi , Gang Cheng , Mulin Liu , Zhuofeng Gao
IPC分类号： H01Q21/26 , H01Q19/10 , H01Q1/24 , H01Q9/28
CPC分类号： H01Q21/26 , H01Q1/246 , H01Q9/285 , H01Q19/10
摘要： A radiating element includes a supporting element and a plurality of radiating units formed at one end of the supporting element. Each of the radiating units has a lower surface facing towards the supporting element and an upper surface facing away from the supporting element. The radiating element further includes a first and second dividing pieces symmetrically disposed on each of the radiating units. The radiating element also includes a loading element formed on the lower surface of each of the plurality of radiating units, wherein the loading element extends outward from the supporting element and along an edge of the radiating unit. Moreover, the radiating element includes an electrical connecting element for connecting the radiating units to a feeding cable, the electrical connecting element being lower than the upper surfaces of the radiating units.
摘要翻译：辐射元件包括支撑元件和形成在支撑元件的一端的多个辐射单元。每个辐射单元具有面向支撑元件的下表面和背离支撑元件的上表面。辐射元件还包括对称地设置在每个辐射单元上的第一和第二分割片。辐射元件还包括形成在多个辐射单元中的每一个的下表面上的加载元件，其中加载元件从支撑元件向外延伸并沿着辐射单元的边缘延伸。此外，辐射元件包括用于将辐射单元连接到馈电电缆的电连接元件，电连接元件低于辐射单元的上表面。

2. 发明申请

US20120235873A1 Radiating Element for Antenna 有权
标题翻译：天线辐射元件
公开(公告)号：US20120235873A1
公开(公告)日：2012-09-20
申请号：US13419140
申请日：2012-03-13
申请人： Zhonglin Wu , Lei Shi , Gang Cheng , Mulin Liu , Zhuofeng Gao
发明人： Zhonglin Wu , Lei Shi , Gang Cheng , Mulin Liu , Zhuofeng Gao
IPC分类号： H01Q1/38 , H01Q19/10
CPC分类号： H01Q21/26 , H01Q1/246 , H01Q9/285 , H01Q19/10
摘要： A radiating element includes a supporting element and a plurality of radiating units formed at one end of the supporting element. Each of the radiating units has a lower surface facing towards the supporting element and an upper surface facing away from the supporting element. The radiating element further includes a first and second dividing pieces symmetrically disposed on each of the radiating units. The radiating element also includes a loading element formed on the lower surface of each of the plurality of radiating units, wherein the loading element extends outward from the supporting element and along an edge of the radiating unit. Moreover, the radiating element includes an electrical connecting element for connecting the radiating units to a feeding cable, the electrical connecting element being lower than the upper surfaces of the radiating units.
摘要翻译：辐射元件包括支撑元件和形成在支撑元件的一端的多个辐射单元。每个辐射单元具有面向支撑元件的下表面和背离支撑元件的上表面。辐射元件还包括对称地设置在每个辐射单元上的第一和第二分割片。辐射元件还包括形成在多个辐射单元中的每一个的下表面上的加载元件，其中加载元件从支撑元件向外延伸并沿着辐射单元的边缘延伸。此外，辐射元件包括用于将辐射单元连接到馈电电缆的电连接元件，电连接元件低于辐射单元的上表面。

3. 发明申请

US20220411058A1 Penetrating High Wing Structure of Civil Aircraft with Blended-Wing-Body 有权
公开(公告)号：US20220411058A1
公开(公告)日：2022-12-29
申请号：US17385945
申请日：2021-07-27
申请人： Yongjie Zhang , Jingpiao Zhou , Lei Shi , Dong Li , Binqian Zhang
发明人： Yongjie Zhang , Jingpiao Zhou , Lei Shi , Dong Li , Binqian Zhang
IPC分类号： B64C39/10 , B64C3/18 , B64D11/00 , B64D9/00 , B64C1/14 , B64D27/02 , B64C5/06 , B64C3/10
摘要： The disclosure provides a penetrating high wing structure of civil aircraft with blended-wing-body, wherein the structure comprises a left wing, a right wing and a high wing penetrating central wing. The left wing and the right wing are symmetrically arranged and connected to two sides of the high wing penetrating central wing through fasteners respectively, and the high wing penetrating central wing is arranged on the top of the main body. The left wing and the right wing both comprise wing ribs and wing spars that are arranged in a crisscross way. The disclosure proposes a penetrating high wing structure, wherein the wing and the body are designed as a whole so that the wings will not damage the continuity of the internal space of the body, which improves the load transfer efficiency of the structure and reduces the fasteners used for connection, thus reducing the weight of the body.

4. 发明授权

US09625475B2 Indole and indoline derivatives and methods of use thereof 有权
公开(公告)号：US09625475B2
公开(公告)日：2017-04-18
申请号：US12727723
申请日：2010-03-19
申请人： Michael R. Schrimpf , Chih-Hung Lee , Tao Li , Gregory A. Gfesser , Kathleen H. Mortell , Ramin Faghih , Diana L. Nersesian , Kevin B. Sippy , William H. Bunnelle , Marc Scanio , Lei Shi , Murali Gopalakrishnan , Diana L. Donnelly-Roberts , Min Hu
发明人： Michael R. Schrimpf , Chih-Hung Lee , Tao Li , Gregory A. Gfesser , Kathleen H. Mortell , Ramin Faghih , Diana L. Nersesian , Kevin B. Sippy , William H. Bunnelle , Marc Scanio , Lei Shi , Murali Gopalakrishnan , Diana L. Donnelly-Roberts , Min Hu
IPC分类号： A61K31/55 , C07D487/00 , C07D491/00 , C07D498/00 , C07D513/00 , C07D515/00 , G01N33/68 , C07D471/18 , C07D487/10 , G01N33/50
CPC分类号： G01N33/6896 , C07D471/18 , C07D487/10 , G01N33/5058 , G01N2800/2814 , G01N2800/30
摘要： The present application relates to indole and indoline derivatives of formula (I), (II), (III), (IV), (V), or (VI) wherein a, R1, R2, R3, R4, R5, U, V, W, X, Y, and Z are as defined in the specification. The present application also relates to compositions comprising such compounds, and methods of treating disease conditions using such compounds and compositions, and methods for identifying such compounds.

5. 发明申请

US20170007034A1 MATTRESS CORE WITH STORAGE CAPABILITIES 审中-公开
标题翻译：具有存储能力的MATTRESS核心
公开(公告)号：US20170007034A1
公开(公告)日：2017-01-12
申请号：US14939504
申请日：2015-11-12
申请人： Lei Shi
发明人： Lei Shi
IPC分类号： A47C27/00 , A47G9/04 , A47G9/02
CPC分类号： A47C27/00 , A47C17/86 , A47C31/105 , A47G9/0238 , A47G9/04
摘要： A mattress core with storage capabilities including a mattress core, an open slot located in the side of the mattress core, and an inner supporting frame inside said open slot. A drawer can be placed inside the inner supporting frame of the opening slot. It further includes an outer cover wherein said outer cover further includes a top cover, a surrounding side cover, and said top cover and side cover enclose by a zipper or a plurality of snap buttons.
摘要翻译：一种具有存储能力的床垫芯，包括床垫芯，位于床垫芯侧面的开口槽和位于所述开口槽内的内支撑框架。抽屉可以放置在开口槽的内支撑框架内。其还包括外盖，其中所述外盖还包括顶盖，周围侧盖，并且所述顶盖和侧盖通过拉链或多个卡扣包围。

6. 发明授权

US09362173B2 Method for chip package 有权
标题翻译：芯片封装方法
公开(公告)号：US09362173B2
公开(公告)日：2016-06-07
申请号：US13883399
申请日：2011-10-18
申请人： Lei Shi , Yujuan Tao , Guohua Gao , Naomi Masuda , Koichi Meguro
发明人： Lei Shi , Yujuan Tao , Guohua Gao , Naomi Masuda , Koichi Meguro
IPC分类号： H01L21/78 , H01L21/56 , H01L23/31 , H01L23/00
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3114 , H01L23/3178 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/94 , H01L2224/03462 , H01L2224/0347 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/05644 , H01L2224/05655 , H01L2224/11849 , H01L2224/131 , H01L2224/94 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15788 , H01L2224/13611 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2224/13099 , H01L2224/05099 , H01L2224/05599 , H01L2224/05552 , H01L2924/00
摘要： Provided is a method for chip packaging, including the steps of: providing a semi-packaged wafer which has a cutting trail and a metal bonding pad of the chip; forming on the metal bonding pad a sub-ball metal electrode, using a selective formation process; forming a protective layer on the wafer in a region not including the sub-ball metal electrode, with the protective layer covering the cutting trail; forming a solder ball on the sub-ball metal electrode; dicing the wafer along the cutting trail. The present invention can prevent metal in the cutting trail from being affected during the production of the sub-ball metal electrode, and protect the lateral sides of a discrete chip after cutting. The process flow thereof is simple, and enhances the efficiency of the packaging as well as its yield.
摘要翻译：提供了一种芯片封装的方法，包括以下步骤：提供具有切割轨迹的半封装晶片和芯片的金属焊盘; 使用选择性形成工艺在金属焊盘上形成子球金属电极; 在不包括子球金属电极的区域中的晶片上形成保护层，保护层覆盖切割轨迹; 在子球金属电极上形成焊球; 沿着切割线切割晶片。本发明可以防止在制造子球金属电极期间切割轨迹中的金属受到影响，并且在切割之后保护离散芯片的侧面。其工艺流程简单，并且提高了包装的效率以及其收率。

7. 发明授权

US09099448B2 Three-dimensional system-level packaging methods and structures 有权
标题翻译：三维系统级封装方法和结构
公开(公告)号：US09099448B2
公开(公告)日：2015-08-04
申请号：US13984967
申请日：2012-03-22
申请人： Yujuan Tao , Lei Shi , Honghui Wang
发明人： Yujuan Tao , Lei Shi , Honghui Wang
IPC分类号： H01L23/48 , H01L23/52 , H01L23/02 , H01L23/485 , H01L25/00 , H01L21/58 , H01L23/538 , H05K1/18
CPC分类号： H01L23/485 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/80 , H01L24/82 , H01L25/00 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/24195 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/00013 , H01L2924/014 , H01L2924/19105 , H05K1/185 , H01L2924/00014 , H01L2224/29099 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29599
摘要： A 3D system-level packaging method includes providing a packaging substrate, forming a glue layer on the substrate, and attaching a first chip layer at an opposite side of a functional surface of the first chip layer on the packaging substrate through the glue layer. The method also includes forming a first sealant layer on the packaging substrate at a same side attached with the first chip layer and exposing bonding pads of the first chip layer. The method also includes forming first vias in the first sealant layer, forming first vertical metal wiring in the first vias, and forming a first horizontal wiring layer on the sealant layer interconnecting the first chip layer and the first vertical metal wiring. Further, the method includes forming a plurality of package layers on the first sealant layer, and each of the plurality of package layers includes a chip layer, a sealant layer covering the chip layer, and vertical metal wiring and a horizontal wiring layer interconnecting adjacent package layers.
摘要翻译： 3D系统级封装方法包括提供封装衬底，在衬底上形成胶层，并通过胶层在封装衬底上的第一芯片层的功能表面的相对侧附着第一芯片层。该方法还包括在与第一芯片层相连的同一侧在封装衬底上形成第一密封剂层并且暴露第一芯片层的焊盘。该方法还包括在第一密封剂层中形成第一通孔，在第一通孔中形成第一垂直金属布线，以及在互连第一芯片层和第一垂直金属布线的密封剂层上形成第一水平布线层。此外，该方法包括在第一密封剂层上形成多个封装层，并且多个封装层中的每一个包括芯片层，覆盖芯片层的密封剂层和垂直金属布线以及互连相邻封装的水平布线层层。

8. 发明授权

US09093030B2 Driving apparatus, OLED panel and method for driving OLED panel 有权
标题翻译：驱动装置，OLED面板和驱动OLED面板的方法
公开(公告)号：US09093030B2
公开(公告)日：2015-07-28
申请号：US13486051
申请日：2012-06-01
申请人： Yinan Liang , Zhanjie Ma , Chunping Long , Jun Cheng , Lei Shi , Dongfang Wang , Chunsheng Jiang , Zheng Liu
发明人： Yinan Liang , Zhanjie Ma , Chunping Long , Jun Cheng , Lei Shi , Dongfang Wang , Chunsheng Jiang , Zheng Liu
IPC分类号： G09G5/00 , G09G3/32
CPC分类号： G09G3/3283 , G09G2310/0248
摘要： The present disclosure relates to a driving apparatus, an OLED (Organic Light-Emitting Diode) panel, and a method for driving the OLED panel. The driving apparatus can be integrated on a substrate of pixel circuits and is capable of providing fast and stable current driving. The driving apparatus includes a switching module for selecting a voltage signal according to a received clock signal; a conversion module for converting the voltage signal into a current signal; and an output module for outputting the voltage signal or the converted current signal to drive a pixel circuit array, wherein the switching module is connected to the conversion module and the output module, and the conversion module is connected to the switching module and the output module.
摘要翻译：本发明涉及驱动装置，OLED（有机发光二极管）面板以及驱动OLED面板的方法。驱动装置可以集成在像素电路的基板上，并且能够提供快速和稳定的电流驱动。驱动装置包括：切换模块，用于根据所接收的时钟信号选择电压信号; 用于将电压信号转换为电流信号的转换模块; 以及输出模块，用于输出电压信号或转换的电流信号以驱动像素电路阵列，其中切换模块连接到转换模块和输出模块，并且转换模块连接到开关模块和输出模块。

9. 发明授权

US08987878B2 Substrateless power device packages 有权
标题翻译：无层无源功率器件封装
公开(公告)号：US08987878B2
公开(公告)日：2015-03-24
申请号：US12916086
申请日：2010-10-29
申请人： Tao Feng , Zhiqiang Niu , Yuping Gong , Ruisheng Wu , Ping Huang , Lei Shi , Yueh-Se Ho
发明人： Tao Feng , Zhiqiang Niu , Yuping Gong , Ruisheng Wu , Ping Huang , Lei Shi , Yueh-Se Ho
IPC分类号： H01L23/495 , H01L21/683 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/00 , H01L29/06
CPC分类号： H01L21/6836 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L21/76897 , H01L21/78 , H01L23/3114 , H01L23/481 , H01L23/495 , H01L23/49524 , H01L23/49537 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/73 , H01L24/94 , H01L25/50 , H01L27/088 , H01L29/0657 , H01L29/7827 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68381 , H01L2224/0401 , H01L2224/04026 , H01L2224/04034 , H01L2224/05009 , H01L2224/05025 , H01L2224/051 , H01L2224/05139 , H01L2224/05155 , H01L2224/05166 , H01L2224/05571 , H01L2224/0603 , H01L2224/0616 , H01L2224/06181 , H01L2224/1184 , H01L2224/16245 , H01L2224/291 , H01L2224/32245 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/73253 , H01L2224/73255 , H01L2224/73263 , H01L2224/83801 , H01L2224/84801 , H01L2224/94 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10155 , H01L2924/10253 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/2064 , H01L2924/3511 , H01L2224/03 , H01L2924/00 , H01L2224/05552 , H01L2924/00012 , H01L2224/37099
摘要： A substrate-less composite power semiconductor device may include a thin substrate and a top metal layer located on a top surface of the substrate. A total thickness of the substrate and the epitaxial layer may be less than 25 microns. Solder bumps are formed on top of the top metal layer and molding compound surrounds the solder bumps and leaves the solder bumps at least partly exposed.
摘要翻译：无基底复合功率半导体器件可以包括薄衬底和位于衬底顶表面上的顶金属层。衬底和外延层的总厚度可以小于25微米。焊料凸块形成在顶部金属层的顶部，并且模塑料围绕焊料凸起并且使焊料凸块至少部分暴露。

10. 发明授权

US08883627B2 Method for chip packaging 有权
标题翻译：芯片封装方法
公开(公告)号：US08883627B2
公开(公告)日：2014-11-11
申请号：US13883231
申请日：2011-10-18
申请人： Lei Shi , Guohua Gao , Yujuan Tao , Naomi Masuda , Koichi Meguro
发明人： Lei Shi , Guohua Gao , Yujuan Tao , Naomi Masuda , Koichi Meguro
IPC分类号： H01L21/44 , H01L21/768 , H01L21/78 , H01L23/31 , H01L21/56 , H01L23/00
CPC分类号： H01L21/76885 , H01L21/561 , H01L21/78 , H01L23/3114 , H01L23/3178 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03462 , H01L2224/0347 , H01L2224/0401 , H01L2224/05022 , H01L2224/05572 , H01L2224/05644 , H01L2224/05655 , H01L2224/1147 , H01L2224/13111 , H01L2224/94 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2224/11 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： Provided is a method for chip packaging, including the steps of: providing a semi-packaged wafer which has a cutting trail and a metal bonding pad of the chip; forming a first protective layer on the cutting trail; forming on the metal bonding pad a sub-ball metal electrode; forming a solder ball on the sub-ball metal electrode; dicing the wafer along the cutting trail. The first protective layer according to the present invention can prevent the metal in the cutting trail from being separated by electroplating, and protect the lateral sides of a discrete chip after cutting. The process flow thereof is simple, and enhances the efficiency of the packaging as well as its yield.
摘要翻译：提供了一种芯片封装的方法，包括以下步骤：提供具有切割轨迹的半封装晶片和芯片的金属焊盘; 在切割道上形成第一保护层; 在金属焊盘上形成子球金属电极; 在子球金属电极上形成焊球; 沿着切割线切割晶片。根据本发明的第一保护层可以防止切割轨迹中的金属通过电镀分离，并且在切割之后保护离散芯片的侧面。其工艺流程简单，并且提高了包装的效率以及其收率。

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