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1. 发明授权

US5657203A Electronic device having a plurality of circuit boards arranged therein 失效
标题翻译：具有布置在其中的多个电路板的电子设备
公开(公告)号：US5657203A
公开(公告)日：1997-08-12
申请号：US400258
申请日：1995-03-06
申请人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
发明人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
IPC分类号： H01L25/00 , H01L21/48 , H01L23/498 , H01L23/50 , H01L25/04 , H01L25/07 , H01L25/16 , H01L25/18 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H05K5/0043 , H05K5/0056 , H05K5/064 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

2. 发明授权

US5646827A Electronic device having a plurality of circuit boards arranged therein 失效
公开(公告)号：US5646827A
公开(公告)日：1997-07-08
申请号：US400241
申请日：1995-03-06
申请人： Yasunobu Hirao , Takashi Nagasaka , Yuji Motoyama , Yukihiro Maeda
发明人： Yasunobu Hirao , Takashi Nagasaka , Yuji Motoyama , Yukihiro Maeda
IPC分类号： H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K5/064 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K5/0043 , H05K5/0056 , H01L2224/48091 , H01L2924/13091 , H01L2924/1627 , H05K1/144
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

3. 发明授权

US5408383A Container for electronic devices having a plurality of circuit boards 失效
标题翻译：具有多个电路板的电子设备的容器
公开(公告)号：US5408383A
公开(公告)日：1995-04-18
申请号：US118785
申请日：1993-09-10
申请人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
发明人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
IPC分类号： H01L21/48 , H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K5/064 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K1/144 , H05K5/0043 , H05K5/0056 , H05K5/0069 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

4. 发明授权

US5586388A Method for producing multi-board electronic device 失效
公开(公告)号：US5586388A
公开(公告)日：1996-12-24
申请号：US400243
申请日：1995-03-06
申请人： Yasunobu Hirao , Yuji Motoyama , Takashi Nagasaka , Hidekazu Katsuyama
发明人： Yasunobu Hirao , Yuji Motoyama , Takashi Nagasaka , Hidekazu Katsuyama
IPC分类号： H01L21/48 , H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K3/36
CPC分类号： H05K5/064 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K1/144 , H05K5/0043 , H05K5/0056 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , Y10T29/49126
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

5. 发明授权

US5586389A Method for producing multi-board electronic device 失效
标题翻译：制造多板电子设备的方法
公开(公告)号：US5586389A
公开(公告)日：1996-12-24
申请号：US400242
申请日：1995-03-06
申请人： Yasunobu Hirao , Makoto Koyama , Yuji Motoyama
发明人： Yasunobu Hirao , Makoto Koyama , Yuji Motoyama
IPC分类号： H01L25/00 , H01L21/48 , H01L23/498 , H01L23/50 , H01L25/16 , H05K1/14 , H05K5/00 , H05K3/30 , H01R43/24 , H05K3/36
CPC分类号： H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K1/144 , H05K5/0043 , H05K5/0056 , H05K5/064 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , Y10T29/49121 , Y10T29/49126 , Y10T29/49146 , Y10T29/49158
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

6. 发明申请

US20090244017A1 Haptic tracking remote control for driver information center system 有权
标题翻译：触觉跟踪遥控器用于驾驶员信息中心系统
公开(公告)号：US20090244017A1
公开(公告)日：2009-10-01
申请号：US12079871
申请日：2008-03-28
申请人： Silviu Pala , Yuji Motoyama
发明人： Silviu Pala , Yuji Motoyama
IPC分类号： G06F3/041
CPC分类号： B60K37/06 , B60K35/00 , B60K2350/1024 , B60K2350/1028 , G06F3/016
摘要： A control interface system for a driver of a vehicle comprises a touchscreen, a control module, and a display. The touchscreen is located proximate to the driver of the vehicle and upon driver interaction therewith is operable to generate a sensor signal. The control module is adapted to receive the sensor signal from the touchscreen and is operable to initiate control of a vehicle function and to generate a haptic feedback signal in response thereto. The touchscreen is adapted to receive the haptic feedback signal from the control module and is operable to provide haptic feedback to the driver of the vehicle in response thereto. The display is embedded in an instrument panel of the vehicle and provides an indicia of the vehicle function controlled by the touchscreen and of driver interaction therewith.
摘要翻译：用于车辆驾驶员的控制接口系统包括触摸屏，控制模块和显示器。触摸屏位于车辆的驾驶员附近，并且当驾驶员与其相互作用时可操作以产生传感器信号。控制模块适于从触摸屏接收传感器信号，并且可操作以启动对车辆功能的控制并响应于此产生触觉反馈信号。触摸屏适于从控制模块接收触觉反馈信号，并且可操作以响应于此向车辆的驾驶员提供触觉反馈。显示器嵌入在车辆的仪表板中，并提供由触摸屏控制的车辆功能的标记以及驾驶员与其的相互作用。

7. 发明授权

US09056549B2 Haptic tracking remote control for driver information center system 有权
公开(公告)号：US09056549B2
公开(公告)日：2015-06-16
申请号：US12079871
申请日：2008-03-28
申请人： Silviu Pala , Yuji Motoyama
发明人： Silviu Pala , Yuji Motoyama
IPC分类号： G06F3/041 , B60K37/06 , B60K35/00 , G06F3/01
CPC分类号： B60K37/06 , B60K35/00 , B60K2350/1024 , B60K2350/1028 , G06F3/016
摘要： A control interface system for a driver of a vehicle comprises a touchscreen, a control module, and a display. The touchscreen is located proximate to the driver of the vehicle and upon driver interaction therewith is operable to generate a sensor signal. The control module is adapted to receive the sensor signal from the touchscreen and is operable to initiate control of a vehicle function and to generate a haptic feedback signal in response thereto. The touchscreen is adapted to receive the haptic feedback signal from the control module and is operable to provide haptic feedback to the driver of the vehicle in response thereto. The display is embedded in an instrument panel of the vehicle and provides an indicia of the vehicle function controlled by the touchscreen and of driver interaction therewith.

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