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1. 发明申请

US20090085187A1 LOADING MECHANISM FOR BARE DIE PACKAGES AND LGA SOCKET 审中-公开
标题翻译：用于BARE DIE包装和LGA插座的装载机构
公开(公告)号：US20090085187A1
公开(公告)日：2009-04-02
申请号：US11864819
申请日：2007-09-28
申请人： Ward Scott , Luke Garner , Ioan Sauciuc
发明人： Ward Scott , Luke Garner , Ioan Sauciuc
IPC分类号： H01L23/48 , H01R12/00 , H01L21/00
CPC分类号： H01L23/42 , H01L2224/16
摘要： Methods and associated apparatus of reducing stress in a package Those methods may comprise providing a package comprising a die coupled to a substrate, wherein the substrate is disposed on an LGA socket, and wherein a TIM is disposed on a top surface of the die, and then attaching a thermal solution to the TIM, wherein at least one standoff is attached between the thermal solution and the substrate.
摘要翻译：降低包装应力的方法和相关设备这些方法可以包括提供包括连接到基底的管芯的封装，其中衬底设置在LGA插座上，并且其中TIM设置在管芯的顶表面上，以及然后将热溶液附着到TIM，其中至少一个间隔件附接在热溶液和基底之间。

2. 发明授权

US07939945B2 Electrically conductive fluid interconnects for integrated circuit devices 有权
标题翻译：用于集成电路器件的导电流体互连
公开(公告)号：US07939945B2
公开(公告)日：2011-05-10
申请号：US12113024
申请日：2008-04-30
申请人： Ioan Sauciuc , Ward Scott
发明人： Ioan Sauciuc , Ward Scott
IPC分类号： H01L29/40
CPC分类号： H05K3/321 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/09472 , H05K2201/10734
摘要： Disclosed are embodiments of an electrically conductive fluid interconnect for coupling an integrated circuit (IC) device to a substrate. The IC device may be coupled to the substrate in a socketless manner or using a socket. The electrically conductive fluid interconnect may include, for example, a metal, an electrically conductive paste, or an electrically conductive polymer material. The fluid may be in a liquid or paste state over at least part of an operating temperature range of the IC device, and in other embodiments the fluid may be in the liquid or paste state at room temperature. Other embodiments are described and claimed.
摘要翻译：公开了用于将集成电路（IC）器件耦合到衬底的导电流体互连件的实施例。 IC器件可以以无插槽的方式或使用插座耦合到基板。导电流体互连可以包括例如金属，导电膏或导电聚合物材料。流体可以在IC器件的至少一部分工作温度范围内处于液体或糊状态，并且在其它实施例中，流体可以在室温下处于液体或糊状态。描述和要求保护其他实施例。

3. 发明授权

US07499278B2 Method and apparatus for dissipating heat from an electronic device 有权
标题翻译：从电子设备散热的方法和装置
公开(公告)号：US07499278B2
公开(公告)日：2009-03-03
申请号：US11229227
申请日：2005-09-16
申请人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
发明人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0241 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator. The evaporator is then able to evaporate the liquid coolant and remove thermal energy from the processor.
摘要翻译：本发明的方法和装置从电子装置散发热量，为高发热电子器件提供有效且普遍应用的热解决方案。该装置包括蒸发器，冷凝器，加热器和导管。蒸发器，冷凝器和管道限定了具有部分填充有液体冷却剂的内部容积的封闭系统。蒸发器热连接到诸如处理器的电子设备，并且通过蒸发液体冷却剂来从处理器去除热能。当设备被定向成使得没有液体冷却剂与蒸发器接触时，加热器向冷却剂施加热能直到冷却剂开始沸腾。沸腾液体冷却剂会在液体冷却剂内形成气泡。通过沸腾产生的气泡的体积提高了封闭系统内的液体冷却剂的水平，直到液体冷却剂与蒸发器接触。蒸发器然后能够蒸发液体冷却剂并从处理器去除热能。

4. 发明授权

US07510418B1 Loading mechanisms for integrated circuit (IC) packages 有权
标题翻译：集成电路（IC）封装的装载机制
公开(公告)号：US07510418B1
公开(公告)日：2009-03-31
申请号：US11931805
申请日：2007-10-31
申请人： Ward Scott , Hong Xie , Ioan Sauciuc
发明人： Ward Scott , Hong Xie , Ioan Sauciuc
IPC分类号： H01R13/62
CPC分类号： H01L23/4093 , H01L2224/16 , H01L2224/73204 , H01R12/714 , H01R12/88
摘要： Disclosed is a socket assembly comprising a retention mechanism, a circuit board, an IC socket, a heat sink unit and a loading mechanism. The retention mechanism includes a support plate, on which the circuit board, the IC socket comprising die and package, and the heat sink unit are stacked respectively. The retention mechanism further includes a plurality of standoffs perpendicular to the support plate and include a pair of latches at different heights. The loading mechanism includes a loading plate configured on end portions of the standoffs and a pair of downwardly extending clips that are capable of engaging to the latches on the both standoffs. Correspondingly, the circuit board, the IC socket and the heat sink unit are sandwiched between the loading plate and the support plate. The heights of the pair of latches on the standoffs are based on the die and package in the IC socket.
摘要翻译：公开了一种插座组件，其包括保持机构，电路板，IC插座，散热器单元和装载机构。保持机构包括支撑板，电路板，包含芯片和封装的IC插座和散热单元分别堆叠在支撑板上。保持机构还包括垂直于支撑板的多个支座，并且包括在不同高度处的一对闩锁。装载机构包括配置在支座的端部上的装载板和能够与两个支座上的闩锁接合的一对向下延伸的夹子。相应地，电路板，IC插座和散热单元夹在装载板和支撑板之间。支架上的这对闩锁的高度基于IC插座中的裸片和封装。

5. 发明申请

US20090273083A1 ELECTRICALLY CONDUCTIVE FLUID INTERCONNECTS FOR INTEGRATED CIRCUIT DEVICES 有权
标题翻译：用于集成电路设备的电气导电流体互连
公开(公告)号：US20090273083A1
公开(公告)日：2009-11-05
申请号：US12113024
申请日：2008-04-30
申请人： Ioan Sauciuc , Ward Scott
发明人： Ioan Sauciuc , Ward Scott
IPC分类号： H01L23/50 , H01L21/77
CPC分类号： H05K3/321 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/09472 , H05K2201/10734
摘要： Disclosed are embodiments of an electrically conductive fluid interconnect for coupling an integrated circuit (IC) device to a substrate. The IC device may be coupled to the substrate in a socketless manner or using a socket. The electrically conductive fluid interconnect may include, for example, a metal, an electrically conductive paste, or an electrically conductive polymer material. The fluid may be in a liquid or paste state over at least part of an operating temperature range of the IC device, and in other embodiments the fluid may be in the liquid or paste state at room temperature. Other embodiments are described and claimed.
摘要翻译：公开了用于将集成电路（IC）器件耦合到衬底的导电流体互连件的实施例。 IC器件可以以无插槽的方式或使用插座耦合到基板。导电流体互连可以包括例如金属，导电膏或导电聚合物材料。流体可以在IC器件的至少一部分工作温度范围内处于液体或糊状态，并且在其它实施例中，流体可以在室温下处于液体或糊状态。描述和要求保护其他实施例。

6. 发明申请

US20060005948A1 Method and apparatus for dissipating heat from an electronic device 有权
公开(公告)号：US20060005948A1
公开(公告)日：2006-01-12
申请号：US11229227
申请日：2005-09-16
申请人： Ioan Sauciuc , Ward Scott , Gregory Chrysler
发明人： Ioan Sauciuc , Ward Scott , Gregory Chrysler
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0241 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator. The evaporator is then able to evaporate the liquid coolant and remove thermal energy from the processor.

7. 发明授权

US06971442B2 Method and apparatus for dissipating heat from an electronic device 失效
标题翻译：从电子设备散热的方法和装置
公开(公告)号：US06971442B2
公开(公告)日：2005-12-06
申请号：US09897793
申请日：2001-06-29
申请人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
发明人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
IPC分类号： F28D15/02 , F28D15/06 , H01L23/427 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0241 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator. The evaporator is then able to evaporate the liquid coolant and remove thermal energy from the processor.
摘要翻译：本发明的方法和装置从电子装置散发热量，为高发热电子器件提供有效且普遍应用的热解决方案。该装置包括蒸发器，冷凝器，加热器和导管。蒸发器，冷凝器和管道限定了具有部分填充有液体冷却剂的内部容积的封闭系统。蒸发器热连接到诸如处理器的电子设备，并且通过蒸发液体冷却剂来从处理器去除热能。当设备被定向成使得没有液体冷却剂与蒸发器接触时，加热器向冷却剂施加热能直到冷却剂开始沸腾。沸腾液体冷却剂会在液体冷却剂内形成气泡。通过沸腾产生的气泡的体积提高了封闭系统内的液体冷却剂的水平，直到液体冷却剂与蒸发器接触。蒸发器然后能够蒸发液体冷却剂并从处理器去除热能。

8. 发明授权

US4609265A Rearview mirror actuating device 失效
标题翻译：后视镜驱动装置
公开(公告)号：US4609265A
公开(公告)日：1986-09-02
申请号：US685406
申请日：1984-12-24
申请人： Clyde M. McKee , Ward Scott , Henry A. Warren , Dennis G. Scott
发明人： Clyde M. McKee , Ward Scott , Henry A. Warren , Dennis G. Scott
IPC分类号： B60R1/02 , G02B7/182 , G02B7/18
CPC分类号： B60R1/025 , G02B7/1827
摘要： An actuating device for automatically controlling the position of a movably mounted vehicle mirror comprises a motor controlled by switches for selectively actuating the motor in response to angular displacement of a trailer with respect to the vehicle. The switches are actuated in response to movement of the trailer and responsively close a circuit connecting a power source to the motor. Preferably, the switching means can include means for disconnecting the power source after a predetermined rotation of the motor in order to avoid excess energy use. Preferably, the disconnecting means comprises a plurality of switches arranged to contact lobes of a rotating cam at predetermined rotational positions of the cam. The cam can be concentrically secured to the rotor shaft or can be connected to the rotor shaft by a lever mechanism in order to form a crank which translates the rotor movement to linear displacement on a mirror positioning member.
摘要翻译：用于自动控制可移动安装的车辆后视镜的位置的致动装置包括由开关控制的电动机，用于响应于拖车相对于车辆的角位移而选择性地启动电动机。开关响应于拖车的移动被致动并且响应地闭合将电源连接到电动机的电路。优选地，开关装置可以包括用于在电动机的预定旋转之后断开电源的装置，以避免过多的能量使用。优选地，断开装置包括多个开关，其布置成在凸轮的预定旋转位置处接触旋转凸轮的凸角。凸轮可以同心地固定到转子轴上，或者可以通过杠杆机构连接到转子轴，以便形成将转子运动转换成反射镜定位部件上的线性位移的曲柄。

9. 发明授权

US3969952A Mirror actuator 失效
标题翻译：镜面执行器
公开(公告)号：US3969952A
公开(公告)日：1976-07-20
申请号：US526794
申请日：1974-11-25
申请人： Clyde M. McKee , Ward Scott
发明人： Clyde M. McKee , Ward Scott
IPC分类号： B60R1/06 , G05G1/04 , G05G7/02 , G05G1/00
CPC分类号： B60R1/061 , G05G1/04 , G05G7/02 , Y10T74/20432
摘要： A mirror actuator for trucks whereby the mirror may be adjusted from a position adjacent the seat of the driver to provide maximum visibility from the right hand mirror. A lever is positioned in the truck adjacent the seat of the driver so that the lever may be actuated by the driver while the driver remains in the driving position. The lever in turn controls a cable which is secured to the exterior right hand mirror assembly so that actuation of the lever will cause a corresponding pivotal movement of the right hand exterior mirror about its vertical center line.
摘要翻译：用于卡车的镜子致动器，其中可以从邻近驾驶员座椅的位置调整镜子，以提供从右手镜的最大可视性。杠杆位于驾驶员座椅附近的卡车中，使驾驶员在驾驶员处于驾驶状态时可以由驾驶员来操纵杠杆。杠杆又控制固定到右手右镜组件的电缆，使得杠杆的致动将引起右手外镜绕其垂直中心线的相应枢转运动。

10. 发明授权

US4229992A Mirror actuator 失效
标题翻译：镜面执行器
公开(公告)号：US4229992A
公开(公告)日：1980-10-28
申请号：US920113
申请日：1978-06-28
申请人： Clyde M. McKee , Ward Scott
发明人： Clyde M. McKee , Ward Scott
IPC分类号： B60R1/06 , F16C1/16 , F16C1/20 , F16C1/10
CPC分类号： F16C1/20 , B60R1/061 , F16C1/16 , Y10T74/20432
摘要： An assembly for converting mirrors commonly provided on trucks so that the mirror can be adjusted from a position adjacent the seat of the driver to provide maximum visibility from the right hand mirror. A clamp mounts to the mirror and connects to an actuator positioned in the truck adjacent the seat of the driver so that the mirror may be adjusted by the driver while the driver remains in the driving position.
摘要翻译：用于转换通常设置在卡车上的镜子的组件，使得可以从邻近驾驶员座椅的位置调整镜子，以提供从右手镜的最大可视性。夹具安装到反射镜上，并连接到位于驾驶员座椅附近的致动器上，使驱动器保持在驱动位置时，驾驶员可以调整反射镜。

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