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1. 发明申请

US20100307805A1 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：电路连接材料，连接结构及其制造方法
公开(公告)号：US20100307805A1
公开(公告)日：2010-12-09
申请号：US12740563
申请日：2008-08-29
申请人： Takashi Nakazawa , Motohiro Arifuku , Kazuyoshi Kojima , Nichiomi Mochizuki
发明人： Takashi Nakazawa , Motohiro Arifuku , Kazuyoshi Kojima , Nichiomi Mochizuki
IPC分类号： H05K1/02 , H05K3/30 , H01B1/12
CPC分类号： H05K3/323 , H01B1/22 , H01B1/24 , H01L24/29 , H01L24/83 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/16 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/8388 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/361 , H05K2203/122 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability.
摘要翻译：本发明的电路连接材料是用于在形成于第一基板主侧的第一电路电极的第一电路元件与形成在第一电路板的主侧上的第二电路电极之间连接的电路连接材料第二电路板，第一电路电极和第二电路电极彼此面对，电路连接材料包含产生自由基的固化剂，自由基聚合物质和含有仲硫醇基团的化合物。本发明的电路连接材料能够进行低温快速固化，并且具有优良的储存稳定性。

2. 发明授权

US08541688B2 Circuit connection material, circuit member connecting structure and method of connecting circuit member 有权
公开(公告)号：US08541688B2
公开(公告)日：2013-09-24
申请号：US12769925
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/03 , H05K1/11
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.

3. 发明申请

US20100212943A1 CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权
公开(公告)号：US20100212943A1
公开(公告)日：2010-08-26
申请号：US12769953
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/09 , C08L67/00 , H01B1/20 , H05K3/36
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.

4. 发明授权

US08558118B2 Circuit connection material, circuit member connecting structure and method of connecting circuit member 有权
标题翻译：电路连接材料，电路构件的连接结构和连接电路构件的方法
公开(公告)号：US08558118B2
公开(公告)日：2013-10-15
申请号：US12769953
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/03 , H05K1/11
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译：用于连接电路构件的电路连接材料，每个电路构件具有形成在基板的主表面上的基板和电路电极，包括响应于光或热而固化的粘合剂组合物和含有氨基甲酸酯基团和酯的有机化合物组。

5. 发明申请

US20100108365A1 CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权
公开(公告)号：US20100108365A1
公开(公告)日：2010-05-06
申请号：US12374628
申请日：2006-07-21
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/09 , C08K5/29 , C09J133/12
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.

6. 发明申请

US20100208444A1 CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权
标题翻译：电路连接材料，电路部件连接结构及连接电路部件的方法
公开(公告)号：US20100208444A1
公开(公告)日：2010-08-19
申请号：US12769925
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/11 , H01B1/20 , C09J175/04
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译：用于连接电路构件的电路连接材料，每个电路构件具有形成在基板的主表面上的基板和电路电极，包括响应于光或热而固化的粘合剂组合物和含有氨基甲酸酯基团和酯的有机化合物组。

7. 发明授权

US08497431B2 Circuit connection material, circuit member connecting structure and method of connecting circuit member 有权
公开(公告)号：US08497431B2
公开(公告)日：2013-07-30
申请号：US12374628
申请日：2006-07-21
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K3/36 , H05K1/09 , C08F2/46
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.

8. 发明申请

US20100243303A1 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER 审中-公开
标题翻译：电路连接材料，电路构件的连接结构以及制造电路连接结构的方法
公开(公告)号：US20100243303A1
公开(公告)日：2010-09-30
申请号：US12438485
申请日：2007-08-20
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Kouji Kobayashi , Takashi Nakazawa , Takashi Tatsuzawa , Katsuyuki Masuda , Takako Ejiri
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Kouji Kobayashi , Takashi Nakazawa , Takashi Tatsuzawa , Katsuyuki Masuda , Takako Ejiri
IPC分类号： H05K1/00 , H05K1/11 , H01R43/00 , H01B1/12
CPC分类号： H05K3/323 , C08G73/1039 , C08K9/02 , C08L2666/28 , C09J9/02 , C09J11/08 , C09J163/00 , C09J179/08 , H01B1/22 , H01B1/24 , H01B3/004 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/07811 , H01L2924/10253 , H01L2924/12044 , H01R4/04 , H05K3/361 , H05K2201/015 , H05K2203/122 , Y10T29/49117 , H01L2924/00
摘要： The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.
摘要翻译：本发明提供一种电路连接材料，用于电连接具有形成在第一电路基板的主表面上的第一电路电极的第一电路部件和形成在第二电路的主表面上的第二电路电极的第二电路部件基板，其中第一和第二电路电极彼此相对，包括含有有机化合物的粘合剂组分，其中粘合剂组分含有含硅化合物的0.10质量％以硅原子计，基于粘合剂组分的总量。

9. 发明申请

US20100254832A1 LIQUID SUPPLY DRIVE MECHANISM USING OSMOTIC PUMP AND MICROCHIP HAVING THE LIQUID SUPPLY DRIVE MECHANISM 有权
标题翻译：液体供应驱动机构使用OSMOTIC PUMP和具有液体供应驱动机构的MICROCHIP
公开(公告)号：US20100254832A1
公开(公告)日：2010-10-07
申请号：US12742078
申请日：2008-11-06
申请人： Takashi Nakazawa
发明人： Takashi Nakazawa
IPC分类号： F04B47/08
CPC分类号： B01L3/50273 , B01L2400/046 , B01L2400/0472 , F04B43/10
摘要： Provided is a microchip having a liquid supply mechanism which can supply a solution in a micro flow path with a simple construction in which a drive source utilizing an osmotic pressure is arranged within the microchip and which controls the osmotic pressure by a control unit utilizing temperature or the like, whereby it is possible to effect drive control such as intermittent driving and continuous driving at a fixed velocity. The liquid supply mechanism using osmotic pressure includes an osmotic pump utilizing the osmotic pressure of a liquid filling chambers separated from each other by a semipermeable membrane, and a unit which varies the osmotic pressure by changing a condition of the solution in at least one of the chambers on the basis of a timing of a pumping operation.
摘要翻译：本发明提供一种具有液体供给机构的微芯片，该液体供给机构能够以简单的结构向微流路供给溶液，在该结构中，使用渗透压的驱动源配置在微芯片内，利用温度控制单元控制渗透压，从而可以以固定速度实现间歇驱动和连续驱动等驱动控制。使用渗透压的液体供给机构包括使用通过半透膜隔开的液体填充室的渗透压的渗透泵，以及通过在至少一个中的至少一个中改变溶液的状态来改变渗透压的单元基于泵送操作的定时。

10. 发明授权

US07041472B2 Method for selectively collecting N-terminal peptide fragment of protein 失效
标题翻译：选择性收集蛋白质N-末端肽片段的方法
公开(公告)号：US07041472B2
公开(公告)日：2006-05-09
申请号：US10739111
申请日：2003-12-19
申请人： Shigemi Norioka , Norikazu Ueyama , Taka-aki Okamura , Takashi Nakazawa , Minoru Yamaguchi , Eiji Ando
发明人： Shigemi Norioka , Norikazu Ueyama , Taka-aki Okamura , Takashi Nakazawa , Minoru Yamaguchi , Eiji Ando
IPC分类号： C12P21/06
CPC分类号： C12P21/06
摘要： The present invention provides a method for selectively collecting the N-terminal peptide fragments of a protein of interest whether or not the protein of interest is modified on the N-terminus. A method for selectively collecting the N-terminal peptide fragment of a protein, comprising: a protection step (1) of protecting side chain-amino groups of amino acid residues containing side chain-amino groups of a protein of interest to obtain a protected protein protected on the side chain-amino groups; a fragmentation step (2) of cleaving the protected protein into one N-terminal peptide fragment (a) containing the N-terminus of the peptide of interest and one or more of peptide fragments (b) other than the N-terminal peptide fragment (a); and a separation step (3) of separating the N-terminal peptide fragment (a) from the other peptide fragments (b) by selectively eluting the N-terminal peptide fragment (a) based on the difference in their reactivity or affinity to substrate, wherein the selective elution is achieved either by allowing the other peptide fragments (b) to bind to the substrate while allowing the N-terminal peptide fragment (a) to elute, or by allowing the N-terminal peptide fragment (a) to bind to the substrate while allowing the other peptide fragments (b) to elute and subsequently eluting the bound N-terminal peptide fragment (a).
摘要翻译：本发明提供了一种用于选择性收集目的蛋白质的N-末端肽片段的方法，无论目的蛋白质是否在N末端被修饰。一种用于选择性收集蛋白质的N-末端肽片段的方法，包括：保护步骤（1）保护含有目的蛋白质的侧链 - 氨基的氨基酸残基的侧链氨基以获得受保护的蛋白质保护侧链氨基; 将保护的蛋白质切割成包含目标肽的N末端的一个N-末端肽片段（a）和除了N-末端肽片段之外的一个或多个肽片段（b）的片段化步骤（2）一个）; 以及通过基于它们对底物的反应性或亲和力的差异来选择性地洗脱N末端肽片段（a），从而将N-末端肽片段（a）与其它肽片段（b）分离的分离步骤（3）其中所述选择性洗脱通过使其它肽片段（b）与底物结合同时允许N-末端肽片段（a）洗脱，或通过使N-末端肽片段（a）与同时允许其他肽片段（b）洗脱并随后洗脱结合的N-末端肽片段（a）。

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