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    • 2. 发明申请
    • FLUORINE COMPOUNDS FOR DOPING CONDUCTIVE OXIDE THIN FILMS
    • 用于掺杂导电氧化物薄膜的氟化合物
    • US20110070371A1
    • 2011-03-24
    • US12884490
    • 2010-09-17
    • Tim GessertXiaonan LiTeresa M. BarnesRobert Torres, JR.Carrie L. Wyse
    • Tim GessertXiaonan LiTeresa M. BarnesRobert Torres, JR.Carrie L. Wyse
    • C23C16/08
    • C23C16/45523C23C16/407C23C16/50
    • Methods of forming a conductive fluorine-doped metal oxide layer on a substrate by chemical vapor deposition are described. The methods may include heating the substrate in a processing chamber, and introducing a metal-containing precursor and a fluorine-containing precursor to the processing chamber. The methods may also include adding an oxygen-containing precursor to the processing chamber. The precursors are reacted to deposit the fluorine-doped metal oxide layer on the substrate. Methods may also include forming the conductive fluorine-doped metal oxide layer by plasma-assisted chemical vapor deposition. These methods may include providing the substrate in a processing chamber, and introducing a metal-containing precursor, and a fluorine-containing precursor to the processing chamber. A plasma may be formed that includes species from the metal-containing precursor and the fluorine-containing precursor. The species may react to deposit the fluorine-doped metal oxide layer on the substrate.
    • 描述了通过化学气相沉积在衬底上形成导电性氟掺杂金属氧化物层的方法。 所述方法可以包括在处理室中加热衬底,并将含金属的前体和含氟前体引入到处理室中。 所述方法还可以包括向处理室中加入含氧前体。 使前体反应以在衬底上沉积氟掺杂的金属氧化物层。 方法还可以包括通过等离子体辅助化学气相沉积形成导电性氟掺杂金属氧化物层。 这些方法可以包括在处理室中提供衬底,并将含金属的前体和含氟前体引入处理室。 可以形成包括来自含金属的前体和含氟前体的物质的等离子体。 该物质可以反应以在衬底上沉积氟掺杂的金属氧化物层。
    • 3. 发明授权
    • Fluorine compounds for doping conductive oxide thin films
    • 用于掺杂导电氧化物薄膜的氟化合物
    • US08425978B2
    • 2013-04-23
    • US12884490
    • 2010-09-17
    • Tim GessertXiaonan LiTeresa M. BarnesRobert Torres, Jr.Carrie L. Wyse
    • Tim GessertXiaonan LiTeresa M. BarnesRobert Torres, Jr.Carrie L. Wyse
    • C23C16/00C23C16/08
    • C23C16/45523C23C16/407C23C16/50
    • Methods of forming a conductive fluorine-doped metal oxide layer on a substrate by chemical vapor deposition are described. The methods may include heating the substrate in a processing chamber, and introducing a metal-containing precursor and a fluorine-containing precursor to the processing chamber. The methods may also include adding an oxygen-containing precursor to the processing chamber. The precursors are reacted to deposit the fluorine-doped metal oxide layer on the substrate. Methods may also include forming the conductive fluorine-doped metal oxide layer by plasma-assisted chemical vapor deposition. These methods may include providing the substrate in a processing chamber, and introducing a metal-containing precursor, and a fluorine-containing precursor to the processing chamber. A plasma may be formed that includes species from the metal-containing precursor and the fluorine-containing precursor. The species may react to deposit the fluorine-doped metal oxide layer on the substrate.
    • 描述了通过化学气相沉积在衬底上形成导电氟掺杂金属氧化物层的方法。 所述方法可以包括在处理室中加热衬底,并将含金属的前体和含氟前体引入到处理室中。 所述方法还可以包括向处理室中加入含氧前体。 使前体反应以在衬底上沉积氟掺杂的金属氧化物层。 方法还可以包括通过等离子体辅助化学气相沉积形成导电性氟掺杂金属氧化物层。 这些方法可以包括在处理室中提供衬底,并将含金属的前体和含氟前体引入处理室。 可以形成包括来自含金属的前体和含氟前体的物质的等离子体。 该物质可以反应以在衬底上沉积氟掺杂的金属氧化物层。
    • 8. 发明授权
    • Variable temperature semiconductor film deposition
    • 可变温度半导体膜沉积
    • US5712187A
    • 1998-01-27
    • US555621
    • 1995-11-09
    • Xiaonan LiPeter Sheldon
    • Xiaonan LiPeter Sheldon
    • H01L21/203H01L21/363H01L31/073H01L31/18H01L21/20
    • H01L31/073H01L21/02474H01L21/02562H01L21/02595H01L21/02631H01L31/1828Y02E10/543Y02P70/521
    • A method of depositing a semiconductor material on a substrate. The method sequentially comprises (a) providing the semiconductor material in a depositable state such as a vapor for deposition on the substrate; (b) depositing the semiconductor material on the substrate while heating the substrate to a first temperature sufficient to cause the semiconductor material to form a first film layer having a first grain size; (c) continually depositing the semiconductor material on the substrate while cooling the substrate to a second temperature sufficient to cause the semiconductor material to form a second film layer deposited on the first film layer and having a second grain size smaller than the first grain size; and (d) raising the substrate temperature, while either continuing or not continuing to deposit semiconductor material to form a third film layer, to thereby anneal the film layers into a single layer having favorable efficiency characteristics in photovoltaic applications. A preferred semiconductor material is cadmium telluride deposited on a glass/tin oxide substrate already having thereon a film layer of cadmium sulfide.
    • 一种在衬底上沉积半导体材料的方法。 该方法顺序地包括(a)提供诸如蒸气的沉积状态的半导体材料以沉积在基底上; (b)将半导体材料沉积在衬底上,同时将衬底加热到​​足以使半导体材料形成具有第一晶粒尺寸的第一膜层的第一温度; (c)在将衬底冷却至足以使半导体材料形成沉积在第一膜层上并具有小于第一晶粒尺寸的第二晶粒尺寸的第二膜层的第二温度下,将半导体材料连续沉积在衬底上; 和(d)提高衬底温度,同时继续或不继续沉积半导体材料以形成第三膜层,从而将膜层退火成在光伏应用中具有良好效率特性的单层。 优选的半导体材料是沉积在已经具有硫化镉层的玻璃/氧化锡衬底上的碲化镉。