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1. 发明授权

US06331071B2 Stirring device 有权
公开(公告)号：US06331071B2
公开(公告)日：2001-12-18
申请号：US09795123
申请日：2001-03-01
申请人： Shoko Akamine , Yasunao Miyazawa , Shigenobu Maruoka
发明人： Shoko Akamine , Yasunao Miyazawa , Shigenobu Maruoka
IPC分类号： B01F718
CPC分类号： B01F7/18 , B01F7/00291 , B01F15/00883
摘要： A stirring device achieving high stirring efficiency and easy to wash and maintain, is provided. The stirring device includes a vertical cylindrical stirring vessel, a rotary shaft vertically extended within the stirring vessel for rotation, and a stirring vessel constituted of two or more basically rectangular vane plates vertically supported on the rotary shaft in symmetrical relation with each other with respect to the rotary shaft. On an upper portion of the stirring vane, a recess is formed for forming a cone about the rotary shaft when the stirring vane rotates. A lower end of the stirring vane is arranged in the vicinity of a bottom surface of the stirring vessel.

2. 发明授权

US06244741B1 Stirring device 有权
标题翻译：搅拌装置
公开(公告)号：US06244741B1
公开(公告)日：2001-06-12
申请号：US09437152
申请日：1999-11-10
申请人： Shoko Akamine , Yasunao Miyazawa , Shigenobu Maruoka
发明人： Shoko Akamine , Yasunao Miyazawa , Shigenobu Maruoka
IPC分类号： B01F718
CPC分类号： B01F7/18 , B01F7/00291 , B01F15/00883
摘要： A stirring device achieving high stirring efficiency and easy to wash and maintain, is provided. The stirring device includes a vertical cylindrical stirring vessel, a rotary shaft vertically extended within the stirring vessel for rotation, and a stirring vessel constituted of two or more basically rectangular vane plates vertically supported on the rotary shaft in symmetrical relation with each other with respect to the rotary shaft. On an upper portion of the stirring vane, a recess is formed for forming a cone about the rotary shaft when the stirring vane rotates. A lower end of the stirring vane is arranged in the vicinity of a bottom surface of the stirring vessel.
摘要翻译：提供了实现高搅拌效率并易于洗涤和维护的搅拌装置。搅拌装置包括垂直圆柱形搅拌容器，在搅拌容器内垂直延伸以旋转的旋转轴，以及由旋转轴垂直支撑的两个或更多个基本上矩形的叶片板构成的搅拌容器，该叶片板相对于旋转轴。在搅拌叶片的上部形成有用于在搅拌叶片旋转时围绕旋转轴形成锥体的凹部。搅拌叶片的下端设置在搅拌容器的底面附近。

3. 发明授权

US5118567A Adhesive tape and use thereof 失效
标题翻译：粘合胶带及其用途
公开(公告)号：US5118567A
公开(公告)日：1992-06-02
申请号：US380548
申请日：1989-07-14
申请人： Mikio Komiyama , Yasunao Miyazawa , Kazuyoshi Ebe , Takanori Saito
发明人： Mikio Komiyama , Yasunao Miyazawa , Kazuyoshi Ebe , Takanori Saito
IPC分类号： C08F2/50 , C09J4/00 , C09J4/06 , C09J5/00 , C09J5/06 , C09J7/00 , C09J7/02 , H01L21/302 , H01L21/52 , H01L21/58 , H01L21/68
CPC分类号： H01L21/6835 , C09J4/06 , C09J7/00 , C09J7/0239 , H01L21/302 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/83191 , H01L2224/83855 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T156/1062 , Y10T428/2809 , Y10T428/287 , Y10T428/2891
摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

4. 发明授权

US06584858B1 Device and method for measuring adhesive strength 失效
标题翻译：用于测量粘合强度的装置和方法
公开(公告)号：US06584858B1
公开(公告)日：2003-07-01
申请号：US09979122
申请日：2001-11-19
申请人： Yasunao Miyazawa , Tsutomu Noshiroya , Takao Kimijima , Takao Kokubu
发明人： Yasunao Miyazawa , Tsutomu Noshiroya , Takao Kimijima , Takao Kokubu
IPC分类号： G01N308
CPC分类号： G01N19/04 , G01N33/445
摘要： First, a sample holder 13, 57 is lowered such that a sample is held. Next, a roller 11 or a plate-shaped member 56 is lowered and pressed to an adhesive surface 15A of a sample 15. At this time, a tape 23 is disposed between the roller 11 or the plate-shaped member 56 and the adhesive surface 15A of the sample 15, and a fixed pressure load is applied to the sample 15. Then after a fixed period of time has passed, the tape 23 is pulled from the sample 15 by the raising of the roller 11 or the plate-shaped member 56 and an adhesive strength is measured with a load cell 25 according to the tension of the tape 23 at that time. After measuring, a take-up reel 21, 52 is rotated so as to wind up a predetermined pitch of the tape 23, and an unused portion of the tape 23 is reeled out to the tip of the roller 11 or the plate-shaped member 56.
摘要翻译：首先，使样品保持器13,57下降，使得保持样品。接下来，将辊11或板状构件56下降并压到样品15的粘合表面15A上。此时，带23设置在辊11或板状构件56和粘合表面 15A，并且固定的压力负荷被施加到样本15上。然后经过一段固定的时间后，通过升高辊11或板状构件将带23从试样15拉出并且根据当时的带23的张力，用测力传感器25测量粘合强度。在测量之后，卷取卷轴21,52旋转以卷起带23的预定间距，并且带23的未使用部分被卷绕到辊11的顶端或板状部件 56。

5. 发明授权

US5356949A Adhesive composition comprising (meth)acrylate polymer and epoxy resin 失效
标题翻译：包含（甲基）丙烯酸酯聚合物和环氧树脂的粘合剂组合物
公开(公告)号：US5356949A
公开(公告)日：1994-10-18
申请号：US837117
申请日：1992-02-21
申请人： Mikio Komiyama , Yasunao Miyazawa , Kazuyoshi Ebe , Takanori Saito
发明人： Mikio Komiyama , Yasunao Miyazawa , Kazuyoshi Ebe , Takanori Saito
IPC分类号： C08F2/50 , C09J4/00 , C09J4/06 , C09J5/00 , C09J5/06 , C09J7/00 , C09J7/02 , H01L21/302 , H01L21/52 , H01L21/58 , H01L21/68 , C09J163/02 , C09J133/06
CPC分类号： H01L21/6835 , C09J4/06 , C09J7/00 , C09J7/0239 , H01L21/302 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/83191 , H01L2224/83855 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T156/1062 , Y10T428/2809 , Y10T428/287 , Y10T428/2891
摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable latent curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.
摘要翻译：一种胶带，包括表面张力不大于40达因/厘米的能量束透射性基片和形成在基片的一个表面上的粘合剂层，所述粘合层包含（甲基）丙烯酸酯聚合物，环氧树脂，可光聚合的低分子量化合物，用于环氧树脂的可热活化的潜在性固化剂和用于可光聚合的低分子量化合物的光聚合引发剂。粘合剂层中的粘合剂可用能量束固化，并且如此固化的粘合剂在加热时再次发生粘性。当胶带用于处理半导体晶片时，其用作在切割步骤期间将晶片保持在适当位置的切割胶带。通过加热而附着在每个芯片上并且能够被加热的每块切割和固化的粘合剂层提供了在芯片接合步骤中将芯片牢固地安装在引线框架上所需的粘合剂。

6. 发明授权

US5110388A Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape 失效
标题翻译：使用光刻胶和热固性粘合胶带贴合半导体芯片的方法
公开(公告)号：US5110388A
公开(公告)日：1992-05-05
申请号：US653232
申请日：1991-02-08
申请人： Mikio Komiyama , Yasunao Miyazawa , Kazuyoshi Ebe , Takanori Saito
发明人： Mikio Komiyama , Yasunao Miyazawa , Kazuyoshi Ebe , Takanori Saito
IPC分类号： C08F2/50 , C09J4/00 , C09J4/06 , C09J5/00 , C09J5/06 , C09J7/00 , C09J7/02 , H01L21/302 , H01L21/52 , H01L21/58 , H01L21/68
CPC分类号： H01L21/6835 , C09J4/06 , C09J7/00 , C09J7/0239 , H01L21/302 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/83191 , H01L2224/83855 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T156/1062 , Y10T428/2809 , Y10T428/287 , Y10T428/2891
摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

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