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1. 发明申请

US20220271725A1 Method For Manufacturing Vibration Element 有权
公开(公告)号：US20220271725A1
公开(公告)日：2022-08-25
申请号：US17679280
申请日：2022-02-24
申请人： Seiko Epson Corporation
发明人： Hiyori SAKATA , Takuro KOBAYASHI , Ryuta NISHIZAWA , Shigeru SHIRAISHI , Keiichi YAMAGUCHI
IPC分类号： H03H3/013
摘要： A method for manufacturing a vibration element includes: a first dry etching step of dry etching the quartz crystal substrate from a first surface and forming first grooves and contours of a first vibrating arm and a second vibrating arm on the first surface; and a second dry etching step of dry etching the quartz crystal substrate from a second surface side and forming second grooves and contours of the first vibrating arm and the second vibrating arm on the second surface, in which Wa/Aa

2. 发明申请

US20220246835A1 Method For Manufacturing Vibration Element 有权
公开(公告)号：US20220246835A1
公开(公告)日：2022-08-04
申请号：US17587012
申请日：2022-01-28
申请人： Seiko Epson Corporation
发明人： Hiyori SAKATA , Takuro KOBAYASHI , Ryuta NISHIZAWA , Keiichi YAMAGUCHI , Shigeru SHIRAISHI
IPC分类号： H01L41/332 , H01L41/18 , H03H9/19 , H03H9/215
摘要： A method for manufacturing a vibration element that includes a base portion, a first vibration arm and a second vibration arm that extend from the base portion along a first direction and are arranged along a second direction intersecting the first direction, and bottomed grooves on both main surfaces of the first vibration arm and both main surfaces of the second vibration arm includes: a preparing step of preparing a crystal substrate; a protective film forming step of forming a protective film on the crystal substrate except for groove regions that are regions in which the grooves are formed; and a dry etching step of dry etching the crystal substrate through the protective film to form the grooves. The grooves provided in at least one of the first vibration arm and the second vibration arm include a first groove and a second groove arranged along the second direction.

3. 发明公开

US20240297637A1 Resonator Device 审中-公开
公开(公告)号：US20240297637A1
公开(公告)日：2024-09-05
申请号：US18592675
申请日：2024-03-01
申请人： SEIKO EPSON CORPORATION
发明人： Takashi YAMAZAKI , Takuro KOBAYASHI , Juichiro MATSUZAWA
IPC分类号： H03H9/215 , H03H9/02 , H03H9/05 , H03H9/10
CPC分类号： H03H9/215 , H03H9/02157 , H03H9/0509 , H03H9/105
摘要： A resonator device includes a resonator element, and a base to which the resonator element is fixed via a conductive adhesive. The resonator element includes a base portion, a vibrating arm that is coupled to the base portion and that extends in a first direction, and a support arm that is arranged with the vibrating arm in a second direction orthogonal to the first direction, that extends in the first direction, and that is fixed to the base by the conductive adhesive. 0.2×L1≤Da≤0.4×L1, in which a position at a base end of the support arm is P0, a central position of the conductive adhesive is Pa, and a length between P0 and Pa is Da in the first direction of the support arm.

4. 发明申请

US20220271735A1 Method For Manufacturing Vibration Element 有权
公开(公告)号：US20220271735A1
公开(公告)日：2022-08-25
申请号：US17679319
申请日：2022-02-24
申请人： Seiko Epson Corporation
发明人： Hiyori SAKATA , Takuro KOBAYASHI , Ryuta NISHIZAWA , Keiichi YAMAGUCHI , Shigeru SHIRAISHI
IPC分类号： H03H9/19 , H03H9/17 , H03H3/013
摘要： A method for manufacturing a vibration element includes: a preparing step of preparing a quartz crystal substrate having a first surface and a second surface; a protective film forming step of forming a protective film on the first surface of the quartz crystal substrate, excluding groove forming regions where grooves are formed and an inter-arm region located between a first vibrating arm forming region where a first vibrating arm is formed and a second vibrating arm forming region where a second vibrating arm is formed; and a dry etching step of dry etching the quartz crystal substrate from a first surface side via the protective film and forming the grooves and contours of the first vibrating arm and the second vibrating arm. Wa/Aa

5. 发明公开

US20240297636A1 Resonator Element And Resonator Device 审中-公开
公开(公告)号：US20240297636A1
公开(公告)日：2024-09-05
申请号：US18592642
申请日：2024-03-01
申请人： SEIKO EPSON CORPORATION
发明人： Takuro KOBAYASHI , Akinori YAMADA , Takashi YAMAZAKI , Osamu KAWAUCHI
IPC分类号： H03H9/215 , H03H9/19
CPC分类号： H03H9/215 , H03H9/19
摘要： A resonator element includes a base part and a vibrating arm. The vibrating arm includes an arm part and a wide part whose width is larger than that of the arm part. In the arm part, a first groove is formed on the first surface side, and a second groove is formed on the second surface side. 30 μm≤Wa≤75 μm, in which a width of the arm part is Wa, a thickness T between the first surface and the second surface of the arm part satisfies 110 μm≤T≤150 μm. 0.884≤(t1+t2)/T≤0.990, in which a depth of the first groove is t1, and a depth of the second groove is t2. 0.0056≤Wb/T≤0.0326, in which a width of the first surface arranged across the first groove and a width of the second surface arranged across the second groove are Wb. A length L1 of the vibrating arm satisfies L1≤1000 μm.

6. 发明公开

US20240258981A1 Method Of Manufacturing Vibration Element 审中-公开
公开(公告)号：US20240258981A1
公开(公告)日：2024-08-01
申请号：US18426460
申请日：2024-01-30
申请人： SEIKO EPSON CORPORATION
发明人： Osamu KAWAUCHI , Takashi YAMAZAKI , Takuro KOBAYASHI
IPC分类号： H03H3/02 , H03H9/215
CPC分类号： H03H3/02 , H03H9/215 , H03H2003/026
摘要： A method of manufacturing a vibration element includes: manufacturing, by wet etching, a piezoelectric substrate including a vibration element, a frame portion, and a coupling portion that couples the frame portion and the vibration element; and folding the vibration element at the coupling portion and separating the vibration element from the frame portion. In the manufacturing of the piezoelectric substrate by the wet etching, the coupling portion is formed with a first groove portion, and a first protruding portion and a second protruding portion. The first protruding portion has a first outer shape side that defines an outer shape of the coupling portion and a second outer shape side that defines a boundary between the first protruding portion and the first groove portion, and is formed in a shape in which a distance between the first outer shape side and the second outer shape side decreases as a distance from the outer shape side of the vibration element increases. The second protruding portion has a third outer shape side that defines the outer shape of the coupling portion and a fourth outer shape side that defines a boundary between the second protruding portion and the first groove portion, and is formed in a shape in which a distance between the third outer shape side and the fourth outer shape side decreases as a distance from the outer shape side of the vibration element increases.

7. 发明公开

US20230155564A1 Method for Manufacturing Vibration Element 审中-公开
公开(公告)号：US20230155564A1
公开(公告)日：2023-05-18
申请号：US17986063
申请日：2022-11-14
申请人： SEIKO EPSON CORPORATION
发明人： Takuro KOBAYASHI , Hiyori SAKATA , Akinori YAMADA
IPC分类号： H03H3/02 , H03H9/215
CPC分类号： H03H3/02 , H03H9/215 , H03H2003/026
摘要： A vibration element manufacturing method includes a first dry etching step of dry-etching a quartz crystal substrate from the first surface side to form first grooves and the outer shapes of first and second vibrating arms, a second dry etching step of dry-etching the quartz crystal substrate from the second surface side to form second grooves and the outer shapes, and a wet etching step of wet-etching the side surfaces of the first and second vibrating arms, the first grooves, and the second grooves to form inclining surfaces that couple bottom surfaces to in-groove side surfaces of the first and second grooves, and the first and second grooves satisfy the relationship of D1/D ≥ 0.80, where D represents the depth of each of the first and second grooves, and D1 represents the result of subtraction of the length of the inclining surfaces in a direction Z from the depth in each of the first and second grooves.

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