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    • 1. 发明申请
    • VIBRATOR ELEMENT, VIBRATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
    • 振动元件,振动器,电子设备,电子设备和移动物体
    • US20140239776A1
    • 2014-08-28
    • US14166029
    • 2014-01-28
    • SEIKO EPSON CORPORATION
    • Takashi YAMAZAKI
    • H03H9/21
    • H03H9/21H03H9/0542H03H9/0547
    • A tuning fork type vibrator element, as a vibrator element, includes a base formed on a plane including a first axis and a second axis orthogonal to the first axis, a connection portion extending in a first axis direction from the base, with a thickness thereof being smaller than that of the base and a vibrating arm extending in the first axis direction from one end portion of the connection portion, with a thickness thereof being the same as that of the connection portion, in which the vibrating arm performs flexural vibration along a vertical direction with respect to the plane, and in which the connection portion is provided such that a relationship between a length L2 in the first axis direction of the connection portion and a length L1 in the first axis direction of the vibrating arm falls within a range of L1/15≦L2≦L1.
    • 作为振子元件的音叉式振动元件包括形成在包括第一轴线和与第一轴线正交的第二轴线的平面上的基座,从底座沿第一轴线方向延伸的连接部分,其厚度 小于基座的长度的振动臂和从连接部的一个端部沿第一轴线方向延伸的振动臂,其厚度与连接部的厚度相同,其中振动臂沿着连接部的一端部进行弯曲振动 并且其中连接部分设置成使得连接部分的第一轴线方向上的长度L2与振动臂的第一轴线方向上的长度L1之间的关系落在一个范围内 的L1 / 15≦̸ L2≦̸ L1。
    • 10. 发明公开
    • Method Of Manufacturing Vibration Element
    • US20240258981A1
    • 2024-08-01
    • US18426460
    • 2024-01-30
    • SEIKO EPSON CORPORATION
    • Osamu KAWAUCHITakashi YAMAZAKITakuro KOBAYASHI
    • H03H3/02H03H9/215
    • H03H3/02H03H9/215H03H2003/026
    • A method of manufacturing a vibration element includes: manufacturing, by wet etching, a piezoelectric substrate including a vibration element, a frame portion, and a coupling portion that couples the frame portion and the vibration element; and folding the vibration element at the coupling portion and separating the vibration element from the frame portion. In the manufacturing of the piezoelectric substrate by the wet etching, the coupling portion is formed with a first groove portion, and a first protruding portion and a second protruding portion. The first protruding portion has a first outer shape side that defines an outer shape of the coupling portion and a second outer shape side that defines a boundary between the first protruding portion and the first groove portion, and is formed in a shape in which a distance between the first outer shape side and the second outer shape side decreases as a distance from the outer shape side of the vibration element increases. The second protruding portion has a third outer shape side that defines the outer shape of the coupling portion and a fourth outer shape side that defines a boundary between the second protruding portion and the first groove portion, and is formed in a shape in which a distance between the third outer shape side and the fourth outer shape side decreases as a distance from the outer shape side of the vibration element increases.