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    • 8. 发明授权
    • Method to reduce corner shunting during fabrication of CPP read heads
    • 在CPP读取头制造过程中减少拐角分流的方法
    • US07839607B2
    • 2010-11-23
    • US11890868
    • 2007-08-07
    • Robert E. Fontana, Jr.Ying HongWipul Pemsiri JayasekaraHoward Gordon Zolla
    • Robert E. Fontana, Jr.Ying HongWipul Pemsiri JayasekaraHoward Gordon Zolla
    • G11B5/127
    • B82Y10/00B82Y25/00G11B5/3163G11B5/3932G11B2005/3996Y10T428/1171
    • A method is presented for fabricating a CPP read head having a CPP read head sensor and a hard bias layer which includes forming a strip of sensor material in a sensor material region, and depositing strips of fast-milling dielectric material in first and second fast-milling dielectric material regions adjacent to the sensor material region. A protective layer and a layer of masking material are deposited on the strip of sensor material and the strips of fast-milling dielectric material to provide masked areas and exposed areas. A shaping source, such as an ion milling source, is provided which shapes the exposed areas. Hard bias material is then deposited on the regions of sensor material and fast-milling dielectric material to form caps on each of these regions. The caps of hard bias material and the masking material are then removed from each of these regions.
    • 提出了一种用于制造具有CPP读取头传感器和硬偏置层的CPP读取头的方法,该CPP读取头包括在传感器材料区域中形成传感器材料条,以及将快速研磨电介质材料的条带放置在第一和第二快速接头中, 研磨与传感器材料区域相邻的介电材料区域。 保护层和掩蔽材料层沉积在传感器材料条和快速研磨电介质材料条上,以提供掩蔽区域和暴露区域。 提供成形源,例如离子铣削源,其形成暴露的区域。 然后将硬偏置材料沉积在传感器材料和快速研磨电介质材料的区域上,以在这些区域中的每一个上形成盖。 然后从这些区域中的每一个去除硬偏置材料的盖子和掩模材料。
    • 10. 发明授权
    • Planar perpendicular recording head
    • 平面垂直记录头
    • US07253991B2
    • 2007-08-07
    • US10836918
    • 2004-04-30
    • Robert E. Fontana, Jr.Kuok San HoChing Hwa Tsang
    • Robert E. Fontana, Jr.Kuok San HoChing Hwa Tsang
    • G11B5/127G11B5/31
    • G11B5/315G11B5/10G11B5/1278
    • A magnetic head (slider) for perpendicular recording which requires no lapping is described. The head is fabricated with an air bearing surface that is parallel to the wafer surface. The coil and pole pieces are formed from thin films disposed parallel to the air bearing surface. Standard lithographic techniques can be used to define the shapes, gaps and pole piece dimensions. Non-rectilinear shapes can be formed; for example, side shields that conform around the write pole piece region. The thickness of the main and return pole pieces are controlled by the deposition process rather than by lapping. The saw cuts used to separate the individual sliders from the rest of the wafer are perpendicular to the air-bearing surface and do not pass through any critical features.
    • 描述了不需要研磨的用于垂直记录的磁头(滑块)。 该头部具有平行于晶片表面的空气轴承表面。 线圈和极片由平行于空气轴承表面设置的薄膜形成。 标准光刻技术可用于定义形状,间隙和极片尺寸。 可以形成非直线形状; 例如,围绕写入极片区域的侧面屏蔽。 主回极片和返回极片的厚度由沉积过程而不是研磨来控制。 用于将各个滑块与其余的晶片分开的锯切板垂直于空气轴承表面,并且不通过任何关键特征。