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1. 发明授权

US07875484B2 Monolithic IC and MEMS microfabrication process 有权
标题翻译：单片IC和MEMS微加工工艺
公开(公告)号：US07875484B2
公开(公告)日：2011-01-25
申请号：US11602087
申请日：2006-11-20
申请人： Richard Yeh , David M. Bloom
发明人： Richard Yeh , David M. Bloom
IPC分类号： H01L21/00
CPC分类号： H01L27/06 , B81C1/00246 , B81C2203/0742
摘要： Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures.
摘要翻译：公开了使用高应力氮化硅作为机械材料的单片IC / MEMS工艺，而非晶硅用作牺牲层。电子电路和微机电器件建立在单个晶片的单独区域上。 IC和MEMS工艺步骤的顺序旨在防止部分完成的电路和器件随后的高工艺温度的变化。

2. 发明授权

US08445307B2 Monolithic IC and MEMS microfabrication process 有权
标题翻译：单片IC和MEMS微加工工艺
公开(公告)号：US08445307B2
公开(公告)日：2013-05-21
申请号：US12968594
申请日：2010-12-15
申请人： Richard Yeh , David M Bloom
发明人： Richard Yeh , David M Bloom
IPC分类号： H01L21/00
CPC分类号： H01L27/06 , B81C1/00246 , B81C2203/0742
摘要： Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures.
摘要翻译：公开了使用高应力氮化硅作为机械材料的单片IC / MEMS工艺，而非晶硅用作牺牲层。电子电路和微机电器件建立在单个晶片的单独区域上。 IC和MEMS工艺步骤的顺序旨在防止部分完成的电路和器件随后的高工艺温度的变化。

3. 发明申请

US20110084343A1 Monolithic IC and MEMS microfabrication process 有权
公开(公告)号：US20110084343A1
公开(公告)日：2011-04-14
申请号：US12968594
申请日：2010-12-15
申请人： Richard Yeh , David M. Bloom
发明人： Richard Yeh , David M. Bloom
IPC分类号： H01L29/66 , H01L21/20
CPC分类号： H01L27/06 , B81C1/00246 , B81C2203/0742
摘要： Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures.

4. 发明申请

US20090140433A1 MEMS chip-to-chip interconnects 审中-公开
标题翻译： MEMS芯片到芯片互连
公开(公告)号：US20090140433A1
公开(公告)日：2009-06-04
申请号：US12276123
申请日：2008-11-21
申请人： David M. Bloom , Matthew A. Leone , Richard Yeh
发明人： David M. Bloom , Matthew A. Leone , Richard Yeh
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： B81C3/008 , B81B7/0006 , B81B2207/07
摘要： A chip-to-chip interconnect system suited for MEMS that do not require low-resistance connections is described. The interconnects may be fabricated simultaneously with MEMS ribbon structures such as are found in MEMS optical modulators.
摘要翻译：描述了适用于不需要低电阻连接的MEMS的芯片到芯片的互连系统。互连可以与诸如在MEMS光学调制器中发现的MEMS带结构同时制造。

5. 发明申请

US20120099171A1 Pseudo Bipolar MEMS Ribbon Drive 有权
标题翻译：伪双极MEMS带驱动
公开(公告)号：US20120099171A1
公开(公告)日：2012-04-26
申请号：US12910072
申请日：2010-10-22
申请人： Richard Yeh , David M. Bloom
发明人： Richard Yeh , David M. Bloom
IPC分类号： G02B26/02
CPC分类号： G09G3/3433 , G09G2310/061
摘要： A pseudo bipolar method for driving a MEMS ribbon device reduces charging effects in the device.
摘要翻译：用于驱动MEMS带状器件的伪双极性方法降低了器件中的充电效应。

6. 发明授权

US08368984B2 Pseudo bipolar MEMS ribbon drive 有权
标题翻译：伪双极MEMS带驱动器
公开(公告)号：US08368984B2
公开(公告)日：2013-02-05
申请号：US12910072
申请日：2010-10-22
申请人： Richard Yeh , David M Bloom
发明人： Richard Yeh , David M Bloom
IPC分类号： G02B26/08 , G02B26/00
CPC分类号： G09G3/3433 , G09G2310/061
摘要： A pseudo bipolar method for driving a MEMS ribbon device reduces charging effects in the device.
摘要翻译：用于驱动MEMS带状器件的伪双极性方法降低了器件中的充电效应。

7. 发明申请

US20080119000A1 Monolithic IC and MEMS microfabrication process 有权
标题翻译：单片IC和MEMS微加工工艺
公开(公告)号：US20080119000A1
公开(公告)日：2008-05-22
申请号：US11602087
申请日：2006-11-20
申请人： Richard Yeh , David M. Bloom
发明人： Richard Yeh , David M. Bloom
IPC分类号： H01L21/00
CPC分类号： H01L27/06 , B81C1/00246 , B81C2203/0742
摘要： Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures.
摘要翻译：公开了使用高应力氮化硅作为机械材料的单片IC / MEMS工艺，而非晶硅用作牺牲层。电子电路和微机电器件建立在单个晶片的单独区域上。 IC和MEMS工艺步骤的顺序旨在防止部分完成的电路和器件随后的高工艺温度的变化。

8. 发明申请

US20130120226A1 SHIFTED QUAD PIXEL AND OTHER PIXEL MOSAICS FOR DISPLAYS 审中-公开
标题翻译：改变了四分之一像素和其他像素MOSAICS显示
公开(公告)号：US20130120226A1
公开(公告)日：2013-05-16
申请号：US13493944
申请日：2012-06-11
申请人： Kostadin D. Djordjev , Richard Yeh , Alan G. Lewis
发明人： Kostadin D. Djordjev , Richard Yeh , Alan G. Lewis
IPC分类号： G09G3/20 , B23P17/04
CPC分类号： G09G3/3466 , G09G2300/0452 , G09G2300/06 , Y10T29/49826
摘要： This disclosure provides systems and apparatuses having pixels with various display element arrangements. In one aspect, a passive matrix display apparatus includes a plurality of red display elements extending along a direction parallel to a first row, the plurality of red display elements addressed by a single first common line, a plurality of green display elements extending along a direction parallel to a second row, the plurality of green display elements addressed by a single second common line, and a plurality of blue display elements extending along a direction parallel to a third row, the plurality of blue display elements addressed by a single third common line, where the number of green display elements in the display is greater than one of a number of red display elements in the display and a number of blue display elements in the display.
摘要翻译：本公开提供了具有各种显示元件布置的像素的系统和装置。一方面，一种无源矩阵显示装置包括沿着与第一行平行的方向延伸的多个红色显示元件，多个红色显示元件由单个第一公共线寻址，多个绿色显示元件沿着方向平行于第二行，由单个第二公共线寻址的多个绿色显示元件和沿着平行于第三行的方向延伸的多个蓝色显示元件，所述多个蓝色显示元件由单个第三公共线寻址其中显示器中的绿色显示元件的数量大于显示器中的多个红色显示元件中的一个以及显示器中的蓝色显示元件的数量。

9. 发明授权

US07569387B2 Antibody to TNF receptor-like molecules 失效
标题翻译： TNF受体样分子的抗体
公开(公告)号：US07569387B2
公开(公告)日：2009-08-04
申请号：US11436207
申请日：2006-05-17
申请人： Lars Eyde Theill , Richard Yeh , Scott Michael Silbiger , Gang Yu , Giorgio Senaldi
发明人： Lars Eyde Theill , Richard Yeh , Scott Michael Silbiger , Gang Yu , Giorgio Senaldi
IPC分类号： C07K16/28 , C12N5/16
CPC分类号： C07K14/7151 , A61K38/00 , C07K2319/00 , C12N2799/021
摘要： Novel MK61 polypeptides and nucleic acid molecules encoding the same. The invention also provides vectors, host cells, selective binding agents, and methods for producing MK61 polypeptides. Also provided for are methods for the treatment, diagnosis, amelioration, or prevention of diseases with MK61 polypeptides.
摘要翻译：新型MK61多肽和编码其的核酸分子。本发明还提供了载体，宿主细胞，选择性结合剂和用于产生MK61多肽的方法。还提供用于治疗，诊断，改善或预防MK61多肽的疾病的方法。

10. 发明授权

US07094566B2 IL-17 receptor like molecules and uses thereof 有权
公开(公告)号：US07094566B2
公开(公告)日：2006-08-22
申请号：US09810927
申请日：2001-03-16
申请人： Eugene Medlock , Richard Yeh , Scott M. Silbiger , Gary S. Elliott , Hung Q. Nguyen , Shuqian Jing
发明人： Eugene Medlock , Richard Yeh , Scott M. Silbiger , Gary S. Elliott , Hung Q. Nguyen , Shuqian Jing
IPC分类号： C12N15/12 , C12N5/10 , C12N15/63 , C12P21/02 , C07K14/47
CPC分类号： A01K67/0275 , A01K2217/05 , A01K2227/105 , A01K2267/0368 , A61K38/00 , A61K49/0008 , C07K14/7155 , C12N15/8509 , G01N33/6863 , G01N2500/00 , Y10S435/81
摘要： The present invention provides for IL-17 receptor like polypeptides and nucleic acid molecules encoding the same. The invention also provides vectors, host cells, agonists and antagonists (including selective binding agents), and methods for producing IL-17 receptor like polypeptides. Also provided for are methods for treatment, diagnosis, amelioration, or prevention of diseases with IL-17 receptor like polypeptides.

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