会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Ducted exhaust equipment enclosure
    • 管道排气设备外壳
    • US08737068B2
    • 2014-05-27
    • US13348820
    • 2012-01-12
    • William KrietzmanRichard Evans Lewis, IIDennis W. Vanlith
    • William KrietzmanRichard Evans Lewis, IIDennis W. Vanlith
    • H05K7/20
    • H05K7/20754H05K7/1488H05K7/20745
    • An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    • 电子设备外壳包括至少部分地被多个面板封闭的框架结构,所述框架限定了一个或多个电子部件安装在其中的隔室,以及排气管道,其适于将从隔室排出的热空气与冷空气进入 隔室,从而改善外壳的热管理。 排气管道包括从隔室的顶板向上延伸的下部管道部分和从下部管道部分的上端向上伸展的上部管道部分。 每个管道部分包括通过铰接角配件连接在一起的四个面板,使得该部分是可折叠的。 上部管道部分包括向外扩张的部分。
    • 4. 发明授权
    • Vertical exhaust duct
    • 垂直排气管
    • US08730665B2
    • 2014-05-20
    • US13116899
    • 2011-05-26
    • Richard Evans Lewis, IIDennis W. VanLith
    • Richard Evans Lewis, IIDennis W. VanLith
    • H05K7/20
    • H05K5/0217H01L2924/0002H05K5/0213H05K7/20H05K7/20736H01L2924/00
    • An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.
    • 电子设备外壳包括由多个支撑柱形成并至少部分地被多个面板包围的框架结构。 面板包括限定具有顶部,底部和后部的外壳的至少侧面,顶部和后部面板。 顶板包括通过其形状的矩形的开口。 设备外壳还包括从外壳的顶板向上延伸的排气管道。 废气导管的横截面为矩形,并与顶板开口环绕并与其流体连通地设置。 排气管道适于将从外壳排出的热空气与进入外壳的冷空气隔离,从而改善外壳的热管理。
    • 5. 发明授权
    • Ducted exhaust equipment enclosure
    • 管道排气设备外壳
    • US08107238B2
    • 2012-01-31
    • US12555697
    • 2009-09-08
    • William KrietzmanRichard Evans Lewis, IIDennis W. Vanlith
    • William KrietzmanRichard Evans Lewis, IIDennis W. Vanlith
    • H05K7/20
    • H05K7/20754H05K7/1488H05K7/20745
    • An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    • 电子设备外壳包括至少部分地被多个面板封闭的框架结构,所述框架限定了一个或多个电子部件安装在其中的隔室,以及排气管道,其适于将从隔室排出的热空气与冷空气进入 隔间,从而改善外壳的热管理。 排气管道包括从隔室的顶板向上延伸的下部管道部分和从下部管道部分的上端向上伸展的上部管道部分。 每个管道部分包括通过铰接角配件连接在一起的四个面板,使得该部分是可折叠的。 上部管道部分包括向外扩张的部分。
    • 10. 发明授权
    • Ratio of open area to closed area in panels for electronic equipment enclosures
    • 电子设备外壳面板开放面积与封闭面积的比例
    • US07438638B2
    • 2008-10-21
    • US11548158
    • 2006-10-10
    • Richard Evans Lewis, IIIan SeatonJames I. Lawrence
    • Richard Evans Lewis, IIIan SeatonJames I. Lawrence
    • H05K7/20H05K5/00
    • H05K9/0041
    • A method of providing an electronic equipment enclosure having a plurality of panels, including identifying at least one panel through which air is intended to flow, determining the design parameters of the identified panel, and providing an electronic equipment enclosure that includes the identified panel, constructed according to the determined design parameters. Determining the design parameters of the identified panel includes first establishing a maximum ratio of open area to closed area of between 60% and 70% and then determining one or more other parameters of the design of the identified panel in view of the established maximum ratio of open area to closed area. Other parameters include the material of which the identified panel is to be constructed, its thickness, and its rigidity. Specific enclosures benefiting from the design process are also described.
    • 一种提供具有多个面板的电子设备外壳的方法,包括识别空气要流动的至少一个面板,确定所识别的面板的设计参数,以及提供包括所识别的面板的电子设备外壳,构成 根据确定的设计参数。 确定所识别的面板的设计参数包括首先建立开放面积与封闭面积的最大比率在60%至70%之间,然后根据建立的最大比例确定所识别面板的设计的一个或多个其他参数 开放区域到封闭区域。 其他参数包括识别的面板要构造的材料,其厚度和刚度。 还描述了受益于设计过程的特定外壳。