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1. 发明授权

US07208096B2 Method of cleaving GaN/sapphire for forming laser mirror facets 失效
标题翻译：切割用于形成激光镜面的GaN /蓝宝石的方法
公开(公告)号：US07208096B2
公开(公告)日：2007-04-24
申请号：US10602714
申请日：2003-06-25
申请人： Ramam Akkipeddi , Zhongli Li , Sudhiranjan Tripathy , Soo Jin Chua
发明人： Ramam Akkipeddi , Zhongli Li , Sudhiranjan Tripathy , Soo Jin Chua
IPC分类号： B44C1/22 , B23K23/00
CPC分类号： H01S5/0201 , H01S5/0014 , H01S5/0202 , H01S5/0213 , H01S2304/12
摘要： A laser device has a substrate and at least one GaN-based layer upon a first surface of the substrate, and the laser device is cleaved by cutting linear grooves into a second surface of the substrate such that the grooves are in alignment with vertical planes of the substrate. The substrate and the at least one GaN-based layer are cleaved along the vertical planes. The cutting is performed using a laser beam from an external laser source.
摘要翻译：激光装置在衬底的第一表面上具有衬底和至少一个GaN基层，并且激光器件通过将线性沟槽切割到衬底的第二表面而被切割，使得沟槽与底物。衬底和至少一个GaN基层沿垂直平面切割。使用来自外部激光源的激光束进行切割。

2. 发明授权

US08671544B2 Methods and moulds for use in fabricating side-ported microneedles 失效
标题翻译：用于制造侧端微针的方法和模具
公开(公告)号：US08671544B2
公开(公告)日：2014-03-18
申请号：US10592559
申请日：2004-03-12
申请人： Meí Ma Chen , Zhongli Li , Chee Yen Lim , Pei Ying Joyce Tan , Minghua Wang
发明人： Yuan Xu , Meí Ma Chen , Zhongli Li , Chee Yen Lim , Pei Ying Joyce Tan
IPC分类号： B23P25/00 , B28B1/48 , B29C33/00 , B23P17/00
CPC分类号： B29C33/0061 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B29C33/301 , B29C33/3857 , B29C33/40 , B29C33/424 , B29C33/56 , B29C59/026 , B29C2791/001 , B29C2793/0009 , B29L2031/756 , B29L2031/759 , B81B2201/055 , B81C99/009 , C25D1/02 , Y10T29/49885 , Y10T29/4998 , Y10T29/49982 , Y10T29/49984 , Y10T29/49986 , Y10T29/49988
摘要： A microneedle mold and a method of manufacturing a microneedle mold are provided for use in fabricating microneedles. The method includes providing a microneedle mold base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the microneedle mold base; and forming side-port forming holes in the microneedle mold base, the side-port forming holes extend in side surfaces of the recesses within the microneedle mold base at side-port forming positions of the recesses.
摘要翻译：提供微针模具和制造微针模具的方法用于制造微针。该方法包括：在其中设置微针模具基座，其中凹部对应于待制造的微针并从微针模具底座的第一表面延伸; 并且在微针模具基座中形成侧口形成孔，所述侧端口形成孔在所述凹部的侧端口形成位置处在所述微针基座内的凹部的侧面上延伸。

3. 发明申请

US20100305516A1 Methods and moulds for use in fabricating side-ported microneedles 失效
标题翻译：用于制造侧端微针的方法和模具
公开(公告)号：US20100305516A1
公开(公告)日：2010-12-02
申请号：US10592559
申请日：2004-03-12
申请人： Yuan Xu , Minghua Wang , Mei Ma Chen , Zhongli Li , Chee Yen Lim , Pei Ying Joyce Tan
发明人： Yuan Xu , Minghua Wang , Mei Ma Chen , Zhongli Li , Chee Yen Lim , Pei Ying Joyce Tan
IPC分类号： A61M5/00 , B22C9/22 , B29C33/42 , C25D1/00
CPC分类号： B29C33/0061 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B29C33/301 , B29C33/3857 , B29C33/40 , B29C33/424 , B29C33/56 , B29C59/026 , B29C2791/001 , B29C2793/0009 , B29L2031/756 , B29L2031/759 , B81B2201/055 , B81C99/009 , C25D1/02 , Y10T29/49885 , Y10T29/4998 , Y10T29/49982 , Y10T29/49984 , Y10T29/49986 , Y10T29/49988
摘要： Side-ported microneedles are produced from a suitably shaped microneedle mould (40). A microneedle mould base (32) is made with a number of microneedle mould recesses (30) in it. One surface of the microneedle mould base (32) is coated with a seed layer (34). The microneedle mould base (32) contains two microneedle mould sheets (24, 26), which are separated to gain access to an internal surface of one of the microneedle mould sheets (24, 26). Side-port forming channels (38) are formed on one of the internal surfaces, intersecting with the recesses (30) within the relevant microneedle mould sheet (24). The two microneedle mould sheets (24, 26) are placed back together and joined together as a unitary microneedle mould (40). The microneedles are formed in the recesses (30) by depositing a microneedle layer (44) therein and on the surface with the seed layer (34). The microneedle layer (44) fails to deposit at side-port forming holes (42) where the side-port forming channels (38) intersect the recesses (30), which result in side-ports (46) in the moulded microneedles (52).
摘要翻译：由适当形状的微针模具（40）制造侧端微针。微针模具基座（32）在其中形成有许多微针模具凹槽（30）。微针模具基座（32）的一个表面涂覆有种子层（34）。微针模具基座（32）包含两个微针模具片（24,26），它们分开以进入其中一个微针模板（24,26）的内表面。侧孔形成通道（38）形成在与相关微针模板（24）内的凹部（30）相交的一个内表面上。将两个微针模具片（24,26）放置在一起并作为整体式微针模具（40）连接在一起。通过在其中放置微针层（44）并在种子层（34）的表面上，在凹部（30）中形成微针。该微针层（44）不能沉积在侧孔形成通道（42）处，其中侧孔形成通道（38）与凹槽（30）相交，这导致模制微针（52）中的侧端口（46））。

4. 发明授权

US07497980B2 Microneedles and microneedle fabrication 失效
标题翻译：微针和微针制造
公开(公告)号：US07497980B2
公开(公告)日：2009-03-03
申请号：US10505035
申请日：2003-11-10
申请人： Yuan Xu , Mei Ma Chen , Zhongli Li , Chee Yen Lim , Pei Ying Joyce Tan
发明人： Yuan Xu , Mei Ma Chen , Zhongli Li , Chee Yen Lim , Pei Ying Joyce Tan
IPC分类号： B29C33/42
CPC分类号： B81C1/00111 , A61M37/0015 , A61M2037/003 , A61M2037/0046 , A61M2037/0053 , B29C33/3878 , B29C33/42 , B29C45/00 , B29C2045/0094 , B29L2031/7544 , B29L2031/756 , B81B2201/055 , B81C2201/034
摘要： A master mould is made by wire cutting a plate in two or more directions to provide a base with an array of master mould needles protruding therefrom. The size and shape of the master mould needles can readily be varied by varying the angles of upward and downward cuts in the two or more directions. The master mould is used to make a secondary mould by hot embossing a secondary mould plate onto the master mould. This forms through-holes in the secondary mould. The secondary mould is plated with a layer of metal, which forms a microneedle array.
摘要翻译：主模具通过在两个或更多个方向上对板进行线切割来制造，以提供具有从其突出的主模具针阵列的基座。通过改变在两个或更多个方向上的向上和向下切割的角度，可以容易地改变主模具针的尺寸和形状。主模具用于通过将二次模板热压在主模上来制造二次模具。这在二次模具中形成通孔。二次模具镀有一层金属，形成微针阵列。

5. 发明申请

US20050118436A1 Method for electroless deposition of a metal layer on selected portions of a substrate 审中-公开
标题翻译：金属层在衬底的选定部分上无电沉积的方法
公开(公告)号：US20050118436A1
公开(公告)日：2005-06-02
申请号：US10512113
申请日：2003-04-23
申请人： Sunil Bhangale , Zhongli Li , Peter Moran
发明人： Sunil Bhangale , Zhongli Li , Peter Moran
IPC分类号： C23C18/18 , C23C18/16 , H05K3/18 , H05K3/24 , B05D5/00 , B32B15/04
CPC分类号： H05K3/243 , C23C18/1605 , C23C18/1608 , C23C18/1879 , H05K3/184 , Y10T428/31678
摘要： The present invention relates to a method for electroless deposition of a metal layer on selected portions of a substrate. A preferred form of the invention relates to a method of depositing a desired metal layer, by electroless deposition, on one or more selected portions of an indium tin oxide (ITO) surface of a substrate. These selected portions are typically transparent conductive paths of ITO. The method includes a number of steps including applying a masking layer onto the surface, the masking layer having one or more apertures formed therein so as to expose the one or more selected portions of the surface: exposing the one or more selected portions of the surface to a colloidal suspension of catalytic particles adapted to adsorb to the substrate surface and to enhance deposition of the desired metal layer, and exposing the one or more selected portions of the surface to an ionic solution containing ions of the desired metal to enable formation of the metal layer.
摘要翻译：本发明涉及一种金属层在衬底的选定部分上无电沉积的方法。本发明的优选形式涉及通过无电沉积在衬底的氧化铟锡（ITO）表面的一个或多个选定部分上沉积所需金属层的方法。这些选择的部分通常是ITO的透明导电路径。该方法包括若干步骤，包括在表面上施加掩模层，掩模层具有形成在其中的一个或多个孔，以暴露表面的一个或多个选定部分：暴露表面的一个或多个选定部分涉及适于吸附到基底表面并催化所需金属层沉积的催化颗粒的胶态悬浮液，并将表面的一个或多个选定部分暴露于含有所需金属离子的离子溶液，以形成金属层。

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