专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140177188A1 LASER ENCAPSULATION OF MULTIPLE DISSIMILAR DEVICES ON A SUBSTRATE 审中-公开
标题翻译：在基板上激光加载多个二极管器件
公开(公告)号：US20140177188A1
公开(公告)日：2014-06-26
申请号：US13727124
申请日：2012-12-26
申请人： QUALCOMM MEMS TECHNOLOGIES, INC.
发明人： Philip Jason Stephanou , Ravindra V. Shenoy , Kwan-Yu Lai , James G. Shook , Nassim Khonsari , Peter Jings Lin , Tsongming Kao , Peng Cheng Lin
IPC分类号： B23K26/20 , H05K7/02
CPC分类号： H05K7/02 , B23K1/0016 , B23K1/0053 , B23K1/0056 , B23K1/19 , B23K26/03 , B23K26/042 , B23K26/206
摘要： This disclosure provides systems, methods and apparatus for packaging of dissimilar devices using electromagnetic radiation from a laser. In one aspect, an apparatus can include a first substrate, a second substrate, and a first device and a second device disposed on the second substrate. A first metal ring on the first substrate contacts a second metal ring on a second substrate, and is heated by a first electromagnetic radiation from a laser to enclose a first cavity containing the first device. A third metal ring on the first substrate contacts a fourth metal ring on the second substrate, and is heated by a second electromagnetic radiation to enclose a second cavity containing the second device. Enclosing the first cavity may be performed under a first atmosphere, and the enclosing the second cavity may be performed under a second, different atmosphere.
摘要翻译：本公开提供了使用来自激光器的电磁辐射来封装不同装置的系统，方法和装置。在一个方面，一种装置可以包括第一基板，第二基板以及设置在第二基板上的第一装置和第二装置。第一衬底上的第一金属环接触第二衬底上的第二金属环，并且被来自激光器的第一电磁辐射加热以封闭包含第一器件的第一腔。第一衬底上的第三金属环接触第二衬底上的第四金属环，并且被第二电磁辐射加热以封闭包含第二器件的第二腔。封闭第一空腔可以在第一气氛下进行，并且封闭第二空腔可以在第二不同的气氛下进行。

2. 发明申请

US20150346478A1 Protection of Thin Film Transistors in a Display Element Array from Visible and Ultraviolet Light 审中-公开
标题翻译：从可见光和紫外光中保护显示元件阵列中的薄膜晶体管
公开(公告)号：US20150346478A1
公开(公告)日：2015-12-03
申请号：US14500690
申请日：2014-09-29
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Cheonhong Kim , Tsongming Kao , Jian Ma , Lixia Zhou , Tallis Young Chang , Shu-Jhih Chen , John Hyunchul Hong
IPC分类号： G02B26/00 , G02B5/00 , G02B5/20 , H01L27/12
CPC分类号： G02B26/001 , G02B5/003 , G02B5/208 , H01L27/1214 , H01L27/1248 , H01L27/1259 , H01L29/78633
摘要： A display assembly includes an array of display elements disposed between a first substrate and a second substrate, the array of display elements including one or more thin film transistors (TFTs). A black mask arrangement is disposed between the first substrate and the second substrate, the black mask arrangement being configured to prevent light entering the display assembly from reaching the TFTs.
摘要翻译：显示组件包括布置在第一衬底和第二衬底之间的显示元件阵列，显示元件阵列包括一个或多个薄膜晶体管（TFT）。黑色掩模布置设置在第一基板和第二基板之间，黑色掩模布置被配置为防止进入显示器组件的光到达TFT。

3. 发明申请

US20150166333A1 MEMS ENCAPSULATION BY MULTILAYER FILM LAMINATION 有权
标题翻译：多层薄膜层叠的MEMS封装
公开(公告)号：US20150166333A1
公开(公告)日：2015-06-18
申请号：US14104915
申请日：2013-12-12
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Wenguang Li , Tsongming Kao
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0058 , B81B7/0038 , B81C1/00333 , B81C2203/0172
摘要： This disclosure provides systems, methods and apparatus for a laminated film enclosing an array of microelectromechanical systems (MEMS) structures. In one aspect, a MEMS apparatus includes a substrate having a device region and an edge region surrounding the device region and an array of MEMS structures on the substrate at the device region. A protective layer is disposed over the array of MEMS structures. A laminated film is disposed over the protective layer and in contact with the substrate to form a seal at the edge region, where the laminated film forms a cavity between the substrate and the laminated film at the device region. The laminated film includes a moisture barrier layer facing away from the array of MEMS structures, and a desiccant layer facing toward the array of MEMS structures.
摘要翻译：本公开提供了用于封装微机电系统（MEMS）结构阵列的层压膜的系统，方法和装置。在一个方面，MEMS装置包括具有器件区域和围绕器件区域的边缘区域以及器件区域上的衬底上的MEMS结构阵列的衬底。保护层设置在MEMS结构阵列上。层叠膜设置在保护层上方并与基板接触以在边缘区域形成密封，其中层压膜在器件区域处在基板和层压膜之间形成空腔。层压膜包括背离MEMS结构阵列的防潮层和面向MEMS结构阵列的干燥剂层。

4. 发明授权

US09156678B2 MEMS encapsulation by multilayer film lamination 有权
标题翻译： MEMS封装通过多层膜层压
公开(公告)号：US09156678B2
公开(公告)日：2015-10-13
申请号：US14104915
申请日：2013-12-12
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Wenguang Li , Tsongming Kao
IPC分类号： H01L23/20 , B81B7/00 , B81C1/00
CPC分类号： B81B7/0058 , B81B7/0038 , B81C1/00333 , B81C2203/0172
摘要： This disclosure provides systems, methods and apparatus for a laminated film enclosing an array of microelectromechanical systems (MEMS) structures. In one aspect, a MEMS apparatus includes a substrate having a device region and an edge region surrounding the device region and an array of MEMS structures on the substrate at the device region. A protective layer is disposed over the array of MEMS structures. A laminated film is disposed over the protective layer and in contact with the substrate to form a seal at the edge region, where the laminated film forms a cavity between the substrate and the laminated film at the device region. The laminated film includes a moisture barrier layer facing away from the array of MEMS structures, and a desiccant layer facing toward the array of MEMS structures.
摘要翻译：本公开提供了用于封装微机电系统（MEMS）结构阵列的层压膜的系统，方法和装置。在一个方面，MEMS装置包括具有器件区域和围绕器件区域的边缘区域以及器件区域上的衬底上的MEMS结构阵列的衬底。保护层设置在MEMS结构阵列上。层叠膜设置在保护层上方并与基板接触以在边缘区域形成密封，其中层压膜在器件区域处在基板和层压膜之间形成空腔。层压膜包括背离MEMS结构阵列的防潮层和面向MEMS结构阵列的干燥剂层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式