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    • 1. 发明授权
    • Capacitive touch sensitive housing and method for making the same
    • 电容式触控式外壳及其制作方法
    • US08692790B2
    • 2014-04-08
    • US13285219
    • 2011-10-31
    • Sheng-Hung YiPen-Yi Liao
    • Sheng-Hung YiPen-Yi Liao
    • G06F3/041
    • H03K17/962G06F3/03547G06F3/044G06F2203/0339H03K2017/9602H03K2217/960755
    • A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.
    • 一种电容式触敏壳体,包括:壳体壁; 形成在壳体壁上的电容式触摸传感器焊盘阵列; 形成在所述壳体壁上的多个导电接合焊盘; 以及形成在壳体壁上的多条导线。 每个导电线从相应的一个触摸传感器焊盘延伸到相应的一个接合焊盘,并且与电容式触摸传感器焊盘和相应的一个接合焊盘相应的一个配合以限定具有分层的触摸传感器单元 包括活性金属层和无电沉积金属层的结构。 活性金属层含有能够引发无电沉积的活性金属。
    • 2. 发明授权
    • Non-deleterious technique for creating continuous conductive circuits
    • 用于创建连续导电电路的无害技术
    • US08621749B2
    • 2014-01-07
    • US13035531
    • 2011-02-25
    • Shen-Hung YiPen-Yi Liao
    • Shen-Hung YiPen-Yi Liao
    • H01R43/00H05K13/00
    • H05K3/188C25D5/02C25D5/10H05K3/027H05K3/185H05K3/24H05K2203/107Y10T29/49126Y10T29/49155Y10T29/49156
    • A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.
    • 在非导电衬底上制造连续导电电路的非有害方法可以开始于在非导电衬底的表面上施加金属基底层。 可以基于电路设计在金属基底层内形成电路图案。 包括电路图案的金属基层可以与非导电基底上的金属基底层的其余部分物理分离。 包围电路图案的非导电性基板表面的区域可以称为电镀区域。 非导电性基板表面的其余部分可以称为非电镀区域。 可以在金属基底层上添加第一金属层。 可以在电镀区域的第一金属层上添加第二金属层。 第二金属层可以导电并限制在非电镀区域的第一金属层上的形成。