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    • 8. 发明授权
    • Nitride semiconductor light emitting device
    • 氮化物半导体发光器件
    • US07470938B2
    • 2008-12-30
    • US10983637
    • 2004-11-09
    • Jae Hoon LeeJeong Wook LeeHyun Kyung KimYong Chun Kim
    • Jae Hoon LeeJeong Wook LeeHyun Kyung KimYong Chun Kim
    • H01L29/06H01L31/0328H01L31/0336H01L31/072H01L31/109H01L29/24H01L33/00H01L29/22H01L21/00
    • H01L33/32H01L33/007H01L33/22Y10S257/918
    • In a nitride semiconductor light emitting device having patterns formed on the upper and lower surfaces of a substrate from which light is emitted in a flip chip bonding structure, the patterns are capable of changing light inclination at the upper and lower surfaces of the substrate to decrease total reflection at the interfaces, thereby improving light emitting efficiency. The device includes a substrate having upper and lower surfaces on which predetermined patterns are formed such that light can be incident within a critical angle, the substrate allowing a gallium nitride-based semiconductor material to be grown thereon, an n-type nitride semiconductor layer formed on the upper surface of the substrate, an active layer formed on the upper surface of the n-type nitride semiconductor layer such that the n-type nitride semiconductor layer is partially exposed, a p-type nitride semiconductor layer formed on the upper surface of the active layer, a p-electrode formed on the upper surface of the p-type nitride semiconductor layer, and an n-side electrode formed on the partially exposed n-type nitride semiconductor layer.
    • 在具有形成在基板的上表面和下表面上的图案的氮化物半导体发光器件中,以倒装芯片接合结构发射光,该图案能够改变在基板的上表面和下表面处的光倾斜度 在界面处的全反射,从而提高发光效率。 该装置包括具有上表面和下表面的基板,预定图案形成在其上,使得光可以临界角入射,所述基板允许在其上生长氮化镓基半导体材料,形成n型氮化物半导体层 在所述基板的上表面上形成有在n型氮化物半导体层的上表面上形成的n型氮化物半导体层被部分露出的有源层,形成在所述n型氮化物半导体层的上表面上的p型氮化物半导体层 有源层,形成在p型氮化物半导体层的上表面上的p电极和形成在部分暴露的n型氮化物半导体层上的n侧电极。