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1. 发明授权

US08199389B2 Vibration elements 有权
标题翻译：振动元件
公开(公告)号：US08199389B2
公开(公告)日：2012-06-12
申请号：US12400911
申请日：2009-03-10
申请人： Mochizuki Eiji , Tetsurou Saitoh , Yukito Sato
发明人： Mochizuki Eiji , Tetsurou Saitoh , Yukito Sato
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B2201/047 , B81C1/00682
摘要： A vibration unit including a frame, a vibration element including a substrate configured to vibrate, and a beam configured to connect the vibration element to the frame. The vibration unit is produced by applying an etching process to at least two surfaces of a substrate. A meeting position of the two surfaces of the substrate is located where a first etching process, which takes place on a first surface of the substrate and a second etching process, which takes place on a second surface of the substrate meet, and is located at a position other than a center position in a width direction of the beam.
摘要翻译：包括框架的振动单元，包括被配置为振动的基板的振动元件以及被配置为将振动元件连接到框架的梁。振动单元通过对基板的至少两个表面施加蚀刻工艺来制造。衬底的两个表面的会合位置位于在衬底的第二表面上发生的在衬底的第一表面上发生的第一蚀刻工艺和在衬底的第二表面上发生的第二蚀刻工艺，并且位于除了梁的宽度方向上的中心位置以外的位置。

2. 发明申请

US20090225384A1 VIBRATION ELEMENTS 有权
标题翻译：振动元件
公开(公告)号：US20090225384A1
公开(公告)日：2009-09-10
申请号：US12400911
申请日：2009-03-10
申请人： Mochizuki Eiji , Tetsurou Saitoh , Yukito Sato
发明人： Mochizuki Eiji , Tetsurou Saitoh , Yukito Sato
IPC分类号： G02B26/08 , H03H9/15
CPC分类号： G02B26/0841 , B81B2201/047 , B81C1/00682
摘要： A vibration unit including a frame, a vibration element including a substrate configured to vibrate, and a beam configured to connect the vibration element to the frame. The vibration unit is produced by applying an etching process to at least two surfaces of a substrate. A meeting position of the two surfaces of the substrate located where a first etching process, which takes place on a first surface of the substrate and a second etching process, which takes place on a second surface of the substrate meet, and is located at a position other than a center position in a width direction of the beam.
摘要翻译：包括框架的振动单元，包括被配置为振动的基板的振动元件以及被配置为将振动元件连接到框架的梁。振动单元通过对基板的至少两个表面施加蚀刻工艺来制造。位于基板的第一表面上发生的第一蚀刻工艺和在基板的第二表面上发生的第二蚀刻工艺的基板的两个表面的会合位置相交并位于除了梁的宽度方向上的中心位置以外的位置。

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