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    • 1. 发明授权
    • Test board for high-frequency system level test
    • 测试板进行高频系统级测试
    • US07233157B2
    • 2007-06-19
    • US11025093
    • 2004-12-28
    • Jung-Kuk LeeYoung-Man AhnSeung-Man ShinJong-Cheol Seo
    • Jung-Kuk LeeYoung-Man AhnSeung-Man ShinJong-Cheol Seo
    • G01R31/02G01R31/26
    • G01R31/2889G01R1/07378
    • A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has surface mounted device (SMD) pads on front and rear surfaces. The SMD pads on the front surface of the interface board are connected with the SMD pads on the rear surface thereof through cross connection wiring within the interface board for a pin swap. The through holes of the main board are connected with the SMD pads on the rear surface of the interface board via iron cores fixed at a guide. A test module socket is mounted on surfaces of the SMD pads on the front surface of the interface board.
    • 用于高频系统级测试的测试板:测试板包括具有填充有导电材料的通孔的主板。 这些孔可以位于主板的已经从其移除的现有模块插座的部分。 接口板在前表面和后表面上具有表面贴装(SMD)贴片。 接口板前表面上的SMD焊盘通过接口板中的交叉连接线与后表面的SMD焊盘连接,用于引脚互换。 主板的通孔通过固定在导轨上的铁芯与接口板背面的SMD焊盘连接。 测试模块插座安装在接口板正面的SMD焊盘表面。