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1. 发明授权

US07600858B2 Micro-fluid ejection head structure 有权
标题翻译：微流体喷头结构
公开(公告)号：US07600858B2
公开(公告)日：2009-10-13
申请号：US11754715
申请日：2007-05-29
申请人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
发明人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
IPC分类号： B41J2/05
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/1404 , B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645 , Y10T29/49135 , Y10T29/49139 , Y10T29/4914 , Y10T29/49401 , Y10T29/4979 , Y10T29/49798
摘要： A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
摘要翻译：一种制造用于微流体喷射装置的微流体喷射头结构的方法。该方法包括将可移除的心轴材料施加到在其装置表面上含有流体喷射致动器的半导体衬底晶片。心轴材料成型为在衬底晶片上提供流体室和流体通道位置。将微加工材料施加到成形心轴和晶片的装置表面，以在成形心轴和晶片上提供喷嘴板和流动特征层。在喷嘴板和流动特征层中形成多个喷嘴孔。然后将成形的心轴材料从衬底晶片的器件表面移除，以在喷嘴板和流动特征层中提供流体室和流体通道。

2. 发明授权

US07254890B2 Method of making a microfluid ejection head structure 有权
标题翻译：制造微流体喷射头结构的方法
公开(公告)号：US07254890B2
公开(公告)日：2007-08-14
申请号：US11026504
申请日：2004-12-30
申请人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
发明人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
IPC分类号： B21D53/76 , B41J2/04
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/1404 , B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645 , Y10T29/49135 , Y10T29/49139 , Y10T29/4914 , Y10T29/49401 , Y10T29/4979 , Y10T29/49798
摘要： A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
摘要翻译：一种制造用于微流体喷射装置的微流体喷射头结构的方法。该方法包括将可移除的心轴材料施加到在其装置表面上含有流体喷射致动器的半导体衬底晶片。心轴材料成型为在衬底晶片上提供流体室和流体通道位置。将微加工材料施加到成形心轴和晶片的装置表面，以在成形心轴和晶片上提供喷嘴板和流动特征层。在喷嘴板和流动特征层中形成多个喷嘴孔。然后将成形的心轴材料从衬底晶片的器件表面移除，以在喷嘴板和流动特征层中提供流体室和流体通道。

3. 发明授权

US07905569B2 Planarization layer for micro-fluid ejection head substrates 有权
标题翻译：用于微流体喷射头基板的平面化层
公开(公告)号：US07905569B2
公开(公告)日：2011-03-15
申请号：US10941493
申请日：2004-09-15
申请人： Byron V. Bell , Craig M. Bertelsen , Brian C. Hart , Girish S. Patil , Sean T. Weaver
发明人： Byron V. Bell , Craig M. Bertelsen , Brian C. Hart , Girish S. Patil , Sean T. Weaver
IPC分类号： B41J2/015 , B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1631
摘要： A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.
摘要翻译：一种用于微流体喷射头基板的基本上无机的平坦化层及其方法。平坦化层包括由一个或多个电介质化合物组成的多个层和沉积在微流体的第二金属层上的总厚度范围为约1微米至约15微米的至少一个旋涂玻璃（SOG）层喷射头基板。平坦化层的最上层选自一种或多种介电化合物和硬掩模材料。

4. 发明授权

US08007990B2 Thick film layers and methods relating thereto 有权
标题翻译：厚膜层及其相关方法
公开(公告)号：US08007990B2
公开(公告)日：2011-08-30
申请号：US12496786
申请日：2009-07-02
申请人： Girish S. Patil , Sean T. Weaver , Rich Wells
发明人： Girish S. Patil , Sean T. Weaver , Rich Wells
IPC分类号： G03F7/26
CPC分类号： B41J2/1603 , B41J2/1631 , B41J2/1645
摘要： Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.
摘要翻译：用于微流体喷射头，微流体喷射头和用于制造微流体喷射头和厚膜层的方法的厚膜层。一种这样的厚膜层衍生自重均分子量为约2500至约4000道尔顿的双官能环氧组分，光酸产生剂，芳基酮溶剂和粘合增强组分。一个这样的厚膜层在固化时具有交联密度，这增加了厚膜层的尺寸稳定性，足以提供具有基本垂直壁的流动特征。

5. 发明申请

US20090269707A1 Thick Film Layers and Methods Relating Thereto 有权
标题翻译：厚膜层及其相关方法
公开(公告)号：US20090269707A1
公开(公告)日：2009-10-29
申请号：US12496786
申请日：2009-07-02
申请人： Girish S. Patil , Sean T. Weaver , Rich Wells
发明人： Girish S. Patil , Sean T. Weaver , Rich Wells
IPC分类号： G03F7/20
CPC分类号： B41J2/1603 , B41J2/1631 , B41J2/1645
摘要： Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.
摘要翻译：用于微流体喷射头，微流体喷射头和用于制造微流体喷射头和厚膜层的方法的厚膜层。一种这样的厚膜层衍生自重均分子量为约2500至约4000道尔顿的双官能环氧组分，光酸产生剂，芳基酮溶剂和粘合增强组分。一个这样的厚膜层在固化时具有交联密度，这增加了厚膜层的尺寸稳定性，足以提供具有基本垂直壁的流动特征。

6. 发明授权

US07571979B2 Thick film layers and methods relating thereto 有权
标题翻译：厚膜层及其相关方法
公开(公告)号：US07571979B2
公开(公告)日：2009-08-11
申请号：US11361731
申请日：2006-02-24
申请人： Girish S. Patil , Sean T. Weaver , Rich Wells
发明人： Girish S. Patil , Sean T. Weaver , Rich Wells
IPC分类号： B41J2/015
CPC分类号： B41J2/1603 , B41J2/1631 , B41J2/1645
摘要： Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.
摘要翻译：用于微流体喷射头，微流体喷射头和用于制造微流体喷射头和厚膜层的方法的厚膜层。一种这样的厚膜层衍生自重均分子量为约2500至约4000道尔顿的双官能环氧组分，光酸产生剂，芳基酮溶剂和粘合增强组分。一个这样的厚膜层在固化时具有交联密度，这增加了厚膜层的尺寸稳定性，足以提供具有基本垂直壁的流动特征。

7. 发明授权

US07938975B2 Method for making a micro-fluid ejection device 有权
标题翻译：制造微流体喷射装置的方法
公开(公告)号：US07938975B2
公开(公告)日：2011-05-10
申请号：US11780234
申请日：2007-07-19
申请人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
发明人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
IPC分类号： G11B5/127
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1645 , B81B2201/052 , B81C1/00531
摘要： A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
摘要翻译：蚀刻半导体衬底的方法。该方法包括以下步骤：将光致抗蚀剂蚀刻掩模层施加到衬底的器件表面。光刻胶蚀刻掩模的选择第一区被掩蔽，成像和显影。照射光致抗蚀剂蚀刻掩模层的选择的第二区域以辅助蚀刻掩模层从选择的第二区域的后蚀刻剥离。蚀刻基板以形成通过基板的厚度的流体供给槽。至少蚀刻掩模层的选择第二区域从衬底去除，由此从蚀刻掩模层的选择的第二区域形成的掩模层残留物显着减少。

8. 发明授权

US07271105B2 Method for making a micro-fluid ejection device 有权
标题翻译：制造微流体喷射装置的方法
公开(公告)号：US07271105B2
公开(公告)日：2007-09-18
申请号：US10941404
申请日：2004-09-15
申请人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
发明人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
IPC分类号： H01L21/461
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1645 , B81B2201/052 , B81C1/00531
摘要： A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
摘要翻译：蚀刻半导体衬底的方法。该方法包括以下步骤：将光致抗蚀剂蚀刻掩模层施加到衬底的器件表面。光刻胶蚀刻掩模的选择第一区被掩蔽，成像和显影。照射光致抗蚀剂蚀刻掩模层的选择的第二区域以辅助蚀刻掩模层从选择的第二区域的后蚀刻剥离。蚀刻基板以形成通过基板的厚度的流体供给槽。至少蚀刻掩模层的选择第二区域从衬底去除，由此从蚀刻掩模层的选择的第二区域形成的掩模层残留物显着减少。

9. 发明授权

US06830646B2 Radiation curable resin layer 有权
标题翻译：辐射固化树脂层
公开(公告)号：US06830646B2
公开(公告)日：2004-12-14
申请号：US10418782
申请日：2003-04-18
申请人： Girish S. Patil , Brian C. Hart
发明人： Girish S. Patil , Brian C. Hart
IPC分类号： G03F7004
CPC分类号： C08G59/38 , B41J2/14129 , B41J2/1606 , C08G59/687 , G03F7/0385 , G03F7/0751
摘要： A radiation curable resin formulation suitable for planarizing an ink jet heater chip. The resin formulation includes a multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium salt photoinitiator, and a non-photoreactive solvent. The resin formulation is substantially devoid of acrylate polymer components. Radiation curable resins according to the invention exhibit enhanced adhesion with the nozzle plate adhesive thereby reducing the incidence of delamination between the nozzle plate and a semiconductor chip containing the resin layer. Another advantage is that the resin layer, according to the invention, reduces pigment flocculation on the surface of the resin layer when using pigment-based ink jet inks.
摘要翻译：一种适于平面化喷墨加热器芯片的可辐射固化树脂配方。树脂配方包括多官能环氧组分，双官能环氧组分，硅烷偶联剂，芳基锍盐光引发剂和非光反应性溶剂。树脂配方基本上不含丙烯酸酯聚合物组分。根据本发明的可辐射固化树脂表现出与喷嘴板粘合剂的增强的粘附性，从而减少喷嘴板和含有树脂层的半导体芯片之间的分层的发生。另一个优点是，当使用颜料基喷墨油墨时，根据本发明的树脂层在树脂层的表面上减少颜料絮凝。

10. 发明授权

US06783918B2 Radiation curable resin layer 有权
公开(公告)号：US06783918B2
公开(公告)日：2004-08-31
申请号：US10413040
申请日：2003-04-14
申请人： Girish S. Patil , Brian C. Hart
发明人： Girish S. Patil , Brian C. Hart
IPC分类号： G03F7075
CPC分类号： C08G59/38 , B41J2/14129 , B41J2/1606 , C08G59/687 , G03F7/0385 , G03F7/0751
摘要： A radiation curable resin formulation suitable for planarizing an ink jet heater chip. The resin formulation includes a multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium salt photoinitiator, and a non-photoreactive solvent. The resin formulation is substantially devoid of acrylate polymer components. Radiation curable resins according to the invention exhibit enhanced adhesion with the nozzle plate adhesive thereby reducing the incidence of delamination between the nozzle plate and a semiconductor chip containing the resin layer. Another advantage is that the resin layer, according to the invention, reduces pigment flocculation on the surface of the resin layer when using pigment-based ink jet inks.

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