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1. 发明申请

US20070109737A1 Computer enclosure 有权
标题翻译：电脑外壳
公开(公告)号：US20070109737A1
公开(公告)日：2007-05-17
申请号：US11648304
申请日：2006-12-29
申请人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
发明人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
IPC分类号： G06F1/16 , H05K7/20
CPC分类号： G06F1/1616 , G06F1/1656 , G06F1/1679 , G06F1/182 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49171
摘要： A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
摘要翻译：公开了一种具有改进的外壳布置的计算设备。外壳的一个方面涉及在结构上结合在一起以形成单一复合结构的外壳部件。在一个实施例中，结构胶用于将至少两个独特部分粘合在一起。外壳的另一方面涉及电结合在一起以形成单一的集成导电构件的外壳部件。在一个实施例中，使用导电膏将至少两个独特部分粘合在一起。改进的外壳在诸如膝上型计算机的便携式计算设备中特别有用。

2. 发明授权

US07310872B2 Computer enclosure 有权
公开(公告)号：US07310872B2
公开(公告)日：2007-12-25
申请号：US10928780
申请日：2004-08-27
申请人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
发明人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
IPC分类号： H01R43/00
CPC分类号： G06F1/1616 , G06F1/1656 , G06F1/1679 , G06F1/182 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49171
摘要： A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

3. 发明申请

US20050023022A1 Computer enclosure 有权
标题翻译：电脑外壳
公开(公告)号：US20050023022A1
公开(公告)日：2005-02-03
申请号：US10928780
申请日：2004-08-27
申请人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
发明人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
IPC分类号： A47B97/00 , G06F1/16 , G06F1/18 , G06F13/12 , H02G15/30 , H05K3/02
CPC分类号： G06F1/1616 , G06F1/1656 , G06F1/1679 , G06F1/182 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49171
摘要： A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
摘要翻译：公开了一种具有改进的外壳布置的计算设备。外壳的一个方面涉及在结构上结合在一起以形成单一复合结构的外壳部件。在一个实施例中，结构胶用于将至少两个独特部分粘合在一起。外壳的另一方面涉及电结合在一起以形成单一的集成导电构件的外壳部件。在一个实施例中，使用导电膏将至少两个独特部分粘合在一起。改进的外壳在诸如膝上型计算机的便携式计算设备中特别有用。

4. 发明授权

US06574096B1 Use of titanium in a notebook computer 有权
标题翻译：在笔记本电脑中使用钛
公开(公告)号：US06574096B1
公开(公告)日：2003-06-03
申请号：US09675538
申请日：2000-09-29
申请人： John Difonzo , Stephen Zadesky , David Lundgren
发明人： John Difonzo , Stephen Zadesky , David Lundgren
IPC分类号： G06F116
CPC分类号： G06F1/1635 , G06F1/1616 , G06F1/1656 , G06F1/1679
摘要： The present invention uses titanium and titanium alloys to form the main and display housings of notebook computers. Specifically, the present invention glues injection molded frames to titanium or titanium alloy sheet metal casings. Continuous beads of glue used to overcome the problems formerly associated with shearing. Bayonet recptors formed in the interior of the main casing's bottom case reduce the number of screws needed to attach components forming the main and display housings. Bayonet structures formed in an exterior portion of an injection molded frame slidably mate with the bayonet receptors to look the bottom case of the main housing in position. In some embodiments, the edges of the bottom case are beveled to form a strong five-sided box.
摘要翻译：本发明使用钛和钛合金来形成笔记本电脑的主显示器壳体。具体地说，本发明将注射成型的框架粘合到钛或钛合金金属外壳上。连续的胶珠用于克服以前与剪切相关的问题。在主壳体底部壳体的内部形成的卡口收纳器减少了连接构成主显示器壳体的部件所需的螺钉数量。形成在注射成型框架的外部部分的卡口结构与卡口式接收器可滑动地配合，以将主壳体的底部壳体放置就位。在一些实施例中，底壳的边缘被倒角以形成坚固的五边框。

5. 发明授权

US07636244B2 Computer enclosure 有权
公开(公告)号：US07636244B2
公开(公告)日：2009-12-22
申请号：US11648304
申请日：2006-12-29
申请人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
发明人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
IPC分类号： H05K7/14 , H05K7/18
CPC分类号： G06F1/1616 , G06F1/1656 , G06F1/1679 , G06F1/182 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49171
摘要： A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

6. 发明授权

US07012189B2 Computer enclosure 有权
公开(公告)号：US07012189B2
公开(公告)日：2006-03-14
申请号：US09821784
申请日：2001-03-28
申请人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
发明人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
IPC分类号： H05K9/00
CPC分类号： G06F1/1616 , G06F1/1656 , G06F1/1679 , G06F1/182 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49171
摘要： A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

7. 发明申请

US20110038120A1 HEAT DISSIPATION IN COMPUTING DEVICE 有权
标题翻译：计算设备中的散热
公开(公告)号：US20110038120A1
公开(公告)日：2011-02-17
申请号：US12912671
申请日：2010-10-26
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/20 , B21D53/02
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

8. 发明申请

US20070165373A1 COMPUTER COMPONENT PROTECTION 失效
标题翻译：电脑组件保护
公开(公告)号：US20070165373A1
公开(公告)日：2007-07-19
申请号：US11624141
申请日：2007-01-17
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/16
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

9. 发明申请

US20090040698A1 COMPUTER COMPONENT PROTECTION 有权
标题翻译：电脑组件保护
公开(公告)号：US20090040698A1
公开(公告)日：2009-02-12
申请号：US12253126
申请日：2008-10-16
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/18
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

10. 发明授权

US07457111B2 Computer component protection 失效
标题翻译：计算机组件保护
公开(公告)号：US07457111B2
公开(公告)日：2008-11-25
申请号：US11624141
申请日：2007-01-17
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/16
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

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