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1. 发明申请

US20070184580A1 Method of making a small substrate compatible for processing 审中-公开
标题翻译：制造小基板兼容加工的方法
公开(公告)号：US20070184580A1
公开(公告)日：2007-08-09
申请号：US10597994
申请日：2005-02-02
申请人： Johan Klootwijk , Cornelis Timmering , Jacob Snijder , Ronald Dekker , Theodorus Michelsen
发明人： Johan Klootwijk , Cornelis Timmering , Jacob Snijder , Ronald Dekker , Theodorus Michelsen
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L2221/68313
摘要： A method of making a comparatively small substrate (12) compatible with manufacturing equipment for a larger-size standard substrate is disclosed. The standard substrate (1) has a surface (10) in which a depression (8) is formed, in which depression the small substrate is connected by means of a layer of a bonding material (13). The depression is formed so as to have a flat bottom (9) extending parallel to the surface. The depression has a depth such that, after the small substrate has been connected with its rear side to the bottom of the depression of the standard substrate by means of the layer of bonding material, the front side (14) of the small substrate forms a free surface which practically coincides with the surface (10) of the carrier wafer. When the standard substrate with the small substrate positioned in the depression is placed into a lithographic stepper, the free surface of the small substrate is placed automatically in a position such that patterns having very small dimensions can be projected onto a photoresist layer formed on said free surface.
摘要翻译：公开了一种制造与较大尺寸标准基板的制造设备兼容的较小基板（12）的方法。标准基板（1）具有其中形成有凹部（8）的表面（10），其中小基板通过粘合材料层（13）连接。凹陷形成为具有平行于表面延伸的平坦的底部（9）。凹陷具有这样的深度，使得在通过粘合材料层将小基板与其后侧连接到标准基板的凹陷的底部之后，小基板的正面（14）形成实际上与载体晶片的表面（10）重合的自由表面。当将具有位于凹陷中的小衬底的标准衬底放置在光刻步进器中时，小衬底的自由表面被自动放置在使得具有非常小的尺寸的图案能够投影到形成在所述自由表面。

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