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    • 1. 发明申请
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US20050156188A1
    • 2005-07-21
    • US10839284
    • 2004-05-06
    • Jae RoSang ChoSeung Chae
    • Jae RoSang ChoSeung Chae
    • H01L21/28H01L21/00H01L21/3205H01L23/52H01L33/32H01L33/40H01L33/00
    • H01L33/40H01L33/32H01L33/42
    • Disclosed herein are a nitride semiconductor light emitting device and a method of manufacturing the same. The nitride semiconductor light emitting device comprises a substrate for growing a gallium nitride-based semiconductor material, an n-type nitride semiconductor layer on the substrate, an active layer on the n-type nitride semiconductor layer such that a predetermined portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer on the active layer, a transparent electrode layer on the p-type nitride semiconductor layer so as to be in an ohmic contact with the p-type nitride semiconductor layer, a p-side bonding pad in the form of a bi-layer of Ta/Au on the transparent electrode layer, and an n-side electrode in the form of a bi-layer of Ta/Au on the exposed portion of the n-type nitride semiconductor layer.
    • 本文公开了一种氮化物半导体发光器件及其制造方法。 氮化物半导体发光器件包括用于生长氮化镓基半导体材料的衬底,衬底上的n型氮化物半导体层,n型氮化物半导体层上的有源层,使得n型氮化物半导体发光器件的预定部分, 露出氮化物半导体层,有源层上的p型氮化物半导体层,p型氮化物半导体层上的透明电极层与p型氮化物半导体层欧姆接触,p型 在透明电极层上形成Ta / Au双层形式的正极焊盘和在n型氮化物的暴露部分上形成Ta / Au双层形式的n侧电极 半导体层。
    • 2. 发明申请
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US20060202217A1
    • 2006-09-14
    • US11431001
    • 2006-05-10
    • Jae RoSang ChoSeung Chae
    • Jae RoSang ChoSeung Chae
    • H01L33/00
    • H01L33/40H01L33/32H01L33/42
    • A nitride semiconductor light emitting device includes a substrate for growing a gallium nitride-based semiconductor material, an n-type nitride semiconductor layer on the substrate, an active layer on the n-type nitride semiconductor layer such that a predetermined portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer on the active layer, a transparent electrode layer on the p-type nitride semiconductor layer so as to be in an ohmic contact with the p-type nitride semiconductor layer, a p-side bonding pad in the form of a bi-layer of Ta/Au on the transparent electrode layer, and an n-side electrode in the form of a bi-layer of Ta/Au on the exposed portion of the n-type nitride semiconductor layer.
    • 氮化物半导体发光器件包括用于生长氮化镓基半导体材料的衬底,衬底上的n型氮化物半导体层,n型氮化物半导体层上的有源层,使得n型氮化物半导体材料的预定部分, 露出氮化物半导体层,有源层上的p型氮化物半导体层,p型氮化物半导体层上的透明电极层与p型氮化物半导体层欧姆接触,p型 在透明电极层上形成Ta / Au双层形式的正极焊盘和在n型氮化物的暴露部分上形成Ta / Au双层形式的n侧电极 半导体层。