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    • 9. 发明授权
    • Methods for fabricating semiconductor memory with process induced strain
    • 用工艺诱导应变制造半导体存储器的方法
    • US08592891B1
    • 2013-11-26
    • US13539463
    • 2012-07-01
    • Igor PolishchukSagy LevyKrishnaswamy RamkumarJeong Byun
    • Igor PolishchukSagy LevyKrishnaswamy RamkumarJeong Byun
    • H01L29/76
    • H01L29/4234H01L21/28282H01L29/513H01L29/518H01L29/66833H01L29/792
    • A semiconductor device and method of fabricating the same are provided. In one embodiment, the semiconductor device includes a memory transistor with an oxide-nitride-nitride-oxide (ONNO) stack disposed above a channel region. The ONNO stack comprises a tunnel dielectric layer disposed above the channel region, a multi-layer charge-trapping region disposed above the tunnel dielectric layer, and a blocking dielectric layer disposed above the multi-layer charge-trapping region. The multi-layer charge-trapping region includes a substantially trap-free layer comprising an oxygen-rich nitride and a trap-dense layer disposed above the trap-free layer. The semiconductor device further includes a strain inducing structure including a strain inducing layer disposed proximal to the ONNO stack to increase charge retention of the multi-layer charge-trapping region. Other embodiments are also disclosed.
    • 提供了半导体器件及其制造方法。 在一个实施例中,半导体器件包括具有设置在沟道区上方的氧化氮化物 - 氮化物 - 氧化物(ONNO)堆的存储晶体管。 ONNO堆叠包括设置在沟道区上方的隧道介电层,设置在隧道介电层上方的多层电荷捕获区,以及设置在多层电荷俘获区上方的阻挡介质层。 多层电荷捕获区域包括基本上无陷阱层,其包含富含氧的氮化物和设置在无阱层之上的陷阱致密层。 半导体器件还包括应变诱导结构,其包括设置在ONNO堆叠附近的应变诱导层,以增加多层电荷俘获区域的电荷保留。 还公开了其他实施例。
    • 10. 发明授权
    • Methods for fabricating semiconductor memory with process induced strain
    • 用工艺诱导应变制造半导体存储器的方法
    • US08691648B1
    • 2014-04-08
    • US13168711
    • 2011-06-24
    • Igor PolishchukSagy LevyKrishnaswamy RamkumarJeong Soo Byun
    • Igor PolishchukSagy LevyKrishnaswamy RamkumarJeong Soo Byun
    • H01L21/336
    • H01L21/28282H01L29/66833H01L29/792
    • Non-volatile semiconductor memories and methods of fabricating the same to improve performance thereof are provided. In one embodiment, the method includes: (i) forming a gate for a non-volatile memory transistor on a surface of a substrate overlaying a channel region formed therein, the gate including a charge trapping layer; and (ii) forming a strain inducing structure over the gate of the non-volatile memory transistor to increase charge retention of the charge trapping layer. Preferably, the memory transistor is a silicon-oxide-nitride-oxide-silicon (SONOS) transistor comprising a SONOS gate stack. More preferably, the memory also includes a logic transistor on the substrate, and the step of forming a strain inducing structure comprises the step of forming the strain inducing structure over the logic transistor. Other embodiments are also disclosed.
    • 提供非易失性半导体存储器及其制造方法以改善其性能。 在一个实施例中,该方法包括:(i)在覆盖其中形成的沟道区的衬底的表面上形成用于非易失性存储晶体管的栅极,栅极包括电荷俘获层; 和(ii)在非易失性存储晶体管的栅极上形成应变诱导结构,以增加电荷俘获层的电荷保留。 优选地,存储晶体管是包括SONOS栅极堆叠的氧化硅 - 氧化物 - 氮化物 - 氧化物 - 硅(SONOS)晶体管。 更优选地,存储器还包括在衬底上的逻辑晶体管,并且形成应变诱导结构的步骤包括在逻辑晶体管上形成应变诱导结构的步骤。 还公开了其他实施例。