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1. 发明授权

US6090301A Method for fabricating bump forming plate member 失效
标题翻译：凸块形成板构件的制造方法
公开(公告)号：US6090301A
公开(公告)日：2000-07-18
申请号：US848717
申请日：1997-05-19
申请人： Masataka Mizukoshi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Junichi Kasai
发明人： Masataka Mizukoshi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Junichi Kasai
IPC分类号： H01L21/48 , H01L21/60 , H01L21/68 , H05K3/34 , H01L21/302
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01072 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K3/3478
摘要： A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also subjected to isotropic etching to deepen the grooves. The method can further includes additional anisotropic and isotropic etchings. Also, a method for fabricating a metallic bump forming plate member is disclosed. This method uses the above described crystalline plate having the grooves, and includes fabrication of a replica using the crystalline plate as an original, and fabrication of a metallic bump forming plate member using the replica as an original.
摘要翻译：一种用于制造凸块形成板构件的方法，通过该凸块形成板构件可以在电子部件上形成凸块。在结晶板的表面上形成掩模，对各结晶板进行各向异性蚀刻，形成多个槽。晶片也进行各向同性蚀刻以加深槽。该方法还可以包括额外的各向异性和各向同性蚀刻。此外，公开了一种用于制造金属凸块形成板构件的方法。该方法使用上述具有凹槽的晶片，并且包括使用原版的晶体板制造复制品，以及使用该复制品作为原件制造金属凸块形成板构件。

2. 发明授权

US06319810B1 Method for forming solder bumps 失效
标题翻译：形成焊锡凸块的方法
公开(公告)号：US06319810B1
公开(公告)日：2001-11-20
申请号：US08659356
申请日：1996-06-06
申请人： Masayuki Ochiai , Yasuo Yamagishi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Masataka Mizukoshi , Yuuji Watanabe
发明人： Masayuki Ochiai , Yasuo Yamagishi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Masataka Mizukoshi , Yuuji Watanabe
IPC分类号： H01L2144
CPC分类号： H01L24/12 , B23K3/0623 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L2224/11003 , H01L2224/1111 , H01L2224/11334 , H01L2224/13099 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H05K3/3463 , H05K3/3478 , H05K3/3484 , H05K3/3489 , H05K2201/10992 , H05K2203/0113 , H05K2203/016 , H05K2203/0278 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/087 , H05K2203/1105 , H05K2203/1157 , H05K2203/1476 , H01L2924/00 , H01L2224/48
摘要： Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.
摘要翻译：在诸如其上形成有电极焊盘的半导体芯片的第一部件上形成焊料凸块的方法。准备具有孔的平板，并通过挤压填充焊膏。然后平板与第一构件重叠，平板在第一板上。平板和第一构件被加热到高于焊膏中的焊料合金的熔点的温度。因此，可以获得具有相同尺寸和均匀结构的焊料凸块。

3. 发明授权

US06271110B1 Bump-forming method using two plates and electronic device 失效
标题翻译：凸起成型方法采用两块板和电子装置
公开(公告)号：US06271110B1
公开(公告)日：2001-08-07
申请号：US09118064
申请日：1998-07-17
申请人： Ichiro Yamaguchi , Koki Otake , Masahiro Yoshikawa
发明人： Ichiro Yamaguchi , Koki Otake , Masahiro Yoshikawa
IPC分类号： H01L2144
CPC分类号： B23K3/0623 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H01L2924/351 , H05K3/3463 , H05K3/3478 , H05K3/3484 , H05K3/3489 , H05K2201/10992 , H05K2203/0113 , H05K2203/016 , H05K2203/0278 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/087 , H05K2203/1105 , H05K2203/1157 , H05K2203/1476 , H01L2924/00 , H01L2924/00014
摘要： First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.
摘要翻译：制备第一和第二球形成板。第一板的空腔和第二板20的空腔分别用焊膏填充。第一板和第二板相互放置成面对的关系，并加热形成金属球，每个金属球对应于第一板的一个空腔中的焊膏的总金属成分和第二板中的一个空腔。金属球形成在下板10的空腔中。金属球从第一板的空腔传送到要在其上形成凸块的装置。

4. 发明授权

US06528346B2 Bump-forming method using two plates and electronic device 失效
标题翻译：凸起成型方法采用两块板和电子装置
公开(公告)号：US06528346B2
公开(公告)日：2003-03-04
申请号：US09749521
申请日：2000-12-28
申请人： Masayuki Ochiai , Hidefumi Ueda , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Koki Otake , Junichi Kasai , Nobuo Kamehara , Yasuo Yamagishi , Masataka Mizukoshi
发明人： Masayuki Ochiai , Hidefumi Ueda , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Koki Otake , Junichi Kasai , Nobuo Kamehara , Yasuo Yamagishi , Masataka Mizukoshi
IPC分类号： H01L2148
CPC分类号： B23K3/0623 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H01L2924/351 , H05K3/3463 , H05K3/3478 , H05K3/3484 , H05K3/3489 , H05K2201/10992 , H05K2203/0113 , H05K2203/016 , H05K2203/0278 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/087 , H05K2203/1105 , H05K2203/1157 , H05K2203/1476 , H01L2924/00 , H01L2224/05599
摘要： First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.
摘要翻译：制备第一和第二球形成板。第一板的空腔和第二板20的空腔分别用焊膏填充。第一板和第二板相互放置成面对的关系，并加热形成金属球，每个金属球对应于第一板的一个空腔中的焊膏的总金属成分和第二板中的一个空腔。金属球形成在下板10的空腔中。金属球从第一板的空腔传送到要在其上形成凸块的装置。

5. 发明授权

US6022759A Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit 失效
标题翻译：半导体装置的制造方法，半导体装置用基板和半导体装置装置
公开(公告)号：US6022759A
公开(公告)日：2000-02-08
申请号：US25327
申请日：1998-02-18
申请人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
发明人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/10 , H01L21/44 , H01L21/58
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/3128 , H01L23/49805 , H01L25/105 , H01L2224/32225 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/83385 , H01L2224/8547 , H01L2225/1023 , H01L2225/1041 , H01L2225/1094 , H01L23/5387 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107
摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
摘要翻译：半导体器件包括半导体元件，半导体器件基底元件，其具有安装半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂元件。半导体器件基底部件包括基部和由基部支撑的引线部。引线部分电连接到外部连接端子。半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。弯曲部分位于半导体器件基底部件的边缘部分。

6. 发明授权

US5920117A Semiconductor device and method of forming the device 失效
标题翻译：半导体装置及其形成方法
公开(公告)号：US5920117A
公开(公告)日：1999-07-06
申请号：US819806
申请日：1997-03-18
申请人： Michio Sono , Masashi Takenaka , Masanori Yoshimoto , Tsuyoshi Aoki , Ichiro Yamaguchi , Koki Otake
发明人： Michio Sono , Masashi Takenaka , Masanori Yoshimoto , Tsuyoshi Aoki , Ichiro Yamaguchi , Koki Otake
IPC分类号： H01L23/28 , H01L23/12 , H01L23/13 , H01L23/31 , H01L23/433 , H01L23/495
CPC分类号： H01L23/13 , H01L23/3128 , H01L23/4334 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/181 , H01L2924/30107
摘要： A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.
摘要翻译：一种半导体器件，包括具有下表面的板，在板上形成的容器部分，设置在板的下表面上的外部连接节点，设置在容器部分内部并由板固定的支撑构件，半导体芯片固定在支撑构件上并与外部连接节点电连接，并且密封树脂完全填充容器部分以完全覆盖半导体芯片。

7. 发明授权

US6025258A Method for fabricating solder bumps by forming solder balls with a solder ball forming member 失效
标题翻译：通过用焊球形成部件形成焊球来制造焊料凸块的方法
公开(公告)号：US6025258A
公开(公告)日：2000-02-15
申请号：US516284
申请日：1995-08-17
申请人： Masayuki Ochiai , Hidefumi Ueda , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Koki Otake , Junichi Kasai , Nobuo Kamehara , Yasuo Yamagishi , Masataka Mizukoshi
发明人： Masayuki Ochiai , Hidefumi Ueda , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Koki Otake , Junichi Kasai , Nobuo Kamehara , Yasuo Yamagishi , Masataka Mizukoshi
IPC分类号： B23K3/06 , H01L21/48 , H01L21/60 , H01L21/68 , H05K3/34 , H01L21/283
CPC分类号： H01L24/742 , B23K3/0623 , H01L21/4853 , H01L21/6835 , H01L24/11 , H05K3/3484 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/11002 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H05K2201/10992 , H05K2203/0113 , H05K2203/016 , H05K2203/0278 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/087 , H05K2203/1105 , H05K2203/1157 , H05K2203/1476 , H05K3/3463 , H05K3/3489
摘要： A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.
摘要翻译：一种用于在半导体芯片上制造焊料凸块的方法。制备具有平坦表面的焊球形成构件和以预定图案布置在平坦表面上的多个空腔。然后用焊膏填充空腔，并将焊球形成构件加热到高于焊料熔点的温度，使得焊膏中的熔融焊料粉由于表面张力而形成焊球。然后将半导体芯片移动到焊球形成部件，以将加热的焊球从焊球形成部件转移到半导体芯片。

8. 发明授权

US5747874A Semiconductor device, base member for semiconductor device and semiconductor device unit 失效
标题翻译：半导体器件，半导体器件用基板和半导体器件单元
公开(公告)号：US5747874A
公开(公告)日：1998-05-05
申请号：US529784
申请日：1995-09-18
申请人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
发明人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/10 , H01L23/02
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/3128 , H01L23/49805 , H01L25/105 , H01L2224/32225 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/83385 , H01L2224/8547 , H01L2225/1023 , H01L2225/1041 , H01L2225/1094 , H01L23/5387 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107
摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
摘要翻译：半导体器件包括半导体元件，半导体器件基底元件，其具有安装有半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂元件。半导体器件基底部件包括基部和由基部支撑的引线部。引线部分电连接到外部连接端子。半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。弯曲部分位于半导体器件基底部件的边缘部分。

9. 发明授权

US5643831A Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device 失效
标题翻译：在具有使用焊膏的孔的板上形成焊球并将焊球转移到半导体器件的工艺
公开(公告)号：US5643831A
公开(公告)日：1997-07-01
申请号：US547532
申请日：1995-10-24
申请人： Masayuki Ochiai , Hidefumi Ueda , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Koki Otake , Junichi Kasai , Nobuo Kamehara , Yasuo Yamagishi , Masataka Mizukoshi , Yutaka Yamada , Susumu Abe
发明人： Masayuki Ochiai , Hidefumi Ueda , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Koki Otake , Junichi Kasai , Nobuo Kamehara , Yasuo Yamagishi , Masataka Mizukoshi , Yutaka Yamada , Susumu Abe
IPC分类号： B23K3/06 , H01L21/48 , H01L21/60 , H01L21/68 , H05K3/34 , H01L21/283
CPC分类号： H05K3/3484 , B23K3/0623 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K2201/10992 , H05K2203/0113 , H05K2203/016 , H05K2203/0338 , H05K2203/041 , H05K2203/1476 , H05K3/3463 , H05K3/3489
摘要： A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a crystallographic plane, and an orientation flat in a crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.
摘要翻译：一种使用具有空腔的焊球形成板制造半导体器件的方法。该板由具有<110>结晶平面中的平坦表面的硅板制成，并且在<1-11>晶面中平行取向。通过蚀刻在板的平坦表面上形成空腔，使用具有菱形形状的开口的掩模，其布置成使得菱形的一侧大致平行于<1-11>晶面。结果，形成了具有楔形底部的空腔。然后用焊膏填充空腔，并在板中处于倾斜位置的同时加热以在空腔中形成焊球。然后将焊球从板转移到半导体芯片。

10. 发明授权

US08407982B2 End burning type gas generator 有权
标题翻译：末端燃烧式气体发生器
公开(公告)号：US08407982B2
公开(公告)日：2013-04-02
申请号：US12404074
申请日：2009-03-13
申请人： Takemasa Koreki , Ichiro Yamaguchi
发明人： Takemasa Koreki , Ichiro Yamaguchi
IPC分类号： F02K9/00
CPC分类号： F02K9/30 , F02K9/22
摘要： An end burning type gas generator includes a hollow cylindrical combustor, a propellant that is densely charged in the combustor concentrically and in a plurality of layers without leaving a large void in an internal cross section and that has the same sectional area in each of the layers, and an interstructure separating the plurality of layers from each other and connecting only at a turning portion at an axial end. The propellant end burns sequentially, progressing via the turning portion, beginning with an outermost layer or an innermost layer. The turning portion includes an end outer plate continuously surrounding ends of inner propellant and outer propellant, and a burning rate increasing member provided along the inner surface of the end outer plate to increase the burning rate of the propellant. The end outer plate is shaped such that the burning area at the turning portion remains substantially constant.
摘要翻译：末端燃烧式气体发生器包括中空圆柱形燃烧器，在燃烧室中同心且多层密集地充电的推进剂，而不会在内部横截面中留下大的空隙，并且在各层中具有相同的截面面积以及将多个层彼此分离并且仅在轴向端部处的转动部分处连接的结构。推进剂端部顺序地燃烧，通过转向部分从最外层或最内层开始。转向部分包括连续围绕内部推进剂和外推进剂的端部的端部外板，以及沿着端部外板的内表面设置的燃烧速率增加部件，以增加推进剂的燃烧速率。端外板成形为使得转向部分处的燃烧区域基本保持恒定。

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