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1. 发明申请

US20080054918A1 VERTICAL TYPE HIGH FREQUENCY PROBE CARD 有权
标题翻译：垂直型高频探头卡
公开(公告)号：US20080054918A1
公开(公告)日：2008-03-06
申请号：US11511285
申请日：2006-08-29
申请人： Hsin-Hung Lin , Shih-Cheng Wu , Wei-Cheng Ku , Chien-Liang Chen , Ming-Chi Chen , Hendra Sudin
发明人： Hsin-Hung Lin , Shih-Cheng Wu , Wei-Cheng Ku , Chien-Liang Chen , Ming-Chi Chen , Hendra Sudin
IPC分类号： G01R31/02
CPC分类号： G01R1/07371 , G01R1/06772
摘要： A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.
摘要翻译：垂直型探针卡包括电路板，其具有信号电路和接地电路，其布置成使得每个信号电路并联并且邻近一个接地电路并且与接地电路保持预定距离，并且探针组件，其布置在电路板的底侧，并具有上引导板，下引导板，设置在下引导板上的导电层，多个信号探头，分别电连接到信号电路并邻近多个补偿探针和至少一个接地探针，以使得信号，补偿和接地探针垂直插入上，下引导板的方式电连接到接地电路，并且导电层通过补偿探针和接地探头，同时与信号探头电绝缘。

2. 发明授权

US07368928B2 Vertical type high frequency probe card 有权
标题翻译：垂直式高频探针卡
公开(公告)号：US07368928B2
公开(公告)日：2008-05-06
申请号：US11511285
申请日：2006-08-29
申请人： Hsin-Hung Lin , Shih-Cheng Wu , Wei-Cheng Ku , Chien-Liang Chen , Ming-Chi Chen , Hendra Sudin
发明人： Hsin-Hung Lin , Shih-Cheng Wu , Wei-Cheng Ku , Chien-Liang Chen , Ming-Chi Chen , Hendra Sudin
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R1/07371 , G01R1/06772
摘要： A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.
摘要翻译：垂直型探针卡包括电路板，其具有信号电路和接地电路，其布置成使得每个信号电路并联并且邻近一个接地电路并且与接地电路保持预定距离，并且探针组件，其布置在电路板的底侧，并具有上引导板，下引导板，设置在下引导板上的导电层，多个信号探头，分别电连接到信号电路并邻近多个补偿探针和至少一个接地探针，以使得信号，补偿和接地探针垂直插入上，下引导板的方式电连接到接地电路，并且导电层通过补偿探针和接地探头，同时与信号探头电绝缘。

3. 发明申请

US20080007278A1 High-frequency probe card and transmission line for high-frequency probe card 有权
标题翻译：高频探针卡和高频探针卡传输线
公开(公告)号：US20080007278A1
公开(公告)日：2008-01-10
申请号：US11583740
申请日：2006-10-20
申请人： Wei-Cheng Ku , Hsin-Hung Lin , Chih-Hao Ho , Te-Chen Feng
发明人： Wei-Cheng Ku , Hsin-Hung Lin , Chih-Hao Ho , Te-Chen Feng
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/06772
摘要： A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
摘要翻译：高频探针卡包括具有信号电路和接地电路的电路板，各传输线均具有双线结构，包括用于传输高频信号的第一引线和连接到接地电路的第二引线，以及信号探针。由测试机提供的信号电路的高频测试信号可以通过第一个引线传输到信号探头。由于接地电路和第二引线分别与信号电路和第一引线相邻地设置，所以可以有效地发送高频信号，并且可以在高频信号传输期间保持特性阻抗匹配。传输线的双线结构的直径等于或小于1毫米，从而可以安装大量的传输线，从而可以实现大量电子元件的高频测试。

4. 发明授权

US07683645B2 High-frequency probe card and transmission line for high-frequency probe card 有权
标题翻译：高频探针卡和高频探针卡传输线
公开(公告)号：US07683645B2
公开(公告)日：2010-03-23
申请号：US11583740
申请日：2006-10-20
申请人： Wei-Cheng Ku , Hsin-Hung Lin , Chih-Hao Ho , Te-Chen Feng
发明人： Wei-Cheng Ku , Hsin-Hung Lin , Chih-Hao Ho , Te-Chen Feng
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/06772
摘要： A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
摘要翻译：高频探针卡包括具有信号电路和接地电路的电路板，各传输线均具有双线结构，包括用于传输高频信号的第一引线和连接到接地电路的第二引线，以及信号探针。由测试机提供的信号电路的高频测试信号可以通过第一个引线传输到信号探头。由于接地电路和第二引线分别与信号电路和第一引线相邻地设置，所以可以有效地发送高频信号，并且可以在高频信号传输期间保持特性阻抗匹配。传输线的双线结构的直径等于或小于1毫米，从而可以安装大量的传输线，从而可以实现大量电子元件的高频测试。

5. 发明授权

US08638116B2 Probe card having configurable structure for exchanging or swapping electronic components for impedance matching and impedance matching method therefore 有权
标题翻译：因此，具有用于交换或交换用于阻抗匹配和阻抗匹配方法的电子部件的可配置结构的探针卡
公开(公告)号：US08638116B2
公开(公告)日：2014-01-28
申请号：US13044564
申请日：2011-03-10
申请人： Chao-Ching Huang , Chih-Hao Ho , Wei-Cheng Ku
发明人： Chao-Ching Huang , Chih-Hao Ho , Wei-Cheng Ku
IPC分类号： G01R31/00
CPC分类号： G01R31/2887 , G01R1/07314 , G01R31/2889
摘要： A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
摘要翻译：提供具有用于交换/交换用于阻抗匹配的电子部件的可配置结构的探针卡和阻抗方法。在探针卡中，施加的力施加在电子部件上，以使电子部件与支撑单元的至少一个导电接触垫电连接。支持单元是电路板或空间变压器。为了促进电子部件的交换或交换，可以移除施加的力。探针卡包括能够在按压位置和非按压位置之间移动的按压板。按压板具有在按压板处于按压位置时与电子部件的顶端接触的按压面。因此，可以通过改变压板的定位来产生或去除施加的力。

6. 发明申请

US20120274347A1 INTEGRATED HIGH-SPEED PROBE SYSTEM 有权
标题翻译：集成高速探头系统
公开(公告)号：US20120274347A1
公开(公告)日：2012-11-01
申请号：US13450460
申请日：2012-04-18
申请人： Chun-Chi Wang , Chia-Tai Chang , Ya-Yun Cheng , Wei-Cheng Ku , Chao-Ping Hsieh
发明人： Chun-Chi Wang , Chia-Tai Chang , Ya-Yun Cheng , Wei-Cheng Ku , Chao-Ping Hsieh
IPC分类号： G01R1/073
CPC分类号： G01R1/067 , G01R1/06772 , G01R31/02 , G01R31/2851 , G01R31/2889 , Y10T29/49218
摘要： An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.
摘要翻译：提供集成的高速探头系统。集成高速探针系统包括用于将来自测试仪器的低频测试信号通过探针组件的第一探头传送到DUT的电路基板，以及用于将来自测试仪的高频测试信号传输到高速基板的高速基板被测件。高速基板从测试区域中的电路基板的上表面延伸到探针区域中的电路基板的下表面，用于邻近探针组件并电连接第二探针。以这种方式，测试仪可以通过集成的高速探头系统传输不同频率的测试信号。

7. 发明授权

US08884640B2 Integrated high-speed probe system 有权
标题翻译：集成高速探头系统
公开(公告)号：US08884640B2
公开(公告)日：2014-11-11
申请号：US13450460
申请日：2012-04-18
申请人： Chun-Chi Wang , Chia-Tai Chang , Ya-Yun Cheng , Wei-Cheng Ku , Chao-Ping Hsieh
发明人： Chun-Chi Wang , Chia-Tai Chang , Ya-Yun Cheng , Wei-Cheng Ku , Chao-Ping Hsieh
IPC分类号： G01R31/02 , G01R31/28 , G01R1/067
CPC分类号： G01R1/067 , G01R1/06772 , G01R31/02 , G01R31/2851 , G01R31/2889 , Y10T29/49218
摘要： An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.
摘要翻译：提供集成的高速探头系统。集成高速探针系统包括用于将来自测试仪器的低频测试信号通过探针组件的第一探头传送到DUT的电路基板，以及用于将来自测试仪的高频测试信号传输到高速基板的高速基板被测件。高速基板从测试区域中的电路基板的上表面延伸到探针区域中的电路基板的下表面，用于邻近探针组件并电连接第二探针。以这种方式，测试仪可以通过集成的高速探头系统传输不同频率的测试信号。

8. 发明申请

US20110221462A1 PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING AND IMPEDANCE MATCHING METHOD THEREFORE 有权
标题翻译：具有用于交换或交换电子部件的可配置结构的探针卡，用于阻抗匹配和阻抗匹配方法
公开(公告)号：US20110221462A1
公开(公告)日：2011-09-15
申请号：US13044564
申请日：2011-03-10
申请人： Chao-Ching Huang , Chih-Hao Ho , Wei-Cheng Ku
发明人： Chao-Ching Huang , Chih-Hao Ho , Wei-Cheng Ku
IPC分类号： G01R31/00
CPC分类号： G01R31/2887 , G01R1/07314 , G01R31/2889
摘要： A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
摘要翻译：提供具有用于交换/交换用于阻抗匹配的电子部件的可配置结构的探针卡和阻抗方法。在探针卡中，施加的力施加在电子部件上，以使电子部件与支撑单元的至少一个导电接触垫电连接。支持单元是电路板或空间变压器。为了促进电子部件的交换或交换，可以移除施加的力。探针卡包括能够在按压位置和非按压位置之间移动的按压板。按压板具有在按压板处于按压位置时与电子部件的顶端接触的按压面。因此，可以通过改变压板的定位来产生或去除施加的力。

9. 发明授权

US07724009B2 Method of making high-frequency probe, probe card using the high-frequency probe 有权
标题翻译：高频探头制作方法，探头卡采用高频探头
公开(公告)号：US07724009B2
公开(公告)日：2010-05-25
申请号：US12433952
申请日：2009-05-01
申请人： Wei-Cheng Ku , Kuan-Chun Chou
发明人： Wei-Cheng Ku , Kuan-Chun Chou
IPC分类号： G01R31/02
CPC分类号： G01R1/06772 , G01R1/07342 , G01R3/00
摘要： A high frequency probe preparation method for making a high frequency probe for high frequency testing to assure signal integrity by means of making a sleeve assembly subject to the size of a predetermined bare needle and then sleeving bare needle by the sleeve assembly to form a high-frequency probe is disclosed to include the steps of: a) providing an insulated tube, and b) forming a conducting layer on the outer surface of the insulated tube which having a metal layer for grounding. The insulated tube and the conducting layer constitute the sleeve assembly. The metal layer is formed by means of physical deposition, chemical deposition, mixture of physical and chemical deposition or electrochemical deposition.
摘要翻译：一种高频探头制备方法，用于制造用于高频测试的高频探针，以通过使套筒组件受到预定的裸针的尺寸来确保信号完整性，然后通过套筒组件套入裸针，公开了一种频率探头，包括以下步骤：a）提供绝缘管，以及b）在绝缘管的外表面上形成导电层，该绝缘管具有用于接地的金属层。绝缘管和导电层构成套筒组件。金属层通过物理沉积，化学沉积，物理和化学沉积的混合或电化学沉积形成。

10. 发明申请

US20070200584A1 High frequency cantilever-type probe card 审中-公开
标题翻译：高频悬臂式探针卡
公开(公告)号：US20070200584A1
公开(公告)日：2007-08-30
申请号：US11704331
申请日：2007-02-09
申请人： Wei-Cheng Ku
发明人： Wei-Cheng Ku
IPC分类号： G01R31/02
CPC分类号： G01R1/06772 , G01R1/07342
摘要： A cantilever-type probe card includes a circuit board having a first surface on which a plurality of signal contact pads and grounding contact pads are formed, a locating ring mounted on the first surface of the circuit board, and a plurality of probe pins, each of which is partially supported by the locating ring. Each of the probe pins has an electrically conducting core having an exposed first end electrically connected to one of the signal contact pads of the circuit board, and an exposed second end suspending outside the locating ring for probing a test contact, and a metal film insulatively spaced from the electrically conducting core and electrically connected to one of the grounding contact pads of the circuit board.
摘要翻译：悬臂型探针卡包括具有第一表面的电路板，多个信号接触焊盘和接地焊盘形成在其上，安装在电路板的第一表面上的定位环和多个探针，每个探针其部分地由定位环支撑。每个探针具有导电芯，其具有电连接到电路板的信号接触焊盘之一的暴露的第一端，以及暴露的第二端，悬挂在定位环的外侧，用于探测测试接触，以及金属膜绝对地与导电芯间隔开并电连接到电路板的接地接触焊盘之一。

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