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1. 发明授权

US06664344B1 Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product 有权
标题翻译：聚环氧化物，酚类共缩合物和鏻多酚分子缔合产物的组成
公开(公告)号：US06664344B1
公开(公告)日：2003-12-16
申请号：US09762950
申请日：2001-02-15
申请人： Hiromi Oki , Yoshiyuki Go , Sumiya Miyake , Yoshihito Akiyama
发明人： Hiromi Oki , Yoshiyuki Go , Sumiya Miyake , Yoshihito Akiyama
IPC分类号： C08L6300
CPC分类号： H01L23/293 , C08G59/621 , C08G59/688 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.
摘要翻译：本发明提供了具有快速固化性和优异的储存稳定性的环氧树脂组合物，并且在电子和电气材料领域中是有用的。也就是说，本发明是一种环氧树脂组合物，其包含分子中具有两个以上环氧基的化合物（A），分子中具有两个以上酚羟基的共缩合产物（B）和分子缔合四取代鏻（X）的产物（C），分子中具有两个或多个酚羟基的化合物（Y）和分子中具有两个或多个酚羟基的化合物（Y）的共轭碱所述共轭碱是通过从分子中具有两个或多个酚羟基的上述化合物（Y）除去氢原子得到的酚盐型化合物。

2. 发明授权

US07442729B2 Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt 失效
标题翻译：环氧树脂，多酚化合物和三取代膦酸酯盐的组成
公开(公告)号：US07442729B2
公开(公告)日：2008-10-28
申请号：US11410266
申请日：2006-04-25
申请人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
发明人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
IPC分类号： C08K3/36 , C08L63/02 , C08L63/04
CPC分类号： H01L23/293 , C07F9/5442 , C08G59/688 , C08K5/50 , C08L63/00 , C08L85/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/22 , H01L2924/00
摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
摘要翻译：提供了适用于各种固化性树脂组合物的固化促进剂，具有优异的固化性，保存稳定性和流动性的环氧树脂组合物，以及具有优异的耐焊料龟裂性和耐湿可靠性的半导体装置。环氧树脂组合物包括一分子中具有两个以上环氧基的化合物（A），一分子中具有2个以上酚羟基的化合物（B），作为固化促进剂（C）的三取代膦酰基酚盐或其盐，和无机填料（D）。

3. 发明申请

US20060189721A1 Epoxy resin composition, process for providing latency to the composition and semiconductor device 有权
标题翻译：环氧树脂组合物，为组合物和半导体器件提供延迟的方法
公开(公告)号：US20060189721A1
公开(公告)日：2006-08-24
申请号：US11336434
申请日：2006-01-20
申请人： Yoshihito Akiyama , Naoki Tomida
发明人： Yoshihito Akiyama , Naoki Tomida
IPC分类号： C08L63/00 , C08G59/68
CPC分类号： H01L23/296 , C08G59/621 , C08G59/68 , C08G59/688 , H01L2924/0002 , H01L2924/00
摘要： An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element sealed by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during sealing by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing. (a) An anion component represented by general formula [1]: (b) A compound represented by general formula [2]: (c) A silane compound represented by general formula [3]:
摘要翻译：环氧树脂组合物，其包含环氧树脂（A），固化剂（B），固化促进剂（C）和环氧树脂（D）的延迟固化成分，其是选自组分（a）中的至少一种组分，分别由通式[1]，[2]和[3]表示的具有半导体元件的半导体器件的半导体器件，（b）和（c）），以及用于对环氧树脂组合物提供延迟的方法。环氧树脂具有优良的储存稳定性，通过模塑密封期间的优异的流动性和固化性，以及优异的耐焊接性，并且通过无铅焊接在高温下进行焊接处理而形成裂纹或裂缝。环氧树脂组合物可以通过调节固化促进剂的量和用于延缓固化的组分的量来提供潜在的时间。（a）由通式[1]表示的阴离子成分：（b）由通式[2]表示的化合物：（c）由通式[3]表示的硅烷化合物：

4. 发明授权

US07723444B2 Epoxy resin composition, process for providing latency to the composition and a semiconductor device 有权
标题翻译：环氧树脂组合物，用于提供组合物的延迟的方法和半导体器件
公开(公告)号：US07723444B2
公开(公告)日：2010-05-25
申请号：US11336434
申请日：2006-01-20
申请人： Yoshihito Akiyama , Naoki Tomida
发明人： Yoshihito Akiyama , Naoki Tomida
IPC分类号： C08L63/00 , C08L63/02 , C08L63/04 , H01L23/29
CPC分类号： H01L23/296 , C08G59/621 , C08G59/68 , C08G59/688 , H01L2924/0002 , H01L2924/00
摘要： An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element encapsulated by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during encapsulating by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing. (a) An anion component represented by general formula [1]: (b) A compound represented by general formula [2]: (c) A silane compound represented by general formula [3]:
摘要翻译：环氧树脂组合物，其包含环氧树脂（A），固化剂（B），固化促进剂（C）和环氧树脂（D）的延迟固化成分，其是选自组分（a）中的至少一种组分，分别由通式[1]，[2]和[3]表示的具有半导体元件的半导体器件，通过使用该组合物封装的半导体器件，以及提供对环氧树脂组合物的延迟的方法，（b）和（c）。环氧树脂在通过模塑封装期间具有优异的储存稳定性，优异的流动性和固化性，并且通过根据无铅焊接在高温下的焊接处理而在不形成切割或裂纹的情况下优异的焊接性。环氧树脂组合物可以通过调节固化促进剂的量和用于延缓固化的组分的量来提供潜在的时间。（a）由通式[1]表示的阴离子成分：（b）由通式[2]表示的化合物：（c）由通式[3]表示的硅烷化合物：

5. 发明申请

US20060258822A1 Curing accelerator, epoxy resin composition, and semiconductor device 失效
公开(公告)号：US20060258822A1
公开(公告)日：2006-11-16
申请号：US11410266
申请日：2006-04-25
申请人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
发明人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
IPC分类号： C08L63/00 , B32B27/38 , C08G65/10
CPC分类号： H01L23/293 , C07F9/5442 , C08G59/688 , C08K5/50 , C08L63/00 , C08L85/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/22 , H01L2924/00
摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

6. 发明授权

US07074738B2 Curing accelerator, epoxy resin composition, and semiconductor device 失效
标题翻译：固化促进剂，环氧树脂组合物和半导体装置
公开(公告)号：US07074738B2
公开(公告)日：2006-07-11
申请号：US10453868
申请日：2003-06-04
申请人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
发明人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
IPC分类号： B01J27/16 , C07F9/54 , C08G59/70
CPC分类号： H01L23/293 , C07F9/5442 , C08G59/688 , C08K5/50 , C08L63/00 , C08L85/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/22 , H01L2924/00
摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
摘要翻译：提供了适用于各种固化性树脂组合物的固化促进剂，具有优异的固化性，保存稳定性和流动性的环氧树脂组合物，以及具有优异的耐焊料龟裂性和耐湿可靠性的半导体装置。环氧树脂组合物包括一分子中具有两个以上环氧基的化合物（A），一分子中具有2个以上酚羟基的化合物（B），作为固化促进剂（C）的三取代膦酰基酚盐或其盐，和无机填料（D）。

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