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1. 发明授权

US06851744B2 Roof module for a motor vehicle 失效
标题翻译：汽车车顶模块
公开(公告)号：US06851744B2
公开(公告)日：2005-02-08
申请号：US10114673
申请日：2002-04-02
申请人： Frank Niebuhr , Joachim Röder , Markus Lutz , Manfred Röhnke
发明人： Frank Niebuhr , Joachim Röder , Markus Lutz , Manfred Röhnke
IPC分类号： B60J7/02 , B60J10/25 , B60J10/82 , B60J7/00
CPC分类号： B60J7/022 , B60J7/0084 , B60J10/25 , B60J10/82
摘要： A roof assembly for a motor vehicle comprises a rim portion that guides a roof module towards an opening for a sliding roof cover. The rim portion has a water groove formed integrally with the roof module. In addition, the roof module may have an integrally formed spoiler adjacent the water groove.
摘要翻译：用于机动车辆的车顶组件包括将屋顶模块朝向用于滑动车顶罩的开口引导的轮辋部分。轮辋部分具有与车顶模块一体形成的水槽。此外，屋顶模块可以具有与水槽相邻的整体形成的扰流板。

2. 发明授权

US07000980B2 Roof component, in particular an inner liner for a vehicle roof, and a method of producing same 失效
公开(公告)号：US07000980B2
公开(公告)日：2006-02-21
申请号：US10254266
申请日：2002-09-25
申请人： Markus Lutz , Joachim Röder , Frank Niebuhr , Kai Stehning
发明人： Markus Lutz , Joachim Röder , Frank Niebuhr , Kai Stehning
IPC分类号： B60R13/01
CPC分类号： B62D29/043 , B29C43/10 , B29C43/42 , B29C2043/3652 , B29L2031/3011 , B60R13/0206 , B60R13/0225 , B60R13/0231
摘要： A roof component, in particular an inner liner for a vehicle roof, comprises a carrier layer which consists of a cured material, and a mounting structure. The mounting structure is formed by at least one undercut. There is further proposed a method of producing such a roof component, comprising the following steps: first, a forming tool is provided which consists of a first and a second tool part, an elastically deformable body provided on the first tool part being capable of being deformed between an initial position in which it is extended in a direction perpendicular to a general direction of extension of the roof component, and a working position in which it forms at least one protrusion which extends in parallelism to the general direction of extension of the roof component and at a distance from the first tool part; next, a curable material is introduced into the forming tool, the curable material curing to form the carrier layer while the deformable body is in the working position, such that the protrusion formed by the body is imparted to the carrier layer so as to form an undercut; subsequently, the forming tool is opened and the deformable body is transferred to the initial position, so that it frees the undercut in the carrier layer; finally, the roof component is taken out of the forming tool.

3. 发明授权

US09771257B2 Electromechanical system having a controlled atmosphere, and method of fabricating same 有权
公开(公告)号：US09771257B2
公开(公告)日：2017-09-26
申请号：US13213709
申请日：2011-08-19
申请人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
发明人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
IPC分类号： H01L29/84 , B81C1/00
CPC分类号： B81C1/00293 , B81C2203/0136
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.

4. 发明申请

US20130285162A1 INTEGRATED GETTER AREA FOR WAFER LEVEL ENCAPSULATED MICROELECTROMECHANICAL SYSTEMS 审中-公开
标题翻译：用于水平放大的微电子系统的集成入口区域
公开(公告)号：US20130285162A1
公开(公告)日：2013-10-31
申请号：US13762584
申请日：2013-02-08
申请人： Markus Lutz , Aaron Partridge
发明人： Markus Lutz , Aaron Partridge
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0038 , B81C1/00269 , B81C1/00285 , H01L2224/48091 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) “capturing” impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及一种薄膜封装的MEMS，以及制造或制造包括集成吸气剂区域和/或增加的室容积的薄膜封装的MEMS的技术，其几乎不会增加整体尺寸（s ）从机械结构和室的角度。集成的吸气剂区域设置在室内，并且能够（i）“捕获”从周围材料中排出的杂质，原子和/或分子和/或（ii）减少和/或最小化其中的不利影响杂质，原子和/或分子（例如，降低增加质量到共振器的概率，从而改变谐振器的频率）。以这种方式，本发明的薄膜晶片级封装MEMS包括室内相对稳定的受控压力环境，以提供例如机械结构的更稳定的预定，期望和/或选择的机械阻尼。

5. 发明申请

US20110221013A1 MICROELECTROMECHANICAL DEVICE INCLUDING AN ENCAPSULATION LAYER OF WHICH A PORTION IS REMOVED TO EXPOSE A SUBSTANTIALLY PLANAR SURFACE HAVING A PORTION THAT IS DISPOSED OUTSIDE AND ABOVE A CHAMBER AND INCLUDING A FIELD REGION ON WHICH INTEGRATED CIRCUITS ARE FORMED, AND METHODS FOR FABRICATING SAME 有权
标题翻译：微电子装置，其中包括一部分的封装层，其中所述掩蔽层被移除以暴露出具有外部并在室外排出的部分的主要平面表面，并且包括形成集成电路的场区域及其制造方法
公开(公告)号：US20110221013A1
公开(公告)日：2011-09-15
申请号：US12952895
申请日：2010-11-23
申请人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
发明人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
IPC分类号： H01L29/66 , H01L21/02
CPC分类号： B81C1/00261 , B81B2207/015 , B81C1/00333 , B81C2201/0176 , B81C2203/0136 , H01L2924/0002 , H01L2924/00
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
摘要翻译：这里描述和说明了许多发明。在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。

6. 发明申请

US20110165718A1 Integrated getter area for wafer level encapsulated microelectromechanical systems 有权
公开(公告)号：US20110165718A1
公开(公告)日：2011-07-07
申请号：US13050099
申请日：2011-03-17
申请人： Markus Lutz , Aaron Partridge
发明人： Markus Lutz , Aaron Partridge
IPC分类号： H01L21/56
CPC分类号： B81B7/0038 , B81C1/00269 , B81C1/00285 , H01L2224/48091 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) “capturing” impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.

7. 发明授权

US07777596B2 MEMS resonator structure and method 有权
标题翻译： MEMS谐振器结构及方法
公开(公告)号：US07777596B2
公开(公告)日：2010-08-17
申请号：US12002936
申请日：2007-12-18
申请人： Markus Lutz , Zhiyu Pan , Aaron Partridge
发明人： Markus Lutz , Zhiyu Pan , Aaron Partridge
IPC分类号： H03H9/02 , H03H9/24
CPC分类号： H03H9/02244 , B81B3/007 , B81B3/0072 , B81B2201/0271 , B81B2203/0109 , B81B2203/0163 , H03H3/0076 , H03H9/02338 , H03H2009/0233 , H03H2009/02496 , H03H2009/02503
摘要： A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the density of each of the second plurality of regions differing from the density of each of the first plurality of regions. The second plurality of regions may be disposed in a non-uniform arrangement. The oscillation may include a first state in which the resonator mass is contracted, at least in part, in a first and/or a second direction, and expanded, at least in part, in a third and/or a fourth direction, the second direction being opposite the first direction, the fourth direction being opposite the third direction.
摘要翻译：微机电谐振器可以包括以体模式振荡的一个或多个谐振器质量块，并且其包括每个具有密度的第一多个区域和每个具有密度的第二多个区域，第二多个区域中的每个第二多个区域的密度不同于第一多个区域中的每一个的密度。第二多个区域可以以非均匀的布置设置。振荡可以包括其中谐振器质量至少部分地以第一和/或第二方向收缩并且至少部分地在第三和/或第四方向上膨胀的第一状态，第二状态方向与第一方向相反，第四方向与第三方向相反。

8. 发明授权

US07767482B1 Microelectromechanical systems having stored charge and methods for fabricating and using same 有权
标题翻译：具有储存电荷的微机电系统及其制造和使用方法
公开(公告)号：US07767482B1
公开(公告)日：2010-08-03
申请号：US12269231
申请日：2008-11-12
申请人： Brian H. Stark , Markus Lutz , Aaron Partridge
发明人： Brian H. Stark , Markus Lutz , Aaron Partridge
IPC分类号： H01L21/00
CPC分类号： B81B3/0086 , B81B3/0021
摘要： Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.
摘要翻译：许多发明被公开。一些方面涉及用于和/或制造MEMS的MEMS，和/或用于在设置在室中的机械结构上提供，存储和/或捕获电荷的方法。各种结构可以设置在室中并用于在机械结构上供应，储存和/或捕集电荷。在一些方面，采用易碎连接件，热离子电子源和/或可移动机械结构。可破坏的连接件可以包括保险丝。在一个实施例中，可移动机械结构被驱动以共振。在一些方面，电荷使得换能器将振动能量转换成电能，其可用于为电路，设备和/或其他目的供电。在一些方面，电荷用于改变机械结构的谐振频率和/或产生可能是排斥性的静电力。

9. 发明授权

US07625603B2 Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics 有权
标题翻译：裂纹和无残留的保形沉积氧化硅具有可预测和均匀的蚀刻特性
公开(公告)号：US07625603B2
公开(公告)日：2009-12-01
申请号：US10713172
申请日：2003-11-14
申请人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
发明人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
IPC分类号： C23C16/00 , C23C16/30 , B05D3/02 , H01L21/00 , H01L21/76 , H01L21/30 , H01L21/302 , H01L21/469 , C23F1/00 , B44C1/22
CPC分类号： H01L21/02164 , C23C16/045 , C23C16/402 , C23C16/56 , H01L21/0228 , H01L21/02337 , H01L21/31612
摘要： A silicon oxide layer is formed by oxidation or decomposition of a silicon precursor gas in an oxygen-rich environment followed by annealing. The silicon oxide layer may be formed with slightly compressive stress to yield, following annealing, an oxide layer having very low stress. The silicon oxide layer thus formed is readily etched without resulting residue using HF-vapor.
摘要翻译：通过在富氧环境中氧化或分解硅前体气体然后进行退火而形成氧化硅层。氧化硅层可以形成为稍微的压缩应力，以在退火之后产生具有非常低的应力的氧化物层。由此形成的氧化硅层容易地被蚀刻，而不会使用HF-蒸气而产生残余物。

10. 发明授权

US07514283B2 Method of fabricating electromechanical device having a controlled atmosphere 有权
标题翻译：具有受控气氛的机电装置的制造方法
公开(公告)号：US07514283B2
公开(公告)日：2009-04-07
申请号：US10392528
申请日：2003-03-20
申请人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
发明人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
IPC分类号： H00L21/00 , H00L21/76 , C23F1/00
CPC分类号： B81C1/00293 , B81C2203/0136
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及一种制造或制造具有在受控或预定的机械阻尼环境中操作的机械结构的MEMS的技术。在这方面，本发明在MEMS的最终包装和/或完成之前将机械结构封装在腔室内。包含和/或容纳机械结构的腔室内的环境提供预定的，期望的和/或选择的机械阻尼。控制，选择和/或设计机械结构要操作的封装流体的参数（例如，气体压力）以提供期望的和/或预定的操作环境。

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