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1. 发明授权

US07894643B2 Finger sensor including flexible circuit and associated methods 有权
标题翻译：手指传感器包括灵活电路及相关方法
公开(公告)号：US07894643B2
公开(公告)日：2011-02-22
申请号：US11550669
申请日：2006-10-18
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00 , G01R27/26
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. The flexible circuit may include a flexible layer covering both the finger sensing area and the at least one bond pad, and at least one conductive trace carried by the flexible layer and coupled to the at least one bond pad. The flexible layer may permit finger sensing therethrough. The flexible circuit may include at least one connector portion extending beyond the finger sensing area and the at least one bond pad. For example, the connector portion may include a tab connector portion and/or a ball grid array connector portion. A fill material, such as an epoxy, may be provided between the IC finger sensor and the flexible circuit.
摘要翻译：手指传感器可以包括手指感测集成电路（IC），其具有手指感测区域和与其相邻的至少一个接合垫，以及耦合到IC手指传感器的柔性电路。柔性电路可以包括覆盖手指感测区域和至少一个接合焊盘的柔性层以及由柔性层承载并耦合到至少一个接合焊盘的至少一个导电迹线。柔性层可以允许通过其中的手指感测。柔性电路可以包括延伸超过手指感测区域和至少一个接合焊盘的至少一个连接器部分。例如，连接器部分可以包括突片连接器部分和/或球栅阵列连接器部分。可以在IC手指传感器和柔性电路之间设置填充材料，例如环氧树脂。

2. 发明申请

US20090003664A1 FINGER SENSING WITH ENHANCED MOUNTING AND ASSOCIATED METHODS 有权
标题翻译：手指感知与增强安装和相关方法
公开(公告)号：US20090003664A1
公开(公告)日：2009-01-01
申请号：US12206183
申请日：2008-09-08
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection. The frame may surround at least a portion of an upper perimeter of the IC carrier and have at least one shoulder cooperating with the at least one laterally extending projection of the IC carrier to define at least one upward stop.
摘要翻译：手指传感器可以包括具有手指感测区域的手指感测集成电路（IC），具有在其中容纳手指感测IC的空腔的IC载体，并且具有至少一个倾斜的上边缘，以及围绕至少一部分 IC载体的上周边具有与IC载体的至少一个倾斜的上边缘对应的至少一个倾斜表面。手指传感器还可以包括用于将IC载体偏置在框架内对准的偏置构件。偏置构件可以包括用于在框架内向上偏压IC载体的至少一个弹性体。在其他实施例中，手指传感器可以包括具有在其中接收手指感测IC的空腔的IC载体，并具有至少一个横向延伸的突起。所述框架可围绕所述IC载体的上周边的至少一部分，并且具有与所述IC载体的所述至少一个侧向延伸突起配合的至少一个肩部，以限定至少一个向上止动件。

3. 发明授权

US08085998B2 Finger sensor including enhanced ESD protection and associated methods 有权
标题翻译：手指传感器包括增强型ESD保护及相关方法
公开(公告)号：US08085998B2
公开(公告)日：2011-12-27
申请号：US11550690
申请日：2006-10-18
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. More particularly, the flexible circuit may include a flexible layer, and at least one conductive trace carried thereby and coupled to the at least one bond pad. The sensor may also include at least one Electrostatic Discharge (ESD) electrode carried by the flexible layer. The ESD electrode may be positioned adjacent a beveled edge, for example, of an IC carrier and thereby exposed through a small gap between an adjacent portion of a frame.
摘要翻译：手指传感器可以包括手指感测集成电路（IC），其具有手指感测区域和与其相邻的至少一个接合垫，以及耦合到IC手指传感器的柔性电路。更具体地，柔性电路可以包括柔性层，以及由此承载的至少一个导电迹线并耦合到至少一个接合焊盘。传感器还可以包括由柔性层承载的至少一个静电放电（ESD）电极。 ESD电极可以位于例如IC载体的倾斜边缘附近，并且由此暴露在框架的相邻部分之间的小间隙。

4. 发明授权

US07599532B2 Finger sensing with enhanced mounting and associated methods 有权
标题翻译：手指感应与增强的安装和相关的方法
公开(公告)号：US07599532B2
公开(公告)日：2009-10-06
申请号：US12206183
申请日：2008-09-08
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： H01L31/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection. The frame may surround at least a portion of an upper perimeter of the IC carrier and have at least one shoulder cooperating with the at least one laterally extending projection of the IC carrier to define at least one upward stop.
摘要翻译：手指传感器可以包括具有手指感测区域的手指感测集成电路（IC），具有在其中容纳手指感测IC的空腔的IC载体，并且具有至少一个倾斜的上边缘，以及围绕至少一部分 IC载体的上周边具有与IC载体的至少一个倾斜的上边缘对应的至少一个倾斜表面。手指传感器还可以包括用于将IC载体偏置在框架内对准的偏置构件。偏置构件可以包括用于在框架内向上偏压IC载体的至少一个弹性体。在其他实施例中，手指传感器可以包括具有在其中接收手指感测IC的空腔的IC载体，并具有至少一个横向延伸的突起。所述框架可围绕所述IC载体的上周边的至少一部分，并且具有与所述IC载体的所述至少一个侧向延伸突起配合的至少一个肩部，以限定至少一个向上止动件。

5. 发明授权

US07424136B2 Finger sensing with enhanced mounting and associated methods 有权
标题翻译：手指感应与增强的安装和相关的方法
公开(公告)号：US07424136B2
公开(公告)日：2008-09-09
申请号：US11550693
申请日：2006-10-18
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： H01L31/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection. The frame may surround at least a portion of an upper perimeter of the IC carrier and have at least one shoulder cooperating with the at least one laterally extending projection of the IC carrier to define at least one upward stop.
摘要翻译：手指传感器可以包括具有手指感测区域的手指感测集成电路（IC），具有在其中容纳手指感测IC的空腔的IC载体，并且具有至少一个倾斜的上边缘，以及围绕至少一部分 IC载体的上周边具有与IC载体的至少一个倾斜的上边缘对应的至少一个倾斜表面。手指传感器还可以包括用于将IC载体偏置在框架内对准的偏置构件。偏置构件可以包括用于在框架内向上偏压IC载体的至少一个弹性体。在其他实施例中，手指传感器可以包括具有在其中接收手指感测IC的空腔的IC载体，并具有至少一个横向延伸的突起。所述框架可围绕所述IC载体的上周边的至少一部分，并且具有与所述IC载体的所述至少一个侧向延伸突起配合的至少一个肩部，以限定至少一个向上止动件。

6. 发明授权

US6069970A Fingerprint sensor and token reader and associated methods 有权
标题翻译：指纹传感器和令牌读取器及相关方法
公开(公告)号：US6069970A
公开(公告)日：2000-05-30
申请号：US299999
申请日：1999-04-27
申请人： Matthew M. Salatino , Dale R. Setlak , Mike Newton , Cal Adkins , Nicolaas W. Van Vanno
发明人： Matthew M. Salatino , Dale R. Setlak , Mike Newton , Cal Adkins , Nicolaas W. Van Vanno
IPC分类号： G06K9/00
CPC分类号： G06K9/0012 , G06K9/0002
摘要： A fingerprint and token sensor system includes an array of fingerprint sensing elements for generating signals related to a fingerprint based upon a finger being positioned adjacent the sensing elements, and a token for also causing the sensing elements to generate signals related to a token message based upon the token being positioned adjacent the sensing elements. Accordingly, the single sensor may be used for both fingerprints and for reading data from a token for range of useful purposes. Each fingerprint sensing element may preferably include an electric field sensing electrode, and a shield associated with a respective electric field sensing electrode. A drive circuit may be connected to the array of electric field sensing electrodes for driving same. The sensor is preferably in the form of an integrated circuit and includes a substrate adjacent the array of fingerprint sensing elements. The token may include an array of electrically conductive elements, a pattern defined by different dielectric values, or electric field generating elements cooperating with the array of electric field sensing electrodes. The elements may be carried on a card, for example. The data message of the token may include further information related to the identity of the token bearer, for example, or may confirm the proper identity of the bearer based upon a match with the live fingerprint of the bearer. Alternately, the token could bypass the requirement for a live fingerprint.
摘要翻译：指纹和令牌传感器系统包括指纹感测元件阵列，用于基于手指位于与感测元件相邻的位置产生与指纹相关的信号，以及用于还使得感测元件产生与令牌消息相关的信号的令牌，其基于令牌位于感测元件附近。因此，单个传感器可以用于两个指纹，并且用于从有用目的范围的令牌读取数据。每个指纹感测元件可以优选地包括电场感测电极和与各个电场感测电极相关联的屏蔽。驱动电路可以连接到用于驱动电场感测电极的阵列的电场感测电极。传感器优选地是集成电路的形式，并且包括与指纹感测元件阵列相邻的衬底。令牌可以包括导电元件的阵列，由不同介电值限定的图案，或与电场感测电极阵列协作的电场产生元件。元件可以被携带在卡上，例如。令牌的数据消息例如可以包括与令牌承载的身份有关的进一步的信息，或者可以基于与承载的实况指纹的匹配来确认承载的适当身份。或者，令牌可以绕过活动指纹的要求。

7. 发明授权

US5920640A Fingerprint sensor and token reader and associated methods 失效
公开(公告)号：US5920640A
公开(公告)日：1999-07-06
申请号：US857526
申请日：1997-05-16
申请人： Matthew M. Salatino , Dale R. Setlak , Mike Newton , Cal Adkins , Nicolaas W. Van Vanno
发明人： Matthew M. Salatino , Dale R. Setlak , Mike Newton , Cal Adkins , Nicolaas W. Van Vanno
IPC分类号： G06K9/00
CPC分类号： G06K9/0012 , G06K9/0002
摘要： A fingerprint and token sensor system includes an array of fingerprint sensing elements for generating signals related to a fingerprint based upon a finger being positioned adjacent the sensing elements, and a token for also causing the sensing elements to generate signals related to a token message based upon the token being positioned adjacent the sensing elements. Accordingly, the single sensor may be used for both fingerprints and for reading data from a token for range of useful purposes. Each fingerprint sensing element may preferably include an electric field sensing electrode, and a shield associated with a respective electric field sensing electrode. A drive circuit may be connected to the array of electric field sensing electrodes for driving same. The sensor is preferably in the form of an integrated circuit and includes a substrate adjacent the array of fingerprint sensing elements. The token may include an array of electrically conductive elements, a pattern defined by different dielectric values, or electric field generating elements cooperating with the array of electric field sensing electrodes. The elements may be carried on a card, for example. The data message of the token may include further information related to the identity of the token bearer, for example, or may confirm the proper identity of the bearer based upon a match with the live fingerprint of the bearer. Alternately, the token could bypass the requirement for a live fingerprint.

8. 发明授权

US6088471A Fingerprint sensor including an anisotropic dielectric coating and associated methods 失效
标题翻译：指纹传感器包括各向异性介质涂层及相关方法
公开(公告)号：US6088471A
公开(公告)日：2000-07-11
申请号：US858005
申请日：1997-05-16
申请人： Dale R. Setlak , Nicolass W. Van Vonno , Mike Newton , Matthew M. Salatino
发明人： Dale R. Setlak , Nicolass W. Van Vonno , Mike Newton , Matthew M. Salatino
IPC分类号： G01B7/28 , A61B5/053 , A61B5/117 , G06K9/00 , G06T1/00
CPC分类号： G06K9/00053 , A61B5/1172 , A61B5/0531
摘要： A fingerprint sensor includes an integrated circuit die and a protective covering of a z-axis anisotropic dielectric material. The die includes a conductive layer defining an array of electric field sensing electrodes. The z-axis anisotropic dielectric layer focusses an electric field at each of the electric field sensing electrodes. In other words, the dielectric covering may be relatively thick, but not result in defocussing of the electric fields propagating through the dielectric covering because of the z-axis anisotropy of the material. The z-axis anisotropic dielectric layer may be provided by a plurality of oriented dielectric particles in a cured matrix. For example, the z-axis anisotropic dielectric layer may comprise barium titanate in a polyimide matrix. The conductive layer preferably comprises a plurality of capacitive coupling pads for permitting capacitive coupling with the integrated circuit die. Accordingly, the dielectric covering is preferably continuous over the capacitive coupling pads and the array of electric field sensing electrodes. The z-axis dielectric layer also advantageously reduces cross-talk between adjacent capacitive coupling pads.
摘要翻译：指纹传感器包括集成电路管芯和z轴各向异性介电材料的保护层。芯片包括限定电场感测电极阵列的导电层。 z轴各向异性介电层聚焦在每个电场感测电极处的电场。换句话说，由于材料的z轴各向异性，电介质覆盖层可能相对较厚，而不会导致通过电介质覆盖层传播的电场的散焦。 z轴各向异性介电层可以由固化基质中的多个定向电介质颗粒提供。例如，z轴各向异性介电层可以包括聚酰亚胺基体中的钛酸钡。导电层优选地包括用于允许与集成电路管芯电容耦合的多个电容耦合焊盘。因此，电介质覆盖物优选在电容耦合焊盘和电场感测电极阵列上连续。 z轴电介质层还有利地减少了相邻电容耦合焊盘之间的串扰。

9. 发明授权

US06628812B1 Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods 有权
标题翻译：指纹传感器封装具有增强的静电放电保护和相关方法
公开(公告)号：US06628812B1
公开(公告)日：2003-09-30
申请号：US09568330
申请日：2000-05-09
申请人： Dale R. Setlak , Daryl Williams , Matthew M. Salatino
发明人： Dale R. Setlak , Daryl Williams , Matthew M. Salatino
IPC分类号： G06K900
CPC分类号： G06F1/1684 , G06F1/1616 , G06K9/00053
摘要： A fingerprint sensor package includes a fingerprint sensing integrated circuit within a housing and comprising a plurality of electric field sensing electrodes and processing circuitry connected thereto. At least one external electrode is carried by the housing for finger contact. An electrostatic discharge (ESD) circuit is provided within the housing and is connected to the at least one external electrode. An isolation circuit is connected to the at least one line of the processing circuitry for external connection. The external electrode and ESD circuit, as well as the line isolation circuit protect the integrated circuit against damage by voltage transients, such as ESD. The at least one external electrode may include first and second external electrodes. The first electrode may be connected to the electrostatic discharge circuit. The processing circuit may further comprise a wake-up circuit for selectively powering predetermined circuit portions responsive to sensing finger contact with the second external electrode. Moreover, the housing may define a recess therein to guide a finger of a user along a predetermined path of travel to contact the first external electrode before the second external electrode.
摘要翻译：指纹传感器封装包括壳体内的指纹感测集成电路，并且包括多个电场感测电极和与其连接的处理电路。至少一个外部电极由壳体承载以进行手指接触。静电放电（ESD）电路设置在外壳内并与至少一个外部电极连接。隔离电路连接到用于外部连接的处理电路的至少一条线路。外部电极和ESD电路以及线路隔离电路保护集成电路免受ESD等电压瞬变的损害。至少一个外部电极可以包括第一和第二外部电极。第一电极可以连接到静电放电电路。处理电路还可以包括唤醒电路，用于响应于感测到与第二外部电极的手指接触来选择性地为预定电路部分供电。此外，壳体可以在其中限定凹部以沿着预定的行进路径引导使用者的手指，以在第二外部电极之前接触第一外部电极。

10. 发明授权

US5887343A Direct chip attachment method 失效
标题翻译：直接芯片连接方法
公开(公告)号：US5887343A
公开(公告)日：1999-03-30
申请号：US857525
申请日：1997-05-16
申请人： Matthew M Salatino , S. James Studebaker , Mike Newton , Dale R. Setlak
发明人： Matthew M Salatino , S. James Studebaker , Mike Newton , Dale R. Setlak
IPC分类号： H01L21/00 , H01L21/68 , H05K3/30
CPC分类号： H01L21/67121 , H01L21/681 , Y10T29/49131 , Y10T29/49144 , Y10T29/53091
摘要： A method is for making a chip package of a type including a carrier and a chip connected thereto using optical alignment techniques. One method includes the steps of: providing a transparent film having chip alignment and carrier alignment indicia thereon, optically detecting the chip through the transparent film and aligning the transparent film and the chip based upon the chip alignment indicia. Similarly, the method may include optically detecting the carrier through the transparent film and aligning the transparent film and the carrier based upon the carrier alignment indicia. In addition, the method further includes securing the chip, transparent film and carrier together, such as by providing a thermoplastic transparent film which may heated for adhesively securing the components. The transparent film may be a transparent z-axis conductive film, or a dielectric transparent film. The dielectric transparent film may be a z-axis anisotropic dielectric transparent film, or openings may be formed in the dielectric film and filled with conductive material to establish electrical contact between the chip and carrier pads.
摘要翻译：一种方法是使用光学对准技术制造包括载体和与其连接的芯片的类型的芯片封装。一种方法包括以下步骤：提供其上具有芯片对准和载体取向标记的透明膜，通过透明膜光学检测芯片，并基于芯片对准标记对准透明膜和芯片。类似地，该方法可以包括通过透明膜光学检测载体并基于载体对准标记对准透明膜和载体。此外，该方法还包括将芯片，透明膜和载体固定在一起，例如通过提供热可塑性透明膜，其可被加热以粘附固定部件。透明膜可以是透明的z轴导电膜或介电透明膜。电介质透明膜可以是z轴各向异性介电透明膜，或者可以在电介质膜中形成开口，并填充导电材料以在芯片和载体焊盘之间建立电接触。

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