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    • 2. 发明授权
    • Rinsing system used in a photoresist coater with capability to avoid a
reversed pressure effect
    • 用于光刻胶涂布机的冲洗系统具有避免反向压力效应的能力
    • US5937876A
    • 1999-08-17
    • US185399
    • 1998-11-03
    • Kuei-Hsi LaiChing-Chih ChengHung-Lung Ma
    • Kuei-Hsi LaiChing-Chih ChengHung-Lung Ma
    • G03F7/16H01L21/00B08B3/08
    • H01L21/67051H01L21/6704G03F7/162
    • A rinsing system used in a photoresist coater to remove a brim portion of the formed photoresist layer on a substrate. The rinsing system has capability to avoid a reversed pressure effect. The rinsing system includes several distribution ducts, which are coupled to a solvent container. Each duct includes an one-way valve, an automatically-releasing-gas filter, and a pump with sequential couplings from the solvent container. The pump is used to transport solvent to the substrate to rinse the photoresist layer. The pump also induces the reversed pressure effect, which can be avoided by the automatically-releasing-gas filter, the one-way valve, and the solvent container. The one-way valve includes a spring to hold a ball-like stopper of the valve so that the reversed pressure effect is consumed by the spring force. The automatically-releasing-gas filter contains a gas and includes a releasing-gas valve to release the gas. The solvent container also contain a gas with a pressure of about one atmospheric pressure. The reversed pressure effect is reduced by the pressure induced by the gases.
    • 一种用于光致抗蚀剂涂布机的漂洗系统,用于去除衬底上形成的光致抗蚀剂层的边缘部分。 冲洗系统具有避免反向压力作用的能力。 冲洗系统包括多个分配管道,其连接到溶剂容器。 每个管道包括单向阀,自动释放气体过滤器和具有来自溶剂容器的顺序耦合的泵。 泵用于将溶剂输送到基材上以冲洗光致抗蚀剂层。 泵还引起反向压力效应,这可以通过自动释放气体过滤器,单向阀和溶剂容器来避免。 单向阀包括用于保持阀的球状塞子的弹簧,使得反作用力由弹簧力消耗。 自动释放气体过滤器包含气体并且包括释放气体阀以释放气体。 溶剂容器还含有压力约为一个大气压的气体。 由气体引起的压力会降低反向压力效应。
    • 3. 发明授权
    • Equipment for brushing the underside of a semiconductor wafer
    • 用于刷涂半导体晶片下侧的设备
    • US06295683B1
    • 2001-10-02
    • US09457308
    • 1999-12-09
    • Kuei-Si LaiShih-Hsun ChiouKuo-Feng HuangChing-Chih Cheng
    • Kuei-Si LaiShih-Hsun ChiouKuo-Feng HuangChing-Chih Cheng
    • B08B104
    • B08B1/04B08B3/02
    • The present invention provides equipment for brushing the underside of a semiconductorwafer that is placed on a rotary wafer chuck. The equipment comprises a brush rod, a brush with a channel in it mounted at an end point of the brush rod, a nozzle for spraying water on the underside of the semiconductor wafer, and a driving device connected to the brush rod for driving the brush rod in a reciprocating motion. The wafer chuck rotates the semiconductor wafer and, simultaneously, water drives the blade and the brush to raise and rotate so as to spray water over the underside of the semiconductor wafer. The driving device drives the brush to brush the underside of the semiconductor wafer along a radial direction of the semiconductor wafer.
    • 本发明提供了用于刷涂放置在旋转晶片卡盘上的半导体晶片的下侧的设备。 该设备包括一个刷杆,一个刷子,其中安装在刷杆端部的通道,用于在半导体晶片的下侧喷水的喷嘴,以及连接到刷杆的驱动装置,用于驱动刷子 杆往复运动。 晶片卡盘旋转半导体晶片,同时,水驱动叶片和刷子以升高和旋转,以便在半导体晶片的下侧喷射水。 驱动装置驱动刷子沿着半导体晶片的径向刷刷半导体晶片的下侧。