专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5401604A Positive-type photosensitive resin compositions with quinone diazide sulfonyl unit 失效
标题翻译：具有醌二叠氮基磺酰基单元的正型感光性树脂组合物
公开(公告)号：US5401604A
公开(公告)日：1995-03-28
申请号：US188712
申请日：1994-01-31
申请人： Chikayuki Otsuka , Mamoru Seio , Kiyomi Sakurai , Kazuyuki Kawamura
发明人： Chikayuki Otsuka , Mamoru Seio , Kiyomi Sakurai , Kazuyuki Kawamura
IPC分类号： G03F7/023 , G03F7/16
CPC分类号： G03F7/0233 , G03F7/164
摘要： A positive-type photosensitive resin composition containing a resin which results from reactions between a specific polyepoxide compound, a carboxylic acid compound having a specific phenolic hydroxyl group, a carboxylic acid compound having no specific phenolic hydroxyl group, and 1,2-quinone diazide sulfonyl halide. The resin composition has high exposure sensitivity, is capable of inhibiting swell or dissolution of unexposed areas during the stage of development, and yet retains other favorable properties. The resin composition has also attained short developing time.
摘要翻译：含有由特定聚环氧化合物，具有特定酚羟基的羧酸化合物，不具有特定酚羟基的羧酸化合物与1,2-醌二叠氮基磺酰基之间的反应产生的树脂的正型感光性树脂组合物卤化物。该树脂组合物具有高的曝光灵敏度，能够在显影阶段抑制未曝光区域的溶胀或溶解，并且还保留其它有利的性质。树脂组合物也具有短的显影时间。

2. 发明授权

US5232816A Positive type photosensitive resinous composition comprising a resin copolymer having at least a phosphoric acid ester monomer 失效
标题翻译：含有至少一种磷酸酯单体的树脂共聚物的正型型感光性树脂组合物
公开(公告)号：US5232816A
公开(公告)日：1993-08-03
申请号：US575651
申请日：1990-08-31
申请人： Mamoru Seio , Takeshi Ikeda , Kiyomi Sakurai
发明人： Mamoru Seio , Takeshi Ikeda , Kiyomi Sakurai
IPC分类号： G03F7/039 , C08K3/10 , C08L33/14 , G03F7/023
CPC分类号： G03F7/0233 , Y10S430/107 , Y10S430/111
摘要： A positive type photosensitive resinous composition comprising a binder resin and a quinone diazide compound, the binder resin being a copolymer of(a) at least one phosphoric acid ester monomer represented by the formula: ##STR1## (b) at least one acid group containing .alpha.,.beta.-ethylenically unsaturated monomer, and(c) other copolymerizable .alpha.,.beta.-ethylenically unsaturated monomers than (a) and (b), which is specifically useful for the formation of resist coating in the preparation of printed circuit board.

3. 发明授权

US5368884A Method of forming solder mask 失效
标题翻译：形成焊接掩模的方法
公开(公告)号：US5368884A
公开(公告)日：1994-11-29
申请号：US118231
申请日：1993-09-09
申请人： Yoshikazu Yamagami , Akio Kashihara , Mamoru Seio , Hisaki Tanabe
发明人： Yoshikazu Yamagami , Akio Kashihara , Mamoru Seio , Hisaki Tanabe
IPC分类号： G03F7/16 , H05K3/00 , H05K3/28 , B05D1/00
CPC分类号： G03F7/164 , H05K3/28 , H05K2203/1105 , H05K2203/1355 , H05K3/0079
摘要： The present invention has as its object providing a solder mask which permits high density mounting, is suitable for protecting conductor circuits, particularly has mask thickness on the circuit parts and each edge part of the circuits which make almost no difference from those on other parts, and is excellent in electrical insulation, heat resistance and solvent resistance.This invention provides a method of forming a solder mask for printed circuit boards, using any powder paint which is curable by both irradiation of ultraviolet ray and heat, comprising:(1) a step of coating the powder paint on a printed circuit board, while holding it at a temperature higher than a softening point of the powder paint,(2) a step of irradiating ultraviolet rays thereon through a pattern mask,(3) a step of making development with a medium which dissolves the region not irradiated by ultraviolet rays and,(4) a step of completely curing the coating part developed on the printed circuit board at a temperature higher than the curing temperature of the powder paint.
摘要翻译：本发明的目的是提供一种允许高密度安装的焊接掩模，适用于保护导体电路，特别是在电路部件和电路的每个边缘部分具有掩模厚度，与其它部件几乎没有区别，电绝缘性，耐热性和耐溶剂性优异。本发明提供一种形成印刷电路板用焊料掩模的方法，使用可通过紫外线照射和热照射两者固化的任何粉末涂料，其包括：（1）在粉末涂料上涂布印刷电路板的步骤，同时将其保持在高于粉末涂料的软化点的温度下，（2）通过图案掩模在其上照射紫外线的步骤，（3）利用溶解未被紫外线照射的区域的介质进行显影的步骤和（4）在高于粉末涂料的固化温度的温度下完全固化在印刷电路板上显影的涂层部分的步骤。

4. 发明授权

US5531881A Method for correcting defect in color filter 失效
标题翻译：校正彩色滤光片缺陷的方法
公开(公告)号：US5531881A
公开(公告)日：1996-07-02
申请号：US411147
申请日：1995-03-27
申请人： Akira Matsumura , Masashi Ohata , Mamoru Seio
发明人： Akira Matsumura , Masashi Ohata , Mamoru Seio
IPC分类号： G02B5/20 , G02F1/1335 , C25D13/00
CPC分类号： G02F1/133516 , G02B5/201
摘要： Disclosed is a simple correction method of defects in color layer, which occur in production of color filter. The method does not have the problems associated with the conventional correction methods. The present invention provides a method for correcting defects in a color filter, comprising:(a) forming an electrodeposited film having certain color by means of electrodeposition method on defect portions of a color filter which comprises a transparent substrate, a transparent electrode formed on at least a portion of the transparent substrate and a color layer having a color pattern formed thereon, wherein the color layer has defect portions that formation of the color layer is incomplete, and(b) curing the electrodeposited film with heat or ultraviolet light.
摘要翻译：公开了彩色滤光片生产中出现的彩色层缺陷的简单校正方法。该方法不存在与常规校正方法相关的问题。本发明提供了一种校正滤色器中的缺陷的方法，包括：（a）通过电沉积法在具有透明基底的形成在其上的透明电极的滤色片的缺陷部分上形成具有一定颜色的电沉积膜所述透明基板的至少一部分和形成有着色图案的着色层，其中所述着色层具有形成所述着色层不完整的缺陷部分，和（b）用热或紫外光固化所述电沉积膜。

5. 发明授权

US06366333B1 Method of forming a conductive and reflective thin metal film suitable for a reflective LCD device and a device produced by the method 有权
标题翻译：形成适用于反射型LCD装置的导电性和反射型金属薄膜的方法以及通过该方法制造的装置
公开(公告)号：US06366333B1
公开(公告)日：2002-04-02
申请号：US09500354
申请日：2000-02-07
申请人： Akira Yamamoto , Masashi Ohata , Mamoru Seio
发明人： Akira Yamamoto , Masashi Ohata , Mamoru Seio
IPC分类号： G02F11335
CPC分类号： C09D5/38 , C09D5/24 , G02B5/0808 , G02F1/133553
摘要： A method is disclosed which can form a thin metal film in a cost-effective manner and by a simple process of applying a coating composition. The method involves applying a coating composition containing colloidal particles of noble metal or copper, as obtained by reducing a compound of the noble metal or copper in the presence of a polymeric dispersant, to form a coating film, and heating the coating film so that the colloidal particles present therein are fused together to form a thin metal film.
摘要翻译：公开了一种能够以成本有效的方式和施加涂料组合物的简单方法形成薄金属膜的方法。该方法包括涂覆含有贵金属或铜的胶体粒子的涂料组合物，通过在聚合物分散剂的存在下还原贵金属或铜的化合物而形成涂膜，并加热涂膜，存在于其中的胶体颗粒熔合在一起以形成薄金属膜。

6. 发明授权

US4999274A Positive type photosensitive resinous composition with 1,2 quinone diazide sulfonyl unit 失效
标题翻译：具有1,2-醌二叠氮基磺酰基单元的正型感光性树脂组合物
公开(公告)号：US4999274A
公开(公告)日：1991-03-12
申请号：US255193
申请日：1988-10-27
申请人： Mamoru Seio , Kanji Nishijima , Katsukiyo Ishikawa
发明人： Mamoru Seio , Kanji Nishijima , Katsukiyo Ishikawa
IPC分类号： G03C1/72 , C08G59/14 , C08G59/42 , C08G59/62 , G03F7/023
CPC分类号： G03F7/0233
摘要： The invention provides a positive type photosensitive resinous composition comprising a resin obtained by the reaction of a polyepoxide compound, an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) and 1,2-quinondiazido sulfonic acid halide with the use of those three components in a defined proportion, which is useful for microfabrication photo-resist and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion to supporting substrates, when developed, non-exposed area are extremely resistive toward swelling.

7. 发明授权

US4671854A Method for preparing a printed circuit board with solder plated circuit and through-holes 失效
标题翻译：制备具有焊料电路和通孔的印刷电路板的方法
公开(公告)号：US4671854A
公开(公告)日：1987-06-09
申请号：US855362
申请日：1986-04-24
申请人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
发明人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
IPC分类号： H05K3/42 , G03F7/004 , G03F7/16 , H05K3/06 , H05K3/10 , H05K3/34 , C23F1/02 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： G03F7/164 , G03F7/004 , H05K3/062 , H05K3/108 , H05K2203/0793 , H05K2203/135 , H05K3/3473 , H05K3/427 , Y10T29/49165
摘要： The invention provides a method for preparing a printed circuit board with solder plated circuit and through-holes, using a specifically prepared photoresist material and a combination of exposure, development, solder plating and etching means.This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.
摘要翻译：本发明提供一种使用特定制备的光致抗蚀剂材料以及曝光，显影，焊料镀覆和蚀刻装置的组合制备具有焊料电镀电路和通孔的印刷电路板的方法。该方法对于制备具有焊接电路的印刷电路板和具有高密度电路图案的通孔特别有用。

8. 发明授权

US5166036A Electrodeposition coating composition and image-forming method using the same 失效
标题翻译：电沉积涂料组合物和使用其的成像方法
公开(公告)号：US5166036A
公开(公告)日：1992-11-24
申请号：US727523
申请日：1991-07-09
申请人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
发明人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
IPC分类号： G03F7/023 , G03F7/16
CPC分类号： G03F7/164 , G03F7/0233 , Y10S430/136
摘要： The invention provides an aqueous electrodeposition coating composition for a positive working resist and an image-forming method using the same. The coating composition is very stable under storage conditions and is capable of resulting in a positive working resist which is specifically useful in the preparation of a printed circuit board with mini-via-holes.
摘要翻译：本发明提供了一种用于正性抗蚀剂的水性电沉积涂料组合物和使用其的成像方法。涂料组合物在储存条件下非常稳定，并且能够产生正工作抗蚀剂，其特别可用于制备具有微通孔的印刷电路板。

9. 发明授权

US5055374A Electrodeposition coating composition containing an acrylic resin and a quinnone diazide group bearing resin 失效
标题翻译：含有丙烯酸树脂和二烯基双组份轴承树脂的电沉积涂料组合物
公开(公告)号：US5055374A
公开(公告)日：1991-10-08
申请号：US388471
申请日：1989-08-02
申请人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
发明人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
IPC分类号： G03F7/022 , G03F7/023 , G03F7/16 , H05K3/06
CPC分类号： G03F7/164 , G03F7/0233
摘要： The invention provides an aqueous electrodeposition coating composition for a positive working resist and an image-forming method using the same. The coating composition is very stable under storage conditions and is capable of resulting in a positive working resist which is specifically useful in the preparation of a printed circuit board with mini-via-holes.

10. 发明授权

US4952481A Photosensitive resin composition 失效
标题翻译：感光树脂组合物
公开(公告)号：US4952481A
公开(公告)日：1990-08-28
申请号：US291392
申请日：1988-12-27
申请人： Mamoru Seio , Hidefumi Kusuda , Masami Kawabata
发明人： Mamoru Seio , Hidefumi Kusuda , Masami Kawabata
IPC分类号： A63F9/24 , C08F290/12 , G03F7/027 , G03F7/033
CPC分类号： C08F290/126 , G03F7/027 , G03F7/033 , A63F2009/2476
摘要： There is hereby provided a photosensitive resin composition suitable for a relief printing plate having an excellent resistance to a water based ink, whereby water or a water like solvent can be employed as a developing solution, which comprises;(i) a polymer (A) having a molecular weight of 5,000 to 500,000 which contains an amino group and a polymerizable double bond moiety,(ii) a monomer (B) having an .alpha.,.beta.-ethylenically unsaturated bond and a free acid group which can quaternize the nitrogen atom of the polymer (A),(iii) a photopolymerizable unsaturated compound (C), and(iv) a photopolymerization initiator (D).
摘要翻译：因此，提供一种适用于耐水性油墨优异的凸版印刷版的感光性树脂组合物，其中可以使用水或类似溶剂的水作为显影液，其包括：（i）分子量为5,000〜500,000的含有氨基和可聚合双键部分的聚合物（A），（ii）具有α，β-烯属不饱和键和游离酸基团的单体（B）其可以使聚合物（A）的氮原子，（iii）光聚合性不饱和化合物（C）和（iv）光聚合引发剂（D）的氮原子季铵化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式