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1. 发明申请

US20060256296A1 Heat-dissipating device for a projection apparatus 有权
公开(公告)号：US20060256296A1
公开(公告)日：2006-11-16
申请号：US11429270
申请日：2006-05-08
申请人： Chi-Chui Yun , Hung-Ying Lin , Jia-Bin Huang
发明人： Chi-Chui Yun , Hung-Ying Lin , Jia-Bin Huang
IPC分类号： G03B21/18 , G03B21/26
CPC分类号： G03B21/16
摘要： A heat-dissipating device includes a receptacle body having a lateral wall formed with an air vent; a lamp unit including a burner, a reflector covered the burner, a glass plate disposed in front of the reflector, the reflector cooperating with the glass plate to define an air inlet adjacent to the air vent and an air outlet spaced from the air vent; a fan unit mounted on the receptacle body for covering the air vent and for generating airflow to flow into the receptacle body; and a nozzle disposed within the receptacle body between the air vent and the lamp unit for guiding the airflow into the lamp unit.

2. 发明授权

US07607781B2 Heat-dissipating device for a projection apparatus 有权
标题翻译：一种用于投影设备的散热装置
公开(公告)号：US07607781B2
公开(公告)日：2009-10-27
申请号：US11429270
申请日：2006-05-08
申请人： Chi-Chui Yun , Hung-Ying Lin , Jia-Bin Huang
发明人： Chi-Chui Yun , Hung-Ying Lin , Jia-Bin Huang
IPC分类号： G03B21/18 , F21V29/00 , F21V7/20 , B60Q1/06
CPC分类号： G03B21/16
摘要： A heat-dissipating device includes a receptacle body having a lateral wall formed with an air vent; a lamp unit including a burner, a reflector covered the burner, a glass plate disposed in front of the reflector, the reflector cooperating with the glass plate to define an air inlet adjacent to the air vent and an air outlet spaced from the air vent; a fan unit mounted on the receptacle body for covering the air vent and for generating airflow to flow into the receptacle body; and a nozzle disposed within the receptacle body between the air vent and the lamp unit for guiding the airflow into the lamp unit.
摘要翻译：散热装置包括具有形成有通风口的侧壁的容器主体; 包括燃烧器的灯单元，覆盖燃烧器的反射器，设置在反射器前面的玻璃板，反射镜与玻璃板配合以限定与排气口相邻的空气入口和与排气口间隔开的空气出口; 风扇单元，其安装在所述容器主体上，用于覆盖所述排气口并产生流入所述容器主体的气流; 以及设置在所述插座本体内的所述通气口和所述灯单元之间的喷嘴，用于将所述气流引导到所述灯单元中。

3. 发明授权

US07781885B2 Optoelectronic semiconductor package and method for attaching heat dissipation element thereto 有权
标题翻译：光电子半导体封装及其散热元件的安装方法
公开(公告)号：US07781885B2
公开(公告)日：2010-08-24
申请号：US12114623
申请日：2008-05-02
申请人： Tai-Wei Lin , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
发明人： Tai-Wei Lin , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
IPC分类号： H01L23/10 , H01L21/00
CPC分类号： H01S5/02469 , H01L33/648 , H01L2224/48091 , H01S5/02208 , H01S5/02236 , H01S5/02288 , H01L2924/00014
摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.
摘要翻译：用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

4. 发明授权

US08482215B2 Light emitting apparatus and control method thereof 有权
标题翻译：发光装置及其控制方法
公开(公告)号：US08482215B2
公开(公告)日：2013-07-09
申请号：US12662905
申请日：2010-05-11
申请人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
发明人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
IPC分类号： H05B37/02
CPC分类号： H05B33/0854
摘要： A light emitting apparatus and a control method thereof are provided. The light emitting apparatus has a semiconductor device capable of emitting light, and the control method includes the following descriptions. A driving power of the semiconductor device is reduced to an ideal power stepwise and gradually. After every time the driving power of the semiconductor device is reduced, the semiconductor device continually emits the light by the reduced driving power within a predetermined time.
摘要翻译：提供一种发光装置及其控制方法。发光装置具有能够发光的半导体器件，并且该控制方法包括以下描述。半导体器件的驱动功率逐渐降低到理想的功率。在每次半导体器件的驱动功率减小之后，半导体器件在预定时间内通过降低的驱动功率连续地发光。

5. 发明授权

US07490966B2 Illumination system 有权
标题翻译：照明系统
公开(公告)号：US07490966B2
公开(公告)日：2009-02-17
申请号：US11557972
申请日：2006-11-09
申请人： Jia-Bin Huang , Chi-Chui Yun , Chu-Ming Cheng , S-Wei Chen
发明人： Jia-Bin Huang , Chi-Chui Yun , Chu-Ming Cheng , S-Wei Chen
IPC分类号： F21V7/04
CPC分类号： G02B6/4298 , G02B7/006 , G02B26/008 , G02B27/0994
摘要： An illumination system having a light source, an integration rod and a color wheel is provided. The light source is suitable for providing a light beam. The light integration rod and the color wheel are disposed in the transmission path of the light beam. The color wheel is disposed between the light source and the light integration rod. The light integration rod has a light input end adjacent to the color wheel and a light output end opposite the light input end. The light integration rod has two indentations at the light input end to form an airflow channel. The noise caused by the rotating color wheel is reduced through the airflow channel.
摘要翻译：提供具有光源，整合杆和色轮的照明系统。光源适用于提供光束。光集成杆和色轮设置在光束的传输路径中。色轮设置在光源和光集成杆之间。光集成杆具有与色轮相邻的光输入端和与光输入端相对的光输出端。光整合杆在光输入端具有两个压痕以形成气流通道。由旋转色轮引起的噪音通过气流通道减少。

6. 发明申请

US20090052483A1 OPTOELECTRONIC SEMICONDUCTOR PACKAGE AND METHOD FOR ATTACHING HEAT DISSIPATION ELEMENT THERETO 有权
标题翻译：光电半导体封装及其连接热释放元件的方法
公开(公告)号：US20090052483A1
公开(公告)日：2009-02-26
申请号：US12114623
申请日：2008-05-02
申请人： Tai-Wei LIN , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
发明人： Tai-Wei LIN , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
IPC分类号： H01S5/024 , H01L33/00
CPC分类号： H01S5/02469 , H01L33/648 , H01L2224/48091 , H01S5/02208 , H01S5/02236 , H01S5/02288 , H01L2924/00014
摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.
摘要翻译：用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

7. 发明授权

US08371700B2 Heat dissipation module and projection apparatus using the same 有权
标题翻译：散热模块和使用其的投影设备
公开(公告)号：US08371700B2
公开(公告)日：2013-02-12
申请号：US12662273
申请日：2010-04-08
申请人： Tai-Wei Lin , Jia-Bin Huang , Chi-Chui Yun
发明人： Tai-Wei Lin , Jia-Bin Huang , Chi-Chui Yun
IPC分类号： G03B21/18
CPC分类号： G03B21/16 , F28D15/0266
摘要： A heat dissipation module includes a heat-absorbing unit, a first heat pipe, a second heat pipe, and a heat-dissipating unit. The heat-absorbing unit is adapted to contact the heat source thermally. The first heat pipe has a first heat-absorbing section being connected to the heat-absorbing unit and a first heat-dissipating section. The second heat pipe has a second heat-absorbing section being connected to the heat-absorbing unit and a second heat-dissipating section. The heat-dissipating unit includes a first fin assembly and a second fin assembly. The first heat-dissipating section is connected to the first fin assembly along a first extending direction, the second heat-dissipating section is connected to the second fin assembly along a second extending direction, the first extending direction and second extending direction are oblique to each other, and a part of the first fin assembly and a part of the second fin assembly are inset to each other.
摘要翻译：散热模块包括吸热单元，第一热管，第二热管和散热单元。吸热单元适于热接触热源。第一热管具有与吸热单元连接的第一吸热部和第一散热部。第二热管具有与吸热单元连接的第二吸热部和第二散热部。散热单元包括第一翅片组件和第二翅片组件。第一散热部沿着第一延伸方向连接于第一散热片组件，第二散热部沿着第二延伸方向与第二散热片组件连接，第一延伸方向和第二延伸方向相互倾斜第一翅片组件的一部分和第二翅片组件的一部分彼此插入。

8. 发明申请

US20080225239A1 PROJECTION APPARATUS AND ILLUMINATION SYSTEM THEREOF 审中-公开
标题翻译：投影设备及其照明系统
公开(公告)号：US20080225239A1
公开(公告)日：2008-09-18
申请号：US11950701
申请日：2007-12-05
申请人： Zeu-Chia Tan , Jia-Bin Huang , Chi-Chui Yun
发明人： Zeu-Chia Tan , Jia-Bin Huang , Chi-Chui Yun
IPC分类号： G03B21/16
CPC分类号： G03B21/16
摘要： An illumination system includes a lamp, an optical element, a fan and a wind-guiding device. The extended direction of the central axis of the fan is slanted to the optic axis of an illumination beam from the lamp with an angle. The wind-guiding device includes a wind-guiding portion and a frame having a first carrying surface for carrying the fan. A second carrying surface of the frame is opposite to the first carrying surface and faces towards the lamp and the optical element. A wind-guiding plate of the wind-guiding portion is extended from a side of the frame towards the optical element and has a bending corner. A part of a cooling airflow from the fan passes through an opening of the frame and is blown to the lamp directly, and another part thereof is guided by the bending corner and is blown directly to the optical element.
摘要翻译：照明系统包括灯，光学元件，风扇和导风装置。风扇的中心轴线的延伸方向以一角度从灯具倾斜到照明光束的光轴。导风装置包括导风部分和具有用于承载风扇的第一承载表面的框架。框架的第二承载表面与第一承载表面相对，并面向灯和光学元件。风导向部分的导风板从框架的一侧朝向光学元件延伸并且具有弯曲角。来自风扇的冷却气流的一部分通过框架的开口，并被直接吹到灯中，另一部分被弯曲角引导并被直接吹到光学元件。

9. 发明申请

US20100289432A1 Light emitting apparatus and control method thereof 有权
标题翻译：发光装置及其控制方法
公开(公告)号：US20100289432A1
公开(公告)日：2010-11-18
申请号：US12662905
申请日：2010-05-11
申请人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
发明人： Zeu-Chia Tan , Chi-Chui Yun , Jia-Bin Huang
IPC分类号： H05B37/02
CPC分类号： H05B33/0854
摘要： A light emitting apparatus and a control method thereof are provided. The light emitting apparatus has a semiconductor device capable of emitting light, and the control method includes the following descriptions. A driving power of the semiconductor device is reduced to an ideal power stepwise and gradually. After every time the driving power of the semiconductor device is reduced, the semiconductor device continually emits the light by the reduced driving power within a predetermined time.
摘要翻译：提供一种发光装置及其控制方法。发光装置具有能够发光的半导体器件，并且该控制方法包括以下描述。半导体器件的驱动功率逐渐降低到理想的功率。在每次半导体器件的驱动功率减小之后，半导体器件在预定时间内通过降低的驱动功率连续地发光。

10. 发明申请

US20100265468A1 Heat dissipation module and projection apparatus using the same 有权
标题翻译：散热模块和使用其的投影设备
公开(公告)号：US20100265468A1
公开(公告)日：2010-10-21
申请号：US12662273
申请日：2010-04-08
申请人： Tai-Wei Lin , Jia-Bin Huang , Chi-Chui Yun
发明人： Tai-Wei Lin , Jia-Bin Huang , Chi-Chui Yun
IPC分类号： G03B21/16 , F28D15/04
CPC分类号： G03B21/16 , F28D15/0266
摘要： A heat dissipation module includes a heat-absorbing unit, a first heat pipe, a second heat pipe, and a heat-dissipating unit. The heat-absorbing unit is adapted to contact the heat source thermally. The first heat pipe has a first heat-absorbing section being connected to the heat-absorbing unit and a first heat-dissipating section. The second heat pipe has a second heat-absorbing section being connected to the heat-absorbing unit and a second heat-dissipating section. The heat-dissipating unit includes a first fin assembly and a second fin assembly. The first heat-dissipating section is connected to the first fin assembly along a first extending direction, the second heat-dissipating section is connected to the second fin assembly along a second extending direction, the first extending direction and second extending direction are oblique to each other, and a part of the first fin assembly and a part of the second fin assembly are inset to each other.
摘要翻译：散热模块包括吸热单元，第一热管，第二热管和散热单元。吸热单元适于热接触热源。第一热管具有与吸热单元连接的第一吸热部和第一散热部。第二热管具有与吸热单元连接的第二吸热部和第二散热部。散热单元包括第一翅片组件和第二翅片组件。第一散热部沿着第一延伸方向连接于第一散热片组件，第二散热部沿着第二延伸方向与第二散热片组件连接，第一延伸方向和第二延伸方向相互倾斜第一翅片组件的一部分和第二翅片组件的一部分彼此插入。

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