专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070209684A1 Copper deposition chamber having integrated bevel clean with edge bevel removal detection 审中-公开
标题翻译：铜沉积室具有整体斜面清洁和边缘斜面去除检测
公开(公告)号：US20070209684A1
公开(公告)日：2007-09-13
申请号：US11369590
申请日：2006-03-07
申请人： Chen-An Chen , Anh Nguyen , Manoocher Birang
发明人： Chen-An Chen , Anh Nguyen , Manoocher Birang
IPC分类号： B08B3/02
CPC分类号： H01L21/6708 , H01L21/67253
摘要： Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.
摘要翻译：本发明的实施例通常提供用于检测和控制半导体衬底的边缘斜面去除的装置和方法。本发明的一个实施例提供一种用于检查旋转基片的装置。该装置包括：衬底支撑件，被配置为在后侧支撑旋转衬底并围绕中心轴线旋转衬底;以及位于衬底支撑件上方的传感器，该传感器被配置为在同时移动的同时检查旋转衬底的前侧径向穿过衬底。

2. 发明申请

US20100279516A1 APPARATUS AND METHOD OF ALIGNING AND POSITIONING A COLD SUBSTRATE ON A HOT SURFACE 有权
标题翻译：在热表面上对准和定位冷基底的装置和方法
公开(公告)号：US20100279516A1
公开(公告)日：2010-11-04
申请号：US12839282
申请日：2010-07-19
申请人： Chen-An Chen , Anh N. Nguyen , Manoocher Birang
发明人： Chen-An Chen , Anh N. Nguyen , Manoocher Birang
IPC分类号： H01L21/26
CPC分类号： H01L21/67248 , C23C16/4586 , H01L21/68742
摘要： Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.
摘要翻译：本发明的实施方案考虑了一种方法，装置和系统，其用于将衬底支撑并定位在与初始或进入衬底温度不同的温度的表面上。本发明的实施例还可以包括控制位于处理室中的衬底和衬底支撑件之间的热传递的方法。本文所述的装置和方法通常还可以提供将衬底精确地定位在位于半导体处理室中的衬底支撑件上的便宜且简单的方法。可受益于本文描述的各种实施方案的衬底处理室包括但不限于RTP，CVD，PVD，ALD，等离子体蚀刻和/或激光退火室。

3. 发明授权

US07947131B2 Copper deposition chamber having integrated bevel clean with edge bevel removal detection 失效
标题翻译：铜沉积室具有整体斜面清洁和边缘斜面去除检测
公开(公告)号：US07947131B2
公开(公告)日：2011-05-24
申请号：US12783391
申请日：2010-05-19
申请人： Chen-An Chen , Anh N. Nguyen , Manoocher Birang
发明人： Chen-An Chen , Anh N. Nguyen , Manoocher Birang
IPC分类号： B08B7/04
CPC分类号： H01L21/6708 , H01L21/67253
摘要： Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.
摘要翻译：本发明的实施例通常提供用于检测和控制半导体衬底的边缘斜面去除的装置和方法。本发明的一个实施例提供一种用于检查旋转基片的装置。该装置包括：衬底支撑件，被配置为在后侧支撑旋转衬底并围绕中心轴线旋转衬底;以及位于衬底支撑件上方的传感器，该传感器被配置为在同时移动的同时检查旋转衬底的前侧径向穿过衬底。

4. 发明申请

US20100218784A1 COPPER DEPOSITION CHAMBER HAVING INTEGRATED BEVEL CLEAN WITH EDGE BEVEL REMOVAL DETECTION 失效
标题翻译：具有边缘水平检测的集成水平清洁的铜沉积室
公开(公告)号：US20100218784A1
公开(公告)日：2010-09-02
申请号：US12783391
申请日：2010-05-19
申请人： CHEN-AN CHEN , Anh N. Nguyen , Manoocher Birang
发明人： CHEN-AN CHEN , Anh N. Nguyen , Manoocher Birang
IPC分类号： G01N21/55 , B08B7/04
CPC分类号： H01L21/6708 , H01L21/67253
摘要： Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.
摘要翻译：本发明的实施例通常提供用于检测和控制半导体衬底的边缘斜面去除的装置和方法。本发明的一个实施例提供一种用于检查旋转基片的装置。该装置包括：衬底支撑件，被配置为在后侧支撑旋转衬底并围绕中心轴线旋转衬底;以及位于衬底支撑件上方的传感器，该传感器被配置为在同时移动的同时检查旋转衬底的前侧径向穿过衬底。

5. 发明授权

US07775852B2 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations 有权
标题翻译：用于化学机械抛光操作的原位终点检测的装置和方法
公开(公告)号：US07775852B2
公开(公告)日：2010-08-17
申请号：US11099789
申请日：2005-04-05
申请人： Manoocher Birang , Nils Johansson , Allan Gleason
发明人： Manoocher Birang , Nils Johansson , Allan Gleason
IPC分类号： B24B49/12
CPC分类号： H01L22/12 , B24B37/013 , B24B37/205 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/0683
摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
摘要翻译：使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

6. 发明授权

US07731566B2 Substrate polishing metrology using interference signals 失效
标题翻译：使用干涉信号的基板抛光计量
公开(公告)号：US07731566B2
公开(公告)日：2010-06-08
申请号：US11838808
申请日：2007-08-14
申请人： Manoocher Birang , Grigory Pyatigorsky
发明人： Manoocher Birang , Grigory Pyatigorsky
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/06 , G01B11/0683
摘要： A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.
摘要翻译：抛光衬底的方法包括：将抛光垫保持在具有抛光头的抛光垫上，其中抛光垫由压板支撑，在衬底和抛光垫之间产生相对运动以抛光衬底的侧面，产生光光束并将光束引向基板，以使光束撞击正在抛光的基板的侧面。从基板反射的光在检测器处产生干涉信号。从干扰信号计算均匀度的度量。

7. 发明授权

US07727364B2 Auxiliary electrode encased in cation exchange membrane tube for electroplating cell 有权
标题翻译：辅助电极封装在电镀槽的阳离子交换膜管中
公开(公告)号：US07727364B2
公开(公告)日：2010-06-01
申请号：US11362432
申请日：2006-02-24
申请人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
发明人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
IPC分类号： C25D17/12 , C25D7/12
CPC分类号： C25D17/10 , C25D5/04 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/02 , H01L21/2885
摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
摘要翻译：一种用于将金属电镀到基底上的方法和装置。本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。该装置包括被配置为在其中保持电镀溶液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的封装辅助电极组件。包封的辅助电极组件通常包括设置在保护管中的辅助电极。

8. 发明申请

US20100050779A1 CARBON NANOTUBE-BASED LOAD CELLS 有权
标题翻译：基于碳纳米管的负载细胞
公开(公告)号：US20100050779A1
公开(公告)日：2010-03-04
申请号：US12201242
申请日：2008-08-29
申请人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
发明人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
IPC分类号： G01B7/16 , H01L49/00 , H01L21/66
CPC分类号： G01L1/20 , G01L1/18 , G01L5/0076 , Y10S977/953 , Y10S977/956
摘要： A robust, stand-alone load cell comprises a block of aligned carbon nanotubes with parallel electrodes on opposing sides of the block and an electrical circuit connected between the electrodes for measuring the electrical resistance of the block. The nanotubes are preferably aligned perpendicular to the electrodes. Carbon nanotube-based load cells may be incorporated into a wafer asssembly for characterizing semiconductor processing equipment. Such a wafer assembly includes two parallel wafers with a plurality of carbon nanotube load cells positioned between and attached to both wafers. The load cells are independently electrically connected to a device which monitors and records the resistivity of the load cell. According to further aspects of the invention, each of the load cell's parallel electrodes may be comprised of many small electrodes, where each small electrode on one side of the block has a corresponding small electrode on the opposing side of the block; corresponding pairs of small electrodes are connected in series to form a chain; an electrical circuit, connected to both ends of the chain of opposing pairs of electrodes, is used to measure the electrical resistance of the chain.
摘要翻译：坚固的独立测力传感器包括在块的相对侧上具有平行电极的对准碳纳米管块和连接在电极之间的用于测量块的电阻的电路。纳米管优选垂直于电极取向。可以将碳纳米管基称重传感器结合到用于表征半导体处理设备的晶片组件中。这种晶片组件包括两个平行的晶片，其中多个碳纳米管负载单元位于两个晶片之间并附着在两个晶片上。称重传感器独立地电连接到监测和记录称重传感器的电阻率的装置。根据本发明的另外的方面，每个负载传感器的平行电极可以由许多小电极组成，其中块的一侧上的每个小电极在块的相对侧具有相应的小电极; 相应的一对小电极串联连接形成链条; 连接到相对电极对的链的两端的电路用于测量链的电阻。

9. 发明授权

US07500901B2 Data processing for monitoring chemical mechanical polishing 有权
标题翻译：数据处理用于监测化学机械抛光
公开(公告)号：US07500901B2
公开(公告)日：2009-03-10
申请号：US11222561
申请日：2005-09-08
申请人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
发明人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
摘要翻译：实施用于监测抛光衬底的技术的方法和装置。获取两个或多个数据点，其中每个数据点具有受传感器感测区域内的特征影响的值，并且对应于感测区域穿过衬底的衬底和传感器的相对位置。一组参考点用于修改采集的数据点。该修改补偿由穿过衬底的感测区域引起的所获取的数据点中的失真。基于修改的数据点，评估基板的局部特性以监测抛光。

10. 发明申请

US20070135958A1 INTEGRATED ENDPOINT DETECTION SYSTEM WITH OPTICAL AND EDDY CURRENT MONITORING 有权
标题翻译：具有光和电流监测的集成端点检测系统
公开(公告)号：US20070135958A1
公开(公告)日：2007-06-14
申请号：US11677450
申请日：2007-02-21
申请人： Boguslaw Swedek , Manoocher Birang , Nils Johansson
发明人： Boguslaw Swedek , Manoocher Birang , Nils Johansson
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译：化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。来自监控系统的信号可以组合在输出线上并由计算机提取。可以计算抛光垫的厚度。涡流监测系统和光学监测系统可以测量基板上基本相同的位置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式