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1. 发明授权

US07486519B2 System for cooling a heat-generating electronic device with increased air flow 有权
标题翻译：用于冷却具有增加的空气流量的发热电子装置的系统
公开(公告)号：US07486519B2
公开(公告)日：2009-02-03
申请号：US11361870
申请日：2006-02-24
申请人： Brian Roger Loiler , Xiaohua H. Sun
发明人： Brian Roger Loiler , Xiaohua H. Sun
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/467 , G06F1/20 , H01L2924/0002 , H05K1/0272 , H05K2201/09063 , H01L2924/00
摘要： A system for cooling a heat-generating electronic device in a computer system includes a printed circuit board having one or more ventilation holes and coupled to a first side of the heat-generating electronic device, and a fan assembly having a top side and a bottom side and coupled to a second side of the heat-generating electronic device. The fan assembly is disposed relative to the printed circuit board to allow air to flow into the top side of the fan assembly and into the bottom side of the fan assembly through the one or more ventilation holes. One advantage of this design is that it enables a greater volume of air to flow through the fan assembly relative to prior art designs, thereby resulting in more efficient cooling of the heat-generating electronic device.
摘要翻译：一种用于在计算机系统中冷却发热电子设备的系统包括具有一个或多个通气孔并耦合到发热电子设备的第一侧的印刷电路板，以及具有顶侧和底部的风扇组件并耦合到发热电子设备的第二侧。风扇组件相对于印刷电路板布置，以允许空气通过一个或多个通风孔流入风扇组件的顶侧并进入风扇组件的底侧。该设计的一个优点是相对于现有技术的设计，其能够使更大体积的空气流过风扇组件，从而导致发热电子设备的更有效的冷却。

2. 发明授权

US07782622B1 Attachment apparatus for electronic boards 有权
标题翻译：电子板附件装置
公开(公告)号：US07782622B1
公开(公告)日：2010-08-24
申请号：US11538553
申请日：2006-10-04
申请人： Xiaohua H. Sun , Ryan C. Tong
发明人： Xiaohua H. Sun , Ryan C. Tong
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H05K1/0271 , H05K1/181 , H05K3/301 , H05K2201/10689 , H05K2201/2009 , H05K2201/2018 , H01L2924/00
摘要： Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.
摘要翻译：公开了一种附件装置。附接装置可以便于将各种部件附接到包括热管理部件的印刷电路板（PCB）。

3. 发明授权

US07283364B2 Thermal management apparatus 有权
标题翻译：热管理装置
公开(公告)号：US07283364B2
公开(公告)日：2007-10-16
申请号：US10999269
申请日：2004-11-29
申请人： Gamal Refai-Ahmed , Xiaohua H. Sun , Nima Osqueizadeh , Salim Lakhani , Jim E. Loro , A. Mei Lan Shepherd-Murray , Ross Lau
发明人： Gamal Refai-Ahmed , Xiaohua H. Sun , Nima Osqueizadeh , Salim Lakhani , Jim E. Loro , A. Mei Lan Shepherd-Murray , Ross Lau
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： G06F1/20 , H01L23/4006 , H01L23/467 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.
摘要翻译：本公开涉及一种用于管理安装到诸如电子或光学部件的电路基板的部件的温度的热管理装置。该装置包括散热结构，其包括从散热结构的表面延伸的至少一个突起。还包括载体结构并与散热结构接合。载体结构包括容纳至少一个突起的孔。另外，该装置包括至少一个偏置结构，其被配置为允许散热结构相对于载体结构的移动，并且提供倾向于将散热结构和载体结构移动到一起的偏置力。

4. 发明授权

US07359205B1 Bottom exit of exhaust air from a chassis to reduce acoustics emission 有权
标题翻译：从底盘排出空气的底部以减少声发射
公开(公告)号：US07359205B1
公开(公告)日：2008-04-15
申请号：US11270997
申请日：2005-11-09
申请人： Xiaohua H. Sun , Don Le
发明人： Xiaohua H. Sun , Don Le
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： G06F1/20
摘要： Embodiments of the present invention recite an electronic device comprising a chassis, a backplane, at least one heat generating component coupled with the backplane, and a fan. In embodiments of the present invention, the chassis comprises at least one air inlet disposed on a side of the chassis and at least one exhaust outlet disposed on the bottom surface of the chassis. The heat generating component is suspended from said backplane when coupled therewith and is disposed above the at least one exhaust outlet. The fan draws cooling air through the at least one air inlet and expels the cooling air through the at least one exhaust outlet.
摘要翻译：本发明的实施例背诵包括底盘，背板，至少一个与底板耦合的发热元件和风扇的电子设备。在本发明的实施例中，底盘包括设置在底盘一侧的至少一个空气入口和设置在底盘底面上的至少一个排气出口。所述发热部件在与所述背板联接时被悬挂在所述至少一个排气出口上方。风扇通过至少一个空气入口吸入冷却空气，并且通过至少一个排气出口排出冷却空气。

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