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1. 发明申请

US20130067550A1 PRIVATE CLOUD SERVER AND CLIENT ARCHITECTURE WITHOUT UTILIZING A ROUTING SERVER 有权
标题翻译：私有云服务器和客户端架构，不使用路由服务器
公开(公告)号：US20130067550A1
公开(公告)日：2013-03-14
申请号：US13229285
申请日：2011-09-09
申请人： Ben Wei CHEN , Chin-Tang YEN , Shi-Ming Zhao
发明人： Ben Wei CHEN , Chin-Tang YEN , Shi-Ming Zhao
IPC分类号： G06F21/20
CPC分类号： H04L63/0272 , H04L29/06326 , H04L29/08306 , H04L63/029 , H04L63/08 , H04L67/10
摘要： A method and system for use with a public cloud network is disclosed, wherein the public cloud network includes at least one private cloud server and at least one smart client device in communication therewith. The method and system comprise setting up the at least one private cloud server and the at least one smart client device in a client server relationship. The at least one private cloud server includes a message box associated therewith. The first message box is located in the public network. The at least one smart client includes a second message box associated therewith. The second message box is located on the public network. The method includes passing session based message information between the at least one private cloud server and the at least one smart client device via the first message box and the second message box in a secure manner. The session base information is authenticated by the private cloud server and the at least one smart client device. The smart client device and the private cloud server can then communicate with each other after the session based information is authenticated.
摘要翻译：公开了一种用于公共云网络的方法和系统，其中公共云网络包括至少一个私有云服务器和与其通信的至少一个智能客户端设备。该方法和系统包括以客户端服务器关系设置至少一个私有云服务器和至少一个智能客户端设备。所述至少一个私有云服务器包括与其相关联的消息框。第一个消息框位于公共网络中。至少一个智能客户端包括与其相关联的第二消息框。第二个消息框位于公共网络上。该方法包括经由第一消息框和第二消息框以安全的方式在至少一个私有云服务器与至少一个智能客户端设备之间传送基于会话的消息信息。会话基础信息由私有云服务器和至少一个智能客户端设备认证。智能客户端设备和私有云服务器可以在基于会话的信息被认证后相互通信。

2. 发明申请

US20130337701A1 USB DEVICE WITH SOLDERLESS CONNECTOR INTERFACE 有权
标题翻译：带无焊接接口的USB设备
公开(公告)号：US20130337701A1
公开(公告)日：2013-12-19
申请号：US13523575
申请日：2012-06-14
申请人： Ben Wei CHEN , Chin-Tang YEN , Ke-Chun CHOU
发明人： Ben Wei CHEN , Chin-Tang YEN , Ke-Chun CHOU
IPC分类号： H01R13/24
CPC分类号： H01R13/33 , H01R24/62 , H01R27/00
摘要： The present invention includes a USB3 device with solderless USB3 connector interfaces, which comprises: a USB3 device main body that houses a carrier body made of rigid material; four interface pins in the outer row that conform to the USB2.0 standard; five interface pins in the inner row that conform to the USB3.0 standard; and a substrate and electronic circuitry; and a USB3 device sub-body that houses: a carrier body made of rigid material; and five interface pins that conform to the USB3.0 standard wherein each interface pin has an upper convex part and a lower concave part; the upper convex part and the lower concave part forms a spring coil pin; and the spring coil pin can withstand multiple times of compression; a top casing; a bottom casing; and a case assembly.
摘要翻译：本发明包括具有无焊接USB3连接器接口的USB3设备，其包括：USB3设备主体，其容纳由刚性材料制成的承载体; 外排符合USB2.0标准的四个接口引脚; 内行五个接口引脚符合USB3.0标准; 以及基板和电子电路; 以及USB3装置子体，其容纳：由刚性材料制成的载体; 以及符合USB3.0标准的五个接口引脚，其中每个接口引脚具有上凸部和下凹部; 上凸部和下凹部形成弹簧圈销; 并且弹簧线圈销可承受多次压缩; 顶盖底壳; 和壳体组件。

3. 发明申请

US20090283313A1 SMALL FORM FACTOR MOLDED MEMORY CARD AND A METHOD THEREOF 有权
标题翻译：小形状因子模制记忆卡及其方法
公开(公告)号：US20090283313A1
公开(公告)日：2009-11-19
申请号：US12507771
申请日：2009-07-22
申请人： Ben Wei CHEN , Jin S. WANG , David Hong-Dien CHEN
发明人： Ben Wei CHEN , Jin S. WANG , David Hong-Dien CHEN
IPC分类号： H05K1/18 , H01L21/56
CPC分类号： B29C45/14647 , B29C45/14655 , B29C45/14836 , B29C45/2708 , H01L21/565 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/30107 , H05K1/117 , H05K3/284 , H05K2201/10159 , H05K2201/10689 , H05K2201/10734 , H05K2203/1311 , H05K2203/1316 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.
摘要翻译：存储卡的形状模制结构包括电路基板，至少一个芯片和密封剂覆盖物。电路基板的上表面和下表面分别具有电路层和多个电触点。芯片位于电路基板的上表面并与电路层电连接。密封剂覆盖物通过使用模具来挤压进入设置在电路基板的至少一个侧表面上的至少一个密封剂入口的密封剂而形成。密封剂覆盖物仅将电触头暴露在外，将所有上述组件封装起来。然后切割保留在密封剂覆盖物上的密封剂入口的痕迹，以获得具有平滑和完整外观的存储卡的形状模制结构。

4. 发明申请

US20110058327A1 FLASH MEMORY CARD EXPANDER 有权
标题翻译：闪存存储卡扩展器
公开(公告)号：US20110058327A1
公开(公告)日：2011-03-10
申请号：US12945722
申请日：2010-11-12
申请人： Ben Wei CHEN , David SUN , George K. L. SHIU
发明人： Ben Wei CHEN , David SUN , George K. L. SHIU
IPC分类号： G06F1/16
CPC分类号： H05K5/0282 , H01R31/06
摘要： Method and system for expanding the memory capacity of devices that use flash memory cards. In one aspect, a memory card expander assembly includes an adaptor shaped to be connected to a memory card slot of a host device, and a receptacle assembly in communication with the adaptor and operative to be attached to the host device. The receptacle assembly includes an expanded memory card slot operative to connect to a memory card such that the host device can communicate with the connected memory card when the adaptor is connected to the memory card slot.
摘要翻译：扩展使用闪存卡的设备的内存容量的方法和系统。在一个方面，一种存储卡扩展器组件包括被成形为连接到主机设备的存储卡插槽的适配器以及与适配器通信并且可操作地连接到主机设备的插座组件。插座组件包括扩展的存储卡插槽，其可操作以连接到存储卡，使得当适配器连接到存储卡插槽时，主机设备可与连接的存储卡通信。

5. 发明申请

US20100133673A1 FLASH MEMORY CARD 有权
标题翻译：闪存卡
公开(公告)号：US20100133673A1
公开(公告)日：2010-06-03
申请号：US12702207
申请日：2010-02-08
申请人： Ben Wei CHEN , David Hong-Dien CHEN , Jason Jajen CHEN
发明人： Ben Wei CHEN , David Hong-Dien CHEN , Jason Jajen CHEN
IPC分类号： H01L23/52
CPC分类号： H01L25/18 , H01L23/5387 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/32145 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2225/06575 , H01L2225/06579 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/10161 , H01L2924/15173 , H01L2924/15192 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.
摘要翻译：公开了一种闪存卡，其包括衬底，在衬底顶部的闪存存储器管芯，在闪存存储器管芯的顶部上的控制器管芯，以及与控制器管芯连接并在闪存管芯的顶部上的插入器，其中，插入器导致大大减少了与基板的引线接合。插入器可以围绕或与控制器管芯并排放置。根据本发明的系统和方法实现了以下目的：（1）尽可能地利用尽可能大的闪存存储器管芯，通过减少衬底上的引线接合焊盘的数量来增加闪存卡的密度并且能够插入可以装配在给定卡内部边界内的最大的模具; （2）更有效地堆叠闪存芯片，增加闪存卡的密度; 和（3）尽可能少的与基板的接合线数量，以提高产量。

6. 发明申请

US20100262768A1 CONFIGURABLE FLASH MEMORY CONTROLLER AND METHOD OF USE 有权
标题翻译：可配置闪存控制器及其使用方法
公开(公告)号：US20100262768A1
公开(公告)日：2010-10-14
申请号：US12824557
申请日：2010-06-28
申请人： Ben Wei CHEN
发明人： Ben Wei CHEN
IPC分类号： G06F12/02 , G06F12/00
CPC分类号： G06F13/1694
摘要： A FLASH memory controller is disclosed. The controller comprises a microcontroller. The microcontroller including firmware for providing different mappings for different types of FLASH memory chips. The controller also includes FLASH control logic for communicating with the microcontroller and adapted to communicate via a FLASH data bus to at least one FLASH memory chip. The FLASH control logic including mapping logic for configuring the FLASH data bus based upon the type of FLASH memory chip coupled thereto. A method and system in accordance with the present invention provides the following advantages: Configurable data bus on the FLASH memory controller through software to simplify routing complexity. Configurable chip select and control bus for flexibility of FLASH memory placement. Elimination of external resistor network for layout simplicity. A scalable architecture for higher data bus bandwidth support. Auto-detection of FLASH memory type and capacity configuration.
摘要翻译：公开了一种闪速存储器控制器。控制器包括微控制器。微控制器包括用于为不同类型的闪速存储器芯片提供不同映射的固件。控制器还包括用于与微控制器进行通信并适于经由FLASH数据总线与至少一个闪速存储器芯片通信的FLASH控制逻辑。 FLASH控制逻辑包括用于基于与其耦合的闪速存储器芯片的类型配置FLASH数据总线的映射逻辑。根据本发明的方法和系统提供以下优点：通过软件在FLASH存储器控制器上配置数据总线，以简化路由复杂度。可配置芯片选择和控制总线，实现闪存放置的灵活性。消除外部电阻网络进行布局简化。用于更高数据总线带宽支持的可扩展架构。自动检测闪存类型和容量配置。

7. 发明申请

US20080282264A1 SECURE AND SCALABLE SOLID STATE DISK SYSTEM 有权
公开(公告)号：US20080282264A1
公开(公告)日：2008-11-13
申请号：US11746576
申请日：2007-05-09
申请人： Ben Wei CHEN , Yungteh Chien , Choon Tak Tang
发明人： Ben Wei CHEN , Yungteh Chien , Choon Tak Tang
IPC分类号： G06F9/44
CPC分类号： G06F3/0659 , G06F3/0604 , G06F3/0679 , G06F21/80
摘要： A solid state disk system is disclosed. The system comprises a user token and at least one level secure virtual storage controller, coupled to the host system. The system includes a plurality of virtual storage devices coupled to at least one secure virtual storage controller. A system and method in accordance with the present invention could be utilized in flash based storage, disk storage systems, portable storage devices, corporate storage systems, PCs, servers, wireless storage, and multimedia storage systems.

8. 发明申请

US20120198548A1 BLANK SMART CARD DEVICE ISSUANCE SYSTEM 有权
标题翻译：空白智能卡设备问题系统
公开(公告)号：US20120198548A1
公开(公告)日：2012-08-02
申请号：US13019180
申请日：2011-02-01
申请人： Ben Wei CHEN
发明人： Ben Wei CHEN
IPC分类号： H04L9/32 , G06K19/073
CPC分类号： G06K19/07716 , G06F21/33 , G06F21/445 , G06K2017/0041 , G06Q20/355 , H04L9/0869 , H04L9/0891 , H04L9/3226 , H04L9/3247 , H04L9/3268
摘要： A smart card issuance system and method are disclosed. In a first aspect a method and system for issuing a smart card device (SC) is disclosed. The method and system comprise providing an initialization phase of the SC by a manufacturer and providing an authentication phase of the SC by the manufacturer. The method and system also include deploying the SC, providing a first time authentication phase for a specific customer by the issuer (IS) after the SC is deployed and starting a first phase of the registration process of the SC for the specific customer by the issuer. The method and system further include providing another authentication phase of the SC by IS after the first time authentication; and providing of an authentication of the IS by the SC. When both the SC and IS are mutually authenticated, the IS and the specific customer are allowed to complete the registration process. In a second aspect, a data transmission process and system for a smart card device (SC) of an issuer (IS) is disclosed. The process and system comprises performing a login of the SC by a user and performing a mutual authentication of the SC and the IS. The process and system further includes establishing a session key after mutual authentication is established. The session key is used to encrypt and decrypt data for transmission between the IS and the SC.
摘要翻译：公开了一种智能卡发行系统和方法。在第一方面，公开了一种用于发布智能卡设备（SC）的方法和系统。该方法和系统包括由制造商提供SC的初始化阶段，并由制造商提供SC的认证阶段。该方法和系统还包括部署SC，在SC部署之后由发行商（IS）为特定客户提供第一时间认证阶段，并且由开发者开始针对特定客户的SC的注册过程的第一阶段。所述方法和系统还包括：在第一次认证之后通过IS提供SC的另一认证阶段; 并由SC提供IS的认证。当SC和IS都相互认证时，IS和特定客户可以完成注册过程。在第二方面，公开了一种用于发行者（IS）的智能卡设备（SC）的数据传输过程和系统。该过程和系统包括由用户执行SC的登录并执行SC和IS的相互认证。该过程和系统还包括在相互认证建立之后建立会话密钥。会话密钥用于对IS和SC之间传输的数据进行加密和解密。

9. 发明申请

US20120102106A1 DUAL-MODE WIRELESS NETWORKED DEVICE INTERFACE AND AUTOMATIC CONFIGURATION THEREOF 有权
标题翻译：双模无线网络设备接口及其自动配置
公开(公告)号：US20120102106A1
公开(公告)日：2012-04-26
申请号：US12912614
申请日：2010-10-26
申请人： Ben Wei CHEN
发明人： Ben Wei CHEN
IPC分类号： G06F15/177 , G06F15/16 , G06F13/40
CPC分类号： H04W76/023 , H04L29/12226 , H04L61/2015 , H04W76/14 , H04W84/18
摘要： A wireless networked device interface is disclosed. The wireless networked device interface comprises a central processing unit (CPU), a bus coupled to the CPU, a memory/buffer coupled to the bus, a peripheral bus interface coupled to the bus, an upstream network module coupled to the bus, a downstream network module coupled to the bus and a peripheral device. The device interface includes a nonvolatile memory (NVM) coupled to the bus. The NVM includes a configuration function which through a portable device can associate with one or more portable devices on the downstream wireless network and associate with one or more access points on the upstream wireless network. The wireless networked device as well as the access point can be discovered, selected and auto-configured through the graphic user interface of one of the portable devices on the downstream wireless network.
摘要翻译：公开了一种无线网络设备接口。无线网络设备接口包括中央处理单元（CPU），耦合到CPU的总线，耦合到总线的存储器/缓冲器，耦合到总线的外围总线接口，耦合到总线的上游网络模块，下游网络模块耦合到总线和外围设备。设备接口包括耦合到总线的非易失性存储器（NVM）。 NVM包括通过便携式设备可以与下游无线网络上的一个或多个便携式设备相关联并与上游无线网络上的一个或多个接入点相关联的配置功能。可以通过下游无线网络上的一个便携式设备的图形用户界面来发现，选择和自动配置无线网络设备以及接入点。

10. 发明申请

US20080277782A1 FLASH MEMORY CARD 有权
标题翻译：闪存卡
公开(公告)号：US20080277782A1
公开(公告)日：2008-11-13
申请号：US12181721
申请日：2008-07-29
申请人： Ben Wei CHEN , David Hong-Dien Chen , Jason Jajen Chen
发明人： Ben Wei CHEN , David Hong-Dien Chen , Jason Jajen Chen
IPC分类号： H01L23/48
CPC分类号： H01L25/18 , H01L23/5387 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/32145 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2225/06575 , H01L2225/06579 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/10161 , H01L2924/15173 , H01L2924/15192 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.
摘要翻译：公开了一种闪存卡，其包括衬底，在衬底顶部的闪存存储器管芯，在闪存存储器管芯的顶部上的控制器管芯，以及与控制器管芯连接并在闪存管芯的顶部上的插入器，其中，插入器导致大大减少了与基板的引线接合。插入器可以围绕或与控制器管芯并排放置。根据本发明的系统和方法实现了以下目的：（1）尽可能地利用尽可能大的闪存存储器管芯，通过减少衬底上的引线接合焊盘的数量来增加闪存卡的密度并且能够插入可以装配在给定卡内部边界内的最大的模具; （2）更有效地堆叠闪存芯片，增加闪存卡的密度; 和（3）尽可能少的与基板的接合线数量，以提高产量。

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