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1. 发明授权

US07793414B2 Methods for forming connection structures for microelectronic devices 有权
标题翻译：用于形成微电子器件的连接结构的方法
公开(公告)号：US07793414B2
公开(公告)日：2010-09-14
申请号：US11642570
申请日：2006-12-20
申请人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
发明人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
IPC分类号： H01R9/00 , H01R12/04
CPC分类号： H01L23/49838 , H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/041 , H05K3/06 , H05K3/202 , H05K3/4038 , H05K2201/09609 , H05K2201/097 , H05K2201/09827 , H05K2201/09881 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
摘要翻译：提供了用于微电子器件的连接结构和用于形成结构的方法。包括具有相对表面的基板和延伸穿过该表面的多个孔。还包括多个导电柱。每个柱从基部延伸到位于基板的相应孔内的尖端。可以提供另外的基底，使得每个柱的基部位于其表面上。可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。可选地，介电材料可以放置在基板和柱之间。

2. 发明授权

US07262368B2 Connection structures for microelectronic devices and methods for forming such structures 有权
标题翻译：微电子器件的连接结构和形成这种结构的方法
公开(公告)号：US07262368B2
公开(公告)日：2007-08-28
申请号：US10917978
申请日：2004-08-13
申请人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
发明人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H01L23/49838 , H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/041 , H05K3/06 , H05K3/202 , H05K3/4038 , H05K2201/09609 , H05K2201/097 , H05K2201/09827 , H05K2201/09881 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
摘要翻译：提供了用于微电子器件的连接结构和用于形成结构的方法。包括具有相对表面的基板和延伸穿过该表面的多个孔。还包括多个导电柱。每个柱从基部延伸到位于基板的相应孔内的尖端。可以提供另外的基底，使得每个柱的基部位于其表面上。可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。可选地，介电材料可以放置在基板和柱之间。

3. 发明申请

US20080296717A1 Packages and assemblies including lidded chips 审中-公开
标题翻译：包装和组件，包括带芯片
公开(公告)号：US20080296717A1
公开(公告)日：2008-12-04
申请号：US11809780
申请日：2007-06-01
申请人： Masud Beroz , Belgacem Haba , Michael J. Nystrom , Richard Dewitt Crisp , Giles Humpston
发明人： Masud Beroz , Belgacem Haba , Michael J. Nystrom , Richard Dewitt Crisp , Giles Humpston
IPC分类号： H01L31/0203 , H01L21/58 , H01L23/02
CPC分类号： H01L31/0203 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/81 , H01L25/03 , H01L25/0657 , H01L25/50 , H01L27/14618 , H01L27/14632 , H01L2224/05554 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/10126 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48464 , H01L2224/4911 , H01L2224/49171 , H01L2224/49175 , H01L2224/81192 , H01L2225/06506 , H01L2225/06517 , H01L2225/06568 , H01L2225/06589 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15787 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2224/29099 , H01L2224/45099 , H01L2224/81805 , H01L2224/05599
摘要： A lidded chip is provided which includes a chip having a major surface and a plurality of first chip contacts exposed at the major surface. A lid overlies the major surface. A chip carrier is disposed between the chip and the lid, the chip carrier having an inner surface confronting the major surface and an outer surface confronting the lid. A plurality of first carrier contacts of the chip carrier are conductively connected to the first chip contacts. A plurality of second carrier contacts extend upwardly at least partially through the openings in the lid.
摘要翻译：提供了一种带芯的芯片，其包括具有主表面的芯片和在主表面处暴露的多个第一芯片触点。盖子盖在主表面上。芯片载体设置在芯片和盖之间，芯片载体具有面向主表面的内表面和面对盖的外表面。芯片载体的多个第一载体触点导电地连接到第一芯片触点。多个第二载体触点至少部分地向上延伸穿过盖中的开口。

4. 发明申请

US20080185705A1 Microelectronic packages and methods therefor 审中-公开
标题翻译：微电子封装及其方法
公开(公告)号：US20080185705A1
公开(公告)日：2008-08-07
申请号：US11895191
申请日：2007-08-23
申请人： Philip R. Osborn , Belgacem Haba , Ellis Chau , Giles Humpston , Masud Beroz , Teck-Gyu Kang , Dat Nghe Duong , Jae M. Park , Jesse Burl Thompson , Richard Dewitt Crisp
发明人： Philip R. Osborn , Belgacem Haba , Ellis Chau , Giles Humpston , Masud Beroz , Teck-Gyu Kang , Dat Nghe Duong , Jae M. Park , Jesse Burl Thompson , Richard Dewitt Crisp
IPC分类号： H01L23/48
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49816 , H01L24/16 , H01L24/31 , H01L24/48 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1357 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83194 , H01L2224/83365 , H01L2224/83385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.
摘要翻译：微电子封装包括具有包括触点的第一面的微电子元件和具有第一表面和第二表面的柔性基板，从第一表面突出的导电柱和在第二表面可接触的导电端子，至少一些导电端子并且所述导电柱电互连，并且所述导电端子中的至少一些偏离所述导电柱。柔性基板的第一表面与微电子元件的第一面并置，使得导电柱从柔性基板朝向微电子元件的第一面突出。导电柱与微电子元件的触点电互连，并且至少一些导电端子可相对于微电子元件移动。

5. 发明授权

US07768117B2 Microelectronic package having interconnected redistribution paths 有权
标题翻译：具有互连再分配路径的微电子封装
公开(公告)号：US07768117B2
公开(公告)日：2010-08-03
申请号：US11809214
申请日：2007-05-30
申请人： Belgacem Haba , Richard Dewitt Crisp , Masud Beroz
发明人： Belgacem Haba , Richard Dewitt Crisp , Masud Beroz
IPC分类号： H01L23/48 , H01L23/02
CPC分类号： H01L25/0657 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/6627 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/49113 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/1903 , H01L2924/3011 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic unit has a structure including a microelectronic element such as a semiconductor chip with a first contact disposed remote from the periphery of the structure. The unit further includes first and second redistribution conductive pads disposed near a periphery of the structure and a conductive path incorporating first and second conductors extending toward the first contact, these conductors being connected to one another adjacent the first contact. The conductive path is connected to the first contact, and can provide signal routing from the periphery of the unit to the contact without the need for long stubs. A package may include a plurality of such units, which may be stacked on one another with the redistribution conductive pads of the various units connected to one another.
摘要翻译：微电子单元具有包括诸如半导体芯片的微电子元件的结构，其具有远离结构的周边设置的第一触点。该单元还包括设置在结构的周边附近的第一和第二再分布导电焊盘以及包括朝向第一触点延伸的第一和第二导体的导电路径，这些导体彼此相邻地邻近第一接触。导电路径连接到第一触点，并且可以提供从单元的外围到触点的信号路由，而不需要长存根。封装可以包括多个这样的单元，其可以彼此堆叠，并且各个单元的再分配导电焊盘彼此连接。

6. 发明申请

US20080296748A1 Transmission line stacking 有权
标题翻译：传输线堆叠
公开(公告)号：US20080296748A1
公开(公告)日：2008-12-04
申请号：US11809214
申请日：2007-05-30
申请人： Belgacem Haba , Richard Dewitt Crisp , Masud Beroz
发明人： Belgacem Haba , Richard Dewitt Crisp , Masud Beroz
IPC分类号： H01L23/48 , H01L23/02
CPC分类号： H01L25/0657 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/6627 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/49113 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/1903 , H01L2924/3011 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic unit has a structure including a microelectronic element such as a semiconductor chip with a first contact disposed remote from the periphery of the structure. The unit further includes first and second redistribution conductive pads disposed near a periphery of the structure and a conductive path incorporating first and second conductors extending toward the first contact, these conductors being connected to one another adjacent the first contact. The conductive path is connected to the first contact, and can provide signal routing from the periphery of the unit to the contact without the need for long stubs. A package may include a plurality of such units, which may be stacked on one another with the redistribution conductive pads of the various units connected to one another.
摘要翻译：微电子单元具有包括诸如半导体芯片的微电子元件的结构，其具有远离结构的周边设置的第一触点。该单元还包括设置在结构的周边附近的第一和第二再分布导电焊盘以及包括朝向第一触点延伸的第一和第二导体的导电路径，这些导体彼此相邻地邻近第一接触。导电路径连接到第一触点，并且可以提供从单元的外围到触点的信号路由，而不需要长存根。封装可以包括多个这样的单元，其可以彼此堆叠，并且各个单元的再分配导电焊盘彼此连接。

7. 发明授权

US07317249B2 Microelectronic package having stacked semiconductor devices and a process for its fabrication 有权
标题翻译：具有堆叠半导体器件的微电子封装及其制造工艺
公开(公告)号：US07317249B2
公开(公告)日：2008-01-08
申请号：US11021627
申请日：2004-12-23
申请人： Richard Dewitt Crisp , Belgacem Haba , Giles Humpston
发明人： Richard Dewitt Crisp , Belgacem Haba , Giles Humpston
IPC分类号： H01L23/34
CPC分类号： H01L24/73 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/73207 , H01L2224/73257 , H01L2225/06572 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. The packaged microelectronic device is formed by using a transfer substrate to transfer solder masses onto at least some of the conductive posts extending from the first major surface of the first microelectronic element or contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts disposed on the surface of the second microelectronic element.
摘要翻译：具有第一和第二电互连微电子元件的封装微电子器件及其制造方法。导电柱从第一微电子元件的一个主表面延伸。第一微电子元件经由导电柱与第二微电子元件电互连。第一微电子元件优选地具有导电柱延伸的插入元件。第二微电子元件经由导电柱经由第二微电子元件上的触点而互连到插入元件。如此互连的微电子元件具有协调的功能，例如可编程逻辑器件，其中一个微电子元件是现场可编程门阵列，而另一微电子元件是存储器件。封装的微电子器件通过使用转移衬底来形成，以将焊料块转移到从第一微电子元件的第一主表面或第二微电子元件上的触点延伸的至少一些导电柱上。焊料块然后用于将导电柱与布置在第二微电子元件的表面上的触点电互连。

8. 发明申请

US20060032670A1 Connection structures for microelectronic devices and methods for forming such structures 有权
标题翻译：微电子器件的连接结构和形成这种结构的方法
公开(公告)号：US20060032670A1
公开(公告)日：2006-02-16
申请号：US10917978
申请日：2004-08-13
申请人： Belgacem Haba , Masud Beroz , David Tuckerman , Giles Humpston , Richard Crisp
发明人： Belgacem Haba , Masud Beroz , David Tuckerman , Giles Humpston , Richard Crisp
IPC分类号： H05K1/14
CPC分类号： H01L23/49838 , H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/041 , H05K3/06 , H05K3/202 , H05K3/4038 , H05K2201/09609 , H05K2201/097 , H05K2201/09827 , H05K2201/09881 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
摘要翻译：提供了用于微电子器件的连接结构和用于形成结构的方法。包括具有相对表面的基板和延伸穿过该表面的多个孔。还包括多个导电柱。每个柱从基部延伸到位于基板的相应孔内的尖端。可以提供另外的基底，使得每个柱的基部位于其表面上。可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。可选地，介电材料可以放置在基板和柱之间。

9. 发明授权

US08207604B2 Microelectronic package comprising offset conductive posts on compliant layer 有权
标题翻译：微电子封装包括柔性层上的偏移导电柱
公开(公告)号：US08207604B2
公开(公告)日：2012-06-26
申请号：US10985126
申请日：2004-11-10
申请人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae M. Park
发明人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae M. Park
IPC分类号： H01L23/485
CPC分类号： H01L23/13 , H01L21/4846 , H01L2924/0002 , H01R13/2414 , H01R13/2464 , H01L2924/00
摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
摘要翻译：微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

10. 发明申请

US20050181655A1 Micro pin grid array with wiping action 有权
标题翻译：微针格栅阵列与擦拭动作
公开(公告)号：US20050181655A1
公开(公告)日：2005-08-18
申请号：US10985126
申请日：2004-11-10
申请人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae Park
发明人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae Park
IPC分类号： H01L21/48 , H01L23/13 , H01R13/24 , H01R13/62
CPC分类号： H01L23/13 , H01L21/4846 , H01L2924/0002 , H01R13/2414 , H01R13/2464 , H01L2924/00
摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
摘要翻译：微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

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